Copper and Gold Wire Bonding Seminar Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past, gold wire was the dominant material in use, but in 2015 copper and palladium coated copper wire captured more than 51% […]
Partial Micro-Vias; WE PCB Design Webinar Wed, Nov 8, 2023 11:00 AM - 12:00 PM CET Partial vias play a decisive role in the miniaturization of printed circuit boards. These are buried vias and microvias, which can be combined in different ways. We call microvias placed directly in solder pads "microvia-in-pad". This saves valuable space, […]
Toroidal Flat Wire PFC Inductors vs. Traditional PFC Inductors- Partnered with DigiKey Electronics Tue, Nov 14, 2023 4:00 PM - 5:00 PM CET Join us for this online seminar as we explain the differences between traditional bobbin type PFC inductors and our new toroidal flat wire PFC inductors. How does it benefit and fulfill the […]
Grid-Tied Inverter Multi-Pole Output Filter Magnetics Design; Frenetic Webinar Date & Time Nov 20, 2023 05:00 PM CET Join us for an insightful Webinar on the design and optimization of output power filters for single-phase grid-tied inverters. Discover the methodology, explore the benefits of the Frenetic Online Platform, and learn from industry expert Donald J. Lucas. Discover the complexities of […]
Hybrid Event | ECPE Workshop: Capacitors in Power Electronics Date: 22/11/2023 - 23/11/2023 Location: Sønderborg, Denmark The main focus in the research areas in power electronics has been on active devices, both on power semiconductors and on the integration of control, protection and driving circuits with the main switches. Due to the already achieved progress in this […]
Definition of component heating of power inductors in switching regulators using IEC 62024 - Partnered with Digi-Key Electronics 28. November 2023, 16:00 - 17:00 CET The heating of components is a central issue in any design. It is often the case that the heating of the application is kept as low as possible. Interpreting the […]
