Near-Field EMI Noise Suppression with 3M Solutions As electronic devices become increasingly complex, navigating the challenge of electromagnetic interference (EMI) requires precise control and innovative materials. Join Dr. Sergei Manuilov […]
Würth Elektronik Webinar: Galvanically isolated voltage measurement made easy with digital isolators October 29, 2024 at 16:00 Interference-free data communication and personal safety are two major challenges for electronics in […]
Webinar: Cost-efficient flexibility: Physical PCB sample WE.bend! Wed, Nov 6, 2024 11:00 AM - 12:00 PM CET WE.flex again: Following the presentation of the two RIGID.flex samples, we are now […]
electronica 2024 November 12-15 World’s leading trade fair and conference for electronics Electronica in Munich is the world's leading trade fair for electronics, it covers the entire spectrum of modern […]
Pre Cap Visual Inspection per Mil-Std-883 (TM 2017) Instructor: Thomas Green Description: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is […]
External Visual Inspection per Mil-Std-883 TM 2009 Instructor: Thomas Green Description: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of […]
Smart Home with Matter - Everything about the cross-manufacturer connection standard Webinar by Würth Elektronik Tuesday, November 26th 2024 @ 4:00PM CET Explore everything about Matter, the cross-manufacturer connection standard […]
Webinar: WE SYSTEMS – Bonding and more Wed, Dec 4, 2024 11:00 AM - 12:00 PM CET Die bonding on printed circuit boards? And wire bonding? Or the complete manufacturing […]
Space and Military Standards for Hybrids and RF Microwave Modules Instructor: Thomas Green Description: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing […]
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical […]
Decreasing the BOM and Improving Common Mode Noise Reduction of Power Modules Webinar by Würth Elektronik Tuesday, December 10th 2024 @ 4:00PM CET Less is more! In this webinar, we’ll […]
Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. […]
