Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

AVX Announces Sponsorship of Formula-E Racing Team

15.2.2019
Reading Time: 3 mins read
A A

Source: AVX news

AVX puts the pedal to the metal in its latest effort to promote increased environmental sustainability, partnering with Mouser, TTI, & Molex to sponsor the GEOX DRAGON racing team for Season 5 of the world’s first & only all-electric automotive racing series
FOUNTAIN INN, S.C. (February 14, 2019) – AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, is sponsoring the GEOX DRAGON Formula-E racing team in partnership with Mouser Electronics, TTI, Inc., and Molex. The world’s first and only racing series with all-electric vehicles, the ABB FIA Formula-E Championship is a fusion of engineering, technology, sport, science, design, music, and entertainment — all firmly rooted in the three core values of energy, environment, and entertainment, and designed to help drive the change towards an all-electric future by accelerating global interest in electric vehicle technology.

RelatedPosts

VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

Bourns Introduces Precision Thin Film Resistors for Measurement

The Formula-E championship is comprised of 13 races that take place in 12 incredible cities across five continents. Season 5 kicked off in Ad Diriyah, Saudi Arabia, on Sunday, December 16, 2018, and will take its final lap in New York City on Sunday, July 14, 2019. The next race takes place this Saturday, February 16, in Mexico City, where GEOX DRAGON drivers José María “Pechito” López — a three-time World Touring Car Driver’s Champion and multiple FIA Formula-E podium finisher — and Felipe Nasr — the reigning IMSA Prototype Champion and former Formula-1 pilot — will take to the 2.093km Autódromo Hermanos Rodríguez track in pursuit of an electric finish and new accolades.

“The all-electric Formula-E racing circuit serves as both a catalyst and proving ground for the innovative electronic components and systems responsible for both the edge-of-your-seat excitement that has earned the sport legions of global fans and for inspiring critical performance, efficiency, and safety improvements responsible for making this technology more enticing to consumers and steering the automotive industry towards an all-electric future,” said Alex Schenkel, AVX’s senior vice president of Global Sales. “We at AVX are thrilled to partner with Mouser, TTI, and Molex to support this cutting-edge, all-electric racing technology and to showcase sustainability in a platform with so much global excitement and appeal. We wish the GEOX DRAGON team and all the Formula-E fans a fast-paced season of good, clean (energy) fun.”

“Formula-E cars require the latest sustainable and — most importantly — high-performance components to gain a competitive edge,” said Todd McAtee, vice president, Americas Business Development for Mouser Electronics. “By teaming up with AVX, TTI, and Molex to sponsor Formula-E, Mouser shows its commitment to keeping engineers up to date with innovative technologies.”

AVX supports the advancement of electric vehicle technology with innovative electronic component, interconnect, sensor, control, and antenna solutions designed to provide peak performance in powertrain, active body control, advanced driver assistance system, lighting, power conversion, and drive control systems. Other recent company-wide efforts to support increased environmental sustainability include a new a 908kW solar energy parking canopy that began operation at its corporate headquarters in Fountain Inn, South Carolina, this January and is expected to generate 1.3GWh of clean, green power — the equivalent of more than one million pounds of burned coal — by the end of 2019.

For more information about the FIA Formula-E Championship, including the Formula-E racing schedule, please click here. To support the GEOX DRAGON Formula-E racing team, visit FANBOOST to vote for drivers José María “Pechito” López and Felipe Nasr and follow hashtag #AVXFormulaE and #FANBOOST on social media. The five drivers with the most FANBOOST votes cast in their favor all the way up until 15 minutes into each race are awarded a significant five-second burst of power that they can deploy in the second half of each race.

Related

Recent Posts

Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

12.11.2026
11
Würth Elektronik ABC of Thermal Management textbook

Würth Elektronik Launches ABC of Thermal Management Guide

11.11.2026
26
Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

10.11.2026
28
Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

800 VDC AI Data Centers Reshape Capacitor Demand for 2027

6.11.2026
89
Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

Connector Raw Material Costs Rise 20.9% in Q2 2026

5.11.2026
19

AI and Passive Components: Structural Growth Beyond Data Centers

5.11.2026
50
YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

5.11.2026
20
DMASS Europe Q3 2026 electronic component distribution market overview

European Component Distribution Jumps 42.7% in Q3 2026

4.11.2026
22
Würth Elektronik WE-SLSP SMT common-mode choke with a square package and four terminals.

Würth Elektronik Releases Common-Mode Chokes for 100 V Data and Power Lines

4.11.2026
49

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved