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Airbus Defence and Space Roadmap for Passive Components

5.12.2018
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source: ADS; ESA SPCD 2018 Symposium

EPCI e-symposium library article

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Airbus Defence and Space Roadmap presentation by Laurent Toudret during the ESA SPCD 2018.

published by EPCI under approval of ESA SPCD 2018 organizing committee.


Title: Airbus Defence and Space Roadmap for Passive Components
Author(s): Laurent Toudret
Organisation(s): Airbus Defence and Space
Symposium: ESA SPCD 2018
Reference: Technology Roadmaps
ISBN: N/A
e-Sessions Applications: Aerospace
e-Sessions Scope Components: Capacitors, Inductors
e-Sessions Topics: Quality & Reliability, Roadmaps


Key Ideas from the Last SCPD 2013 and 2016

  • SCPD-2013 Overview of passive components used in space:~80% of total components
  • Trend for the future: Miniaturisation
  • Lower supply voltage for IC, high frequency operation, high temperature operation, higher power for RF connectors
  • Need to be competitive for European manufacturers
  • Design for ManufacturingGoal: 100% of part in automatic assembly
  • Passive part assembly qualification are critical
  • Major trends VLSI like FPGA: lower supply voltage, higher operating frequency, many decoupling capacitors
  • Waiting for GaNFET for DC-DC converter
  • High data-rate interface
  • RF domain: 27-31 GHz parts are increasing, development for Q/V band running, rated power increase, connectors comes to their limits.
  • Technology Status in Europe. The needs expressed by the space industry are almost covered with ESA qualified and/or evaluated components with the support of national agencies (CNES DLR)
  • Some missing components: chip ceramic BME in 0402, multi-anode polymer tantalum capacitors, high voltage relays, high efficient SMD magnetics 

All remarks from the two first SCPD are still valid:

  • Lower size
  • Higher performance
  • Higher frequency
  • Higher power to be managed
  • Lower cost

What is new in 2018:

  • We face a huge increase of data traffic
    • Exponential trend for global data traffic and mobile data 
    • More and more Machine-to-Machine exchange (x8 in 5 years) and mobile service 
  • Consequences for Data Exchange in Space
    • Move from RF to Optical Link between ground and satellites, between satellites LEO-to-GEO, LEO-to-LEO
    • Wide increase of data to be processed on board
  • In parallel, there are major evolutions in data processing 
    • From system in box to system-on-chip
    • Mix of electronics: digital, power, RF signal interface to be managed in the same area
    • Applications: Frequency Conversion, Signal Processing, Data Compression, Signal/ Data Security/Encryption, Data Storage, Telemetry and Control

Consequences for Electronics

  • Voltage Power Supplies for SoC
    • Number of power supplies
    • Due to the high number of different functions and interface types, more and more different supply voltages will have to be managed separately
    • Multiplication of Point-of-Load and Low-Drop-Out regulator
  • Increase of Electromagnetic Compatibility constraints
    • Low voltage and High current: down to 0.8V >10A, supplied by a DC-DC converter (several 100kHz)
    • High frequency interface: 25GHz, even more in a near future
    • DRR3/4 memories: high data-rate exchange
    • Low voltage data monitoring for the supply currents 

Consequences for passive parts

  • Decoupling capacitor for FPGA and SoC can have a major impact on surface
    • Use of low voltage, high capacitance, low size, last generation of BME ceramic capacitors are mandatory
    • In addition, large capacitance, low voltage and low ESR: tantalum, polymer multi-anode
  • Supply voltage functions:
    • point-of-load and low drop-out voltage regulator
    • Use of low voltage, high capacitance, low size, last generation of BME ceramic capacitors are mandatory
    • In addition, large capacitance, low voltage, tantalum, polymer, multi-anode (but ESL could be a limit with high-frequency switching operations)
    • High current inductors
    • Shunts are mandatory for overload protection 
  • Module interconnection
    • Very high-frequency connector (from 6 to 25 Gb/s up to 50Gb/s) with many channels in parallel, press-fit or BGA technology
  • EMI management
    • Introduction of 0402 RF inductors
    • Introduction of Chip ferrite beads for power applications 

New Space

Advantage of automotive components:

  • Example with chip ceramic capacitor
    • Cost: Between ESA and Automotive: x400, Between COTS+ and Automotive:x100
  • Miniaturization
  • Can be mandatory: due to radiation issue, replacement of IC by discrete solution requiring more space
  • Example with ceramic chip capacitor:
    • size Comparison from a manufacturer supplying capacitors from commercial to full qualified ESA and MIL, including BME techno: for 1210 size 50V, from 0.1μF in MIL qualified to 1μF in ESA BME, up to 10μF in automotive
  • Continuous production quality survey and improvement

Drawbacks of Automotive components:

  • Assembly qualification (To be assessed like all components)
  • Mechanical vibrations (But qualified through the assembly qualification)
  • Out-gassing (To be assessed, especially for inductors, transformers, connectors)
  • Long term operation (But not on the lot)
  • Early failure rate (No specified screening procedure)
  • Lack of lessons learned in space mission

 

… see more at the full presentation link below…

 


see the full presentation here:

 

 

 

 


 

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