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    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

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    SCHURTER TCS6F IP67 sealed SMD tactile switch with white silicone actuator on dark background

    SCHURTER Unveils IP67 Tactile Switch in 6.2 × 6.2 mm Package

    YAGEO SMD 0603 ST Pt1000 chip sensor shown in front of rooftop HVAC equipment

    YAGEO SMD 0603 ST Pt1000 Sensor with Standard SMD Termination

    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
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    • Derating
    • Dielectric Constant
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2nd PCNS Attendees Valued Its High Professional and Networking Level

24.4.2020
Reading Time: 3 mins read
A A

Source: EPCI news

2nd PCNS Passive Components Networking Symposium held in Bucharest, Romania on September 10-13th, 2019 was a great opportunity to meet passive components professionals and discuss with them hot topics, technical challenges, market trends, material supplies etc. related to passive components.

PCNS symposium was attended by 63 participants from 13 European countries, USA and China and posed an ideal networking possibilities for designers, purchasers, application engineers etc. to meet together within the group of component manufacturer industry (~50%), academia (~ 20%) and end users (~ 20% mainly automotive). Space industry was represented by presence of ESA ESTEC and Jacobs Engineering Inc/NASA.

2nd PCNS was hosted by Politehnica University of Bucharest that showed their latest and greatest laboratory equipment ready for material and structure characterization, failure analysis and ready to support material science. Bite of Romanian culture surrounded Welcome Drink with wine testing of excellent local Romanian wines. Gala Dinner at country restaurant introduced national cuisine with a folk music that immersed everyone into a cosmopolitan networking atmosphere.

The professional program included mounting and advanced passives workshops, four keynote speeches, hot topic panel discussion and 18 technical papers.

The two hour Hot Panel Discussion covered challenging topic of DC BIAS Ageing effect of MLCC and its performance in automotive applications. The discussion focused on definition of the issue, capabilities of manufacturers to measure and support suitable tools for designers. Continental Automotive GmbH shared his valuable input on position of customers and its requirements.

Hot Panel Discussion about MLCC class II DC BIAS Ageing.
Left to right: Paul Le Nezet Würth Elektronik; Yuki Nagoshi Murata Electronics Europe; Ladislav Vindiš Continental Automotive GmbH; Benjamin Blume Samsung Electro-Mechanics; Wilson Hayworth Kemet Electronics; Ron Demcko AVX Corporation; Tomas Zednicek EPCI

The panel was very open with target to find the best way forward helping designers of not only automotive system utilize the best fit capacitor technologies. Open questions from audience engaged well the panelist with wide range of related technical and supply chain questions.

The panel discussion summary will be processed into an open letter to AECQ-200 committee to move the topic and further discussion to next level.
PCNS attendees, according to their feedback, rated high: open atmosphere, participants’ level of interest and professional competence and networking.

PCNS Mobile and Web Application allowed interactive way of communication. Attendees could easily navigate through the menu, information about program, sponsors or exhibitors as well as rate online individual papers. The best and two outstanding papers voted by participants are:

BEST PAPER AWARD

Title: Degradation of ESR in Polymer Tantalum Capacitors during High Temperature Storage

by: Dr. Alexander Teverovsky

Jacobs Engineering Inc. NASA GSFC

 

OUTSTANDING PAPER AWARD

Title: Integrated and discrete capacitors based on carbon nanostructures with capacitance densities in excess of 350nF/mm2

by: S.Krause Ph.D., R.Andersson, M.Bylund, A.M.Saleem and V.Desmaris;

SMOLTEK AB

 

 

 

OUTSTANDING PAPER AWARD

Title: Analysis of Multi-Layer Ceramic Capacitors used in Power Distribution Networks

by: Marcel Manofu1, Radu Voina2 and Cătălin Negrea1

1 Continental Automotive Romania, Timișoara;
2 Technical University of Cluj-Napoca

 

Big Thanks also to all the participants for great professional environment, open and friendly atmosphere and PCNS sponsors:

AVX Corporation, Itelcond, Kemet Corporation, Würth Elektronik and exhibitors that enabled this event to happen.

 

PCNS is a bi-annual Passive Components Networking Symposium organized by EPCI hosted by European univeristy.

! The next 3rd PCNS to be hosted by Politehnico di Milano in September 2021 !

! See you there !

 

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