Airbus Defence and Space Roadmap for Passive Components

source: ADS; ESA SPCD 2018 Symposium

EPCI e-symposium library article

Airbus Defence and Space Roadmap presentation by Laurent Toudret during the ESA SPCD 2018.

published by EPCI under approval of ESA SPCD 2018 organizing committee.

Title: Airbus Defence and Space Roadmap for Passive Components
Author(s): Laurent Toudret
Organisation(s): Airbus Defence and Space
Symposium: ESA SPCD 2018
Reference: Technology Roadmaps
ISBN: N/A
e-Sessions Applications: Aerospace
e-Sessions Scope Components: Capacitors, Inductors
e-Sessions Topics: Quality & Reliability, Roadmaps

Key Ideas from the Last SCPD 2013 and 2016

• SCPD-2013 Overview of passive components used in space:~80% of total components
• Trend for the future: Miniaturisation
• Lower supply voltage for IC, high frequency operation, high temperature operation, higher power for RF connectors
• Need to be competitive for European manufacturers
• Design for ManufacturingGoal: 100% of part in automatic assembly
• Passive part assembly qualification are critical
• Major trends VLSI like FPGA: lower supply voltage, higher operating frequency, many decoupling capacitors
• Waiting for GaNFET for DC-DC converter
• High data-rate interface
• RF domain: 27-31 GHz parts are increasing, development for Q/V band running, rated power increase, connectors comes to their limits.
• Technology Status in Europe. The needs expressed by the space industry are almost covered with ESA qualified and/or evaluated components with the support of national agencies (CNES DLR)
• Some missing components: chip ceramic BME in 0402, multi-anode polymer tantalum capacitors, high voltage relays, high efficient SMD magnetics 

All remarks from the two first SCPD are still valid:

• Lower size
• Higher performance
• Higher frequency
• Higher power to be managed
• Lower cost

What is new in 2018:

• We face a huge increase of data traffic
  • Exponential trend for global data traffic and mobile data 
  • More and more Machine-to-Machine exchange (x8 in 5 years) and mobile service 
• Consequences for Data Exchange in Space
  • Move from RF to Optical Link between ground and satellites, between satellites LEO-to-GEO, LEO-to-LEO
  • Wide increase of data to be processed on board
• In parallel, there are major evolutions in data processing 
  • From system in box to system-on-chip
  • Mix of electronics: digital, power, RF signal interface to be managed in the same area
  • Applications: Frequency Conversion, Signal Processing, Data Compression, Signal/ Data Security/Encryption, Data Storage, Telemetry and Control

Consequences for Electronics

• Voltage Power Supplies for SoC
  • Number of power supplies
  • Due to the high number of different functions and interface types, more and more different supply voltages will have to be managed separately
  • Multiplication of Point-of-Load and Low-Drop-Out regulator
• Increase of Electromagnetic Compatibility constraints
  • Low voltage and High current: down to 0.8V >10A, supplied by a DC-DC converter (several 100kHz)
  • High frequency interface: 25GHz, even more in a near future
  • DRR3/4 memories: high data-rate exchange
  • Low voltage data monitoring for the supply currents 

Consequences for passive parts

• Decoupling capacitor for FPGA and SoC can have a major impact on surface
  • Use of low voltage, high capacitance, low size, last generation of BME ceramic capacitors are mandatory
  • In addition, large capacitance, low voltage and low ESR: tantalum, polymer multi-anode
• Supply voltage functions:
  • point-of-load and low drop-out voltage regulator
  • Use of low voltage, high capacitance, low size, last generation of BME ceramic capacitors are mandatory
  • In addition, large capacitance, low voltage, tantalum, polymer, multi-anode (but ESL could be a limit with high-frequency switching operations)
  • High current inductors
  • Shunts are mandatory for overload protection 
• Module interconnection
  • Very high-frequency connector (from 6 to 25 Gb/s up to 50Gb/s) with many channels in parallel, press-fit or BGA technology
• EMI management
  • Introduction of 0402 RF inductors
  • Introduction of Chip ferrite beads for power applications 

… see more at the full presentation link below…

see the full presentation here:

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