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Bourns BTJ Thermal Jumper Chips for PCB Heat Management

One‑Pulse Characterization of Nonlinear Power Inductors

Wk 51 Electronics Supply Chain Digest

Samsung Unveils World First CLLC Resonant 1kV 33nF C0G MLCC in 1210 Size

Bourns Releases 500VDC 690VAC Fuse to Protect Power Semiconductors

Samsung MLCC Replacing Aluminum Polymer Capacitors in AI Systems

Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes

Littelfuse Introduces Automotive Current Sensors for EV Battery, Motor, and Safety Systems

Vishay Releases Fast Acting Thin Film Chip Fuses
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One‑Pulse Characterization of Nonlinear Power Inductors

Thermistor Linearization Challenges

Coaxial Connectors and How to Connect with PCB

PCB Manufacturing, Test Methods, Quality and Reliability

Transformer Behavior – Current Transfer and Hidden Feedback

Choosing the Right Capacitor: The Importance of Accurate Measurements

RF Inductors: Selection and Design Challenges for High-Frequency Circuits

Transformer Safety IEC 61558 Standard

3-Phase EMI Filter Design, Simulation, Calculation and Test
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February 2026
24.2.2026 @ 16:00 - 17:00 CET

Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization

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Designing Qi2 Wireless Power Systems: Practical Development and EMC Optimization Webinar by Würth Elektronik Tuesday, February 24th 2026 @ 4:00PM CET Curious about Qi2 wireless power design? Join this webinar […]

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