Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications

    Bourns Offers Custom Magnetics for 3‑Phase Flying Capacitor Inverters

    YAGEO Releases Cost Efficient Pt‑RTD Sensors with Ni wires

    Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    Stackpole Introduces 1400A Busbar Shunt Resistors

    Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

    Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection

    Passive Components in 2026: From Invisible Commodity to Design Parameter

    Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications

    Bourns Offers Custom Magnetics for 3‑Phase Flying Capacitor Inverters

    YAGEO Releases Cost Efficient Pt‑RTD Sensors with Ni wires

    Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    Stackpole Introduces 1400A Busbar Shunt Resistors

    Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

    Bourns Expands 1000V High‑Power Fuses for Semiconductor and Battery Protection

    Passive Components in 2026: From Invisible Commodity to Design Parameter

    Bourns Introduces High Current Chip Ferrite Beads for Dense Power Rails

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Two‑capacitor paradox explained for engineers

    Capacitances of Nonlinear MLCCs: What Datasheets Don’t Tell You

    Tapped Inductor Buck Converter Fundamentals

    Planar vs Conventional Transformer: When it Make Sense

    Modeling Fringing Field Losses in Inductors & Transformers

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Effect of Burn-in Process on X7R MLCC Reliability

26.8.2022
Reading Time: 4 mins read
A A

The scientific paper on evaluation of effect of burn-in process on reliability of X7R multilayer ceramic capacitors has been published by Penn State researchers.

Base metal electrode (BME) multilayer ceramic capacitors (MLCCs) continue to advance with higher volumetric capacitance, higher voltage, and higher temperature operational ranges with greater numbers of capacitors being manufactured and integrated into the electronic infrastructure of society. Many of these applications range from aerospace, transport, computation, medical, satellite, military, and the internet of things means the interdependence of these devices require higher reliability at a collective and individual component level.

RelatedPosts

Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications

Bourns Offers Custom Magnetics for 3‑Phase Flying Capacitor Inverters

YAGEO Releases Cost Efficient Pt‑RTD Sensors with Ni wires

Thus, determining the lifetime reliability of MLCCs is critical to provide more reliable components, and no weak links to the electrified infrastructure. For some of the more costly systems that support military and satellite systems, the reliability testing is very extensive.

Schematic of the electromigration of oxygen vacancies during MLCC capacitors burn-in process.

The burn-in test is a screening procedure used to remove components with higher probability of infant mortality failures. In this process, components are exposed to high temperatures and voltages relative to their design. The thermal stimulated depolarization current results revealed that burn-in test caused the intragranular and transgranular migration of oxygen vacancies, which will not be relaxed after the burn-in test.

Time to failure data obtained through in situ highly accelerated lifetime tests demonstrated that not only burn-in tests were ineffective at detecting infant mortality failures, but they also had a negative impact on reliability of BME MLCCs by creating a weak population. The electromigration of oxygen vacancies during burn-in tests shorten the lifetime of MLCC population by reducing the protection effects of double Schottky barriers at the grain boundaries and electrode interfaces.

Experimental

Commercial BME X7R MLCCs (1206 case size, 1 uF, and voltage rating (Vr) of 50 V) were used for this study to investigate the dynamics of oxygen vacancies and the associated space charge distribution during burn-in test.

Burn-in tests were carried out at 125 °C with DC fields of 2xVr for 168h and 4xVr for 21h, referred to as long and short burn-in tests in this study. For burn-in tests, these two extreme voltage conditions were chosen based on the MIL- PRF-32535A standard. After burn-in tests, the MLCCs were cooled to room temperature without maintaining the electric field.

Thermal stimulated depolarization current (TSDC) is a powerful technique for studying the relaxation kinetics of polarizable defects, and it was used to investigate the effect of the short and long burn-in tests on ionic space charge development, both intergranular (ionic charge pile up within individual grains) and transgranular (ionic transportation beyond each grain). After short and long burn-intests, TSDC was performed on screened samples; samples were then heated at a constant heating rate; and the leakage current from depolarization of the relaxing defects was measured.

Results and discussion

A burn-in test can lead to electromigration of oxygen vacancies that accumulate into metastable ionic space charge regions, and these in turn reduces the reliability of MLCCs by compromising the double Schottky barriers at the grain boundaries and electrode interfaces. TSDC measurements confirmed inter-granular and transgranular ionic space charge accumulation after burn-in tests.

Schematic of hazard rate curve of MLCCs before (solid) and after (dash) short burn-in test

These oxygen vacancies electromigration can weaken the protection effect of double Schottky barriers at the grain boundaries and electrode interfaces which eventually reduces MLCCs lifetime. The reduction in MLCCs lifetime was confirmed by comparing the mean time to failure (MTTF) and standard deviation (SD) values of samples before and after burn-in tests. Although the MTTF did not change significantly (dropped up to 18%) after burn-in tests, the SD values increased up to 130percent indicating that the TTF data are spread out, raising concerns about the consistency, predictability, and quality of BME MLCCs for applications requiring higher levels of reliability.

Conclusions

The burn-in test is a screening procedure used to eliminate weak components with a high likelihood of infant mortality and to produce uniform components for applications demanding higher levels of reliability.

We demonstrated that the costly burn-intest may be ineffective in identifying infant mortality failures, and it reduces the reliability and lifetime of BME MLCCs through intragranular and transgranular electromigration of oxygen vacancies which may not relax after the burn-in test.

These oxygen vacancies electromigration creates a weak population of BME MLCCs that may fail much sooner than expected, resulting in a subsystem or system failure.

Read more at: Yousefian, P., Randall, C.A. Determining the effect of burn-in process on reliability of X7R multilayer ceramic capacitors. J Mater Sci (2022). https://doi.org/10.1007/s10853-022-07623-9

Related

Source: Journal of Material Science

Recent Posts

Murata and Xona Partner on LEO Satellite Navigation for Industrial Applications

3.6.2026
16

Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

2.6.2026
58

Tecate Unveils High‑temp 105C Supercapacitors for Harsh‑Environment Designs

2.6.2026
14

Passive Components in 2026: From Invisible Commodity to Design Parameter

2.6.2026
21

May 2026 Interconnect, Passives and Electromechanical Components Market Insights

29.5.2026
95

Passive Components Enable Safe and Reliable ADAS Architectures

28.5.2026
68

Current Sense Transformer Datasheet and Design‑in Guide

27.5.2026
66

Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

27.5.2026
31

YMIN Releases Square Supercapacitors for AI Server Power System

27.5.2026
51

Upcoming Events

Jun 16
16:00 - 17:00 CEST

EMC with EMC – EMC‑compliant design with electromechanical connectors

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version