Messe Munchen
Trade Fair Center Messe München, München, Germany
electronica 2024 November 12-15 World’s leading trade fair and conference for electronics Electronica in Munich is the world's leading trade fair for electronics, it covers the entire spectrum of modern […]
Pre Cap Visual Inspection per Mil-Std-883 (TM 2017) Instructor: Thomas Green Description: Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is […]
Design and Test of Non-Hermetic Microelectronics Instructors: Thomas Green and Robert Lowry Description: Packages made from polymeric materials as opposed to traditional hermetic materials (i.e. metals, ceramics, and glasses) require a different […]
Smart Home with Matter - Everything about the cross-manufacturer connection standard Webinar by Würth Elektronik Tuesday, November 26th 2024 @ 4:00PM CET Explore everything about Matter, the cross-manufacturer connection standard […]
Webinar: WE SYSTEMS – Bonding and more Wed, Dec 4, 2024 11:00 AM - 12:00 PM CET Die bonding on printed circuit boards? And wire bonding? Or the complete manufacturing […]
Space and Military Standards for Hybrids and RF Microwave Modules Instructor: Thomas Green Description: The US military specifications for the manufacture of hybrids and RF microwave modules can be confusing […]
MIL-STD-883 TM 2010 Instructor: Thomas Green Description: This course is an addendum to the Pre Cap Visual MIL-STD-883 TM 2017 inspection class (4 sessions) and its best to take that […]
Decreasing the BOM and Improving Common Mode Noise Reduction of Power Modules Webinar by Würth Elektronik Tuesday, December 10th 2024 @ 4:00PM CET Less is more! In this webinar, we’ll […]
Hermeticity Testing, Internal Gas Analysis (IGA) and Getters Instructors: Thomas Green, TJ Green Associates, LLC Robert Lowry, Electronics Materials Consultant Andy Hayden, Edryne Ltd. Description: This tutorial includes a basic review […]
Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. […]
Retrofitting with FeatherWings - How to digitize your analog systems Webinar by Würth Elektronik Tuesday, December 17th 2024 @ 4:00PM CET Discover in our webinar everything about retrofitting with FeatherWings […]
EMC Challenges for high speed signal immunity and low EMI power delivery Webinar by Würth Elektronik Tuesday, January 14th 2025 @ 4:00PM CET presented by Lorandt Fölkel Würth Elektronik eiSos […]