Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. […]
PCIM Europe 11-13.6. Nuernberg Germany The Power Electronics industry has been meeting in Nuremberg since 1979. The exhibition and conference is the leading international platform showcasing current products, topics and […]
