External Visual Inspection per Mil-Std-883 TM 2009 Instructor: Thomas Green Description: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of […]
Smart Home with Matter - Everything about the cross-manufacturer connection standard Webinar by Würth Elektronik Tuesday, November 26th 2024 @ 4:00PM CET Explore everything about Matter, the cross-manufacturer connection standard […]
Webinar: WE SYSTEMS – Bonding and more Wed, Dec 4, 2024 11:00 AM - 12:00 PM CET Die bonding on printed circuit boards? And wire bonding? Or the complete manufacturing […]
Space and Military Standards for Hybrids and RF Microwave Modules Instructor: Thomas Green Description: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing […]
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical […]
Decreasing the BOM and Improving Common Mode Noise Reduction of Power Modules Webinar by Würth Elektronik Tuesday, December 10th 2024 @ 4:00PM CET Less is more! In this webinar, we’ll […]
Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. […]
Hermeticity Testing, Internal Gas Analysis (IGA) and Getters Instructors: Thomas Green, TJ Green Associates, LLC Robert Lowry, Electronics Materials Consultant Andy Hayden, Edryne Ltd. Description: This tutorial includes a basic review […]
Design and Test of Non-Hermetic Microelectronics Instructors: Thomas Green and Robert Lowry Description: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals, ceramics, and glasses) require a different […]
