MIL-Std-883 TM 2010

MIL-STD-883 TM 2010

Instructor: Thomas Green

Description: This course is an addendum to the Pre Cap Visual MIL-STD-883 TM 2017 inspection class (4 sessions) and its best to take that class first before registering for this one. TM 2010 contains the full inspection criteria for Class S and B monolithic microcircuits. TM 2010 Microcircuit visual inspection is a flow down requirement from Mil-Prf-38535. The primary focus of this session will be on the “low mag” visual requirements for component attach and wire bond, which differ from the TM 2017 hybrid visual inspection criteria. TM 2010 also contains additional die attach and wire bond requirements not addressed in TM 2017. We will also briefly review the high mag inspection requirements for ICs and MMICs with a special emphasis on Class S products.

Topics include:

• Mil-Prf-38535 Integrated Circuit (Microcircuits) General Spec flow down
• requirements for visual inspection
• Low Mag Criteria (30-60X)
• Die Attach(eutectic and non-eutectic criteria)
• Wirebond General (gold ball, wedge, and tailless)
• Rebonding of monolithic devices.
• Flip chip solder bump die (para 3.2.1.6)
• Foreign material (para. 3.2.5)
• Foreign Material Die Coated devices (para 3.2.5.1)
• High Mag Criteria (special emphasis on Class S)
• Para 3.1.1-3.4 High Mag IC and MMIC Inspection
• Para. 3.1.6. Film resistors
• Para 3.1.7 Laser trimmed thin film resistors
• Flip Chip Defects Scribe and Edge Cracks
• Class Review with Q&A