Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Wk 12 Electronics Supply Chain Digest

23.3.2026
Reading Time: 4 mins read
A A


Electronics Supply Chain Weekly Digest 3-20-26.

DATAPOINT OF THE WEEK: This week, both onsemi and Alpha and Omega semiconductor announced price icreases effective April 1 on select products, each citing rising raw material, energy, and infrastructure costs as the driver. onsemi and AOS join other suppliers such as Infineon, NXP, ADI, and TI to raise price in recent months.

RelatedPosts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

Wk 32 Electronics Supply Chain Digest

A growing concern for input costs is the sharp declines in Helium production as a result of the war in Iran. QatarEnergy has yet to restart helium production at its Ras Laffan complex following drone strikes on March 2 that knocked out roughly 30% of global supply, a meaningful concern for chipmakers dependent on helium for EUV lithography cooling, according to TrendForce.

Headlines:

Auto/Transportation

  • Global EV traction inverter installations hit 9.65M units in 4Q25, highest in nearly two years, as 800V adoption surges, according to TrendForce
  • GM CFO says gas price hikes not impacting sales, with 1Q more affected by weather and low truck inventory
  • US EV market sees new sales drop 26.8% Y/Y in February as used EV demand rises 28.8% Y/Y, according to Cox
  • US new-vehicle affordability improves in February, with median weeks of income needed falling to 35.4, according to Cox
  • Volkswagen signals shift toward Chinese chips amid growing tension with Nvidia’s automotive platforms, according to DigiTimes
  • Xpeng 1Q revenue guidance of $1.77B-$1.93B , below expectations as EV demand slump drives 40% Y/Y delivery drop in Jan-Feb
  • XPeng targets double overseas sales in 2025, launching models in Mexico and eyes 70% of profit from international markets by 2030

Datacenter

  • Nebius announces it has signed $27B AI infrastructure deal with Meta, including $12B committed capacity by 2027

IP&E

  • MuRata plans to decouple China rare earth supply chain over next 3 years amid rising geopolitical risk, according to Financial Times
  • Nvidia charts optical-copper dual-track path for AI data centers, with CPO expected to hit 35% penetration by 2030, according to DigiTimes

Semiconductors

  • Analog Devices opens new Thailand facility adding wafer-level processing, chip-scale packaging and final testing capacity
  • Horizon Robotics’ next-gen Journey 7 chip to outpace Nvidia’s Thor-X, targeting mass production in 2027, according to LatePost
  • Huali Microelectronics readies 7nm chip production in Shanghai with Huawei collaboration, as reported by Reuters
  • Infineon VP calls on Europe to scale up 300mm wafer fabs and automate to counter Chinese competition, according to Reuters
  • Micron reports massive F2Q beat, guides sharply higher on surging DRAM and NAND prices and raises capex to $25B+
  • Nvidia restarts H20 chip manufacturing for China after receiving US export licenses, excludes sales from $1T forecast
  • Nvidia preparing China-compatible Groq inference chips ahead of May availability, Reuters reported
  • Nvidia to sell 1M GPUs plus networking and inference chips to AWS by end of 2027
  • Nvidia partners with Infineon, NXP, and STMicroelectronics to supply hardware for humanoid robots, says TrendForce
  • onsemi to raise prices on select products from April 1 citing elevated input and manufacturing costs
  • Samsung Electronics to begin volume production of Tesla chips at Texas factory in 2H27
  • Samsung faces 18-day strike threat from May 21 as workers demand 7% wage hike and profit-based bonuses, per Reuters
  • Samsung to supply up to 800M GB of next-gen HBM4 chips to OpenAI for its first in-house AI processor, according to Korean Economic Daily
  • Samsung and AMD sign MoU to expand HBM4 and DDR5 memory supply for next-gen AI accelerators and EPYC processors
  • Vanguard International Semiconductor to raise foundry prices ~10% in April 2026, citing rising input costs
  • Tiancheng Semiconductor develops 14-inch SiC single crystal, marking China’s first step toward 14-inch commercialization

Consumer/Other

  • Amazon reportedly developing new AI-native smartphone codenamed “Transformer,” a decade after $170M Fire Phone flop, says Reuters

Related

Source: Edgewater Research

Recent Posts

Wk 33 Electronics Supply Chain Digest

31.8.2026
42

Wk 32 Electronics Supply Chain Digest

24.8.2026
63

Wk 31 Electronics Supply Chain Digest

17.8.2026
73

Wk 30 Electronics Supply Chain Digest

3.8.2026
69

Wk 29 Electronics Supply Chain Digest

27.7.2026
57

Wk 28 Electronics Supply Chain Digest

20.7.2026
108

Wk 27 Electronics Supply Chain Digest

13.7.2026
82

Wk 26 Electronics Supply Chain Digest

6.7.2026
80

Wk 25 Electronics Supply Chain Digest

29.6.2026
67

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved