VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical […]
Würth Elektronik Webinar: New UL listing for RIGID.flex: Maximum performance - highest safety Wed, Mar 19, 2025 11:00 AM - 12:00 PM CET Our RIGID.flex PCBs have long been established […]
Validating Efficiency and EMC on WBG devices ROHDE & SCHWARZ WEBINAR joined with Würth Elektronik Wednesday, March 19, 2025 at 14:00 CET Are you developing switched mode power supplies? Do […]
Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. […]
How to Get Started with Your DC/DC Power Supply Design 25th March 2025, 4PM CET Designing a DC-DC Converter can be challenging and complex, with many technical considerations. But, as […]
External Visual Inspection per MIL-STD-883 TM 2009 Instructor: Thomas Green Description: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of […]
Power Over Data Line (PoDL): Introduction and Application of the SPE+PoDL Board Webinar by Würth Elektronik Tuesday, April 15th 2025 @ 4:00PM CEST In this webinar, engineers will receive an […]
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