New inverse format thick film chips offer two to three times the standard power rating in a smaller PCB footprint ...
Scientists from Skoltech and their colleagues have used a 3D printer to fuse two materials in an alloy whose composition ...
Designers, manufacturers, importers, and installers of electronic systems must demonstrate that their products do not generate or suffer from electromagnetic ...
System Efficient ESD Design (SEED) address the protection of I/O against ESD using simulation. This allows to predict the robustness ...
YAGEO group released the brand new automotive-grade chip resistors - AH series for anti-sulfurated and high voltage withstanding capabilities. The ...
Yageo, Taiwan's leading passive components maker continues to enjoy strong demand for automotive and industrial applications, but its capacity utilization ...
PREMO, the leading manufacturer of inductive components, releases the new 11kW 3DPowerTM solution, a Full Bridge LLC Transformer 150 µH ...
Exxelia, a leading manufacturer of ruggedized passive components and sub-systems dedicated to demanding markets, today introduced Miniature Micro-Layer™ (MML™) capacitors, ...
Problems that arise when implementing an RF filter in modern signal interfaces are discussed. Effectiveness of filters under realistic impedance ...
The control of EMI in electronic devices is an increasing issue faced by designers in order to ensure that devices ...
© EPCI - Premium Passive Components Educational and Information Site
© EPCI - Premium Passive Components Educational and Information Site