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    Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

    Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

    Samtec Expands Offering of Slim, High-Density HD Array Connectors

    Bourns Unveils High-Precision Wirewound Resistor with Long-Term Stability

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    Littelfuse Acquires Basler Electric Enhancing High-Growth Industrial Market

    DigiKey Grows Inventory with Over 31K New Stocking Parts in Q3 2025

    Murata Expands Automotive Metal Frame Y2/X1 Safety MLCC Capacitors to 500V

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    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters

    Connector PCB Design Challenges

    Efficient Power Converters: Duty Cycle vs Conduction Losses

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3rd PCNS Final Program Released !

6.8.2021
Reading Time: 3 mins read
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3rd PCNS Passive Components Networking Symposium that will take place on 7-10th September, hosted by Politecnico di Milano, Italy is pleased to announce release of its final program. The third PCNS is organized as a hybrid event and it is possible to register either as a live or virtual attendee. Fee is equal allowing flexibility to change attendance type on last moment according to the pandemic situation and travel restrictions.

3rd PCNS received 27 paper abstracts from 9 countries EU and USA (vs 19 papers at 2nd PCNS) ! The papers’ scope submitted by passive manufacturers, universities, material suppliers, space agencies and end users include capacitors, resistors, inductors and passive sensors in areas of aerospace, automotive or industrial. Topics are covering reliability, qualification, new materials & technologies and research.

RelatedPosts

Bourns Releases High Current Metal Alloy-based, Multilayer Power Chip Inductors

Smiths Interconnect Extends Space-Qualified, High-Reliability Fixed Chip Attenuators 

Samtec Expands Offering of Slim, High-Density HD Array Connectors

The technical program looks impressive !

Check it out

Check it out on PCNS website online here (you can also see there program with on click paper abstracts) – OR – download the final program in pdf below:

The program is reach on technical papers, keynotes and invited papers from leading passive manufacturers and industry experts.

Live attendees, in addition can enjoy Italian cuisine supporting casual networking atmosphere during a Welcome Drink and Gala Dinner social events. An exclusive Alfa Romeo Museum tour prior the Gala Dinner may serve a good surroundings incentive to discuss hot topics around future passive components needs for automotive industry.

We hope in best – to meet finally face to face in September

Register and join us at the 3rd PCNS !

Online Registration Form

————————————-

PCNS Passive Components Networking Symposium is a bi-annual international symposium organized by EPCI European Passive Components Institute in co-operation with an European university. 3rd edition of the PCNS Passive Components Networking Days Symposium is hosted by Department of Chemistry, Materials and Chemical Engineering “Giulio Natta” and Department of Electronics, Information and Bioengineering Faculty of Politecnico di Milano.

3rd PCNS is intended as a hybrid, live event with speakers present and streaming options for virtual attendees.

More information is available on the PCNS website:

www.PCNS.events

Related

Source: EPCI

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