Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

    Glass Core Technology Breakthrough Potential for High-Speed Interconnects

    YAGEO Releases High Isolation Transformer for 1500VDC Applications

    Bourns Releases 1500VDC Power Fuse for Photovoltaic Applications

    Murata Releases Worlds First Molded Thermistor with Wire-Bonding

    Vishay Extends Axial Wirewound Resistors with WSZ Lead Form

    Smoltek CNF-MIM Capacitor Commercialization Update

    Bourns Unveils Automotive Thick Film on Steel

    TT Electronics Releases Failsafe and High Surge SMD MELF Resistors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Coupled Inductors in Multiphase Boost Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

    Glass Core Technology Breakthrough Potential for High-Speed Interconnects

    YAGEO Releases High Isolation Transformer for 1500VDC Applications

    Bourns Releases 1500VDC Power Fuse for Photovoltaic Applications

    Murata Releases Worlds First Molded Thermistor with Wire-Bonding

    Vishay Extends Axial Wirewound Resistors with WSZ Lead Form

    Smoltek CNF-MIM Capacitor Commercialization Update

    Bourns Unveils Automotive Thick Film on Steel

    TT Electronics Releases Failsafe and High Surge SMD MELF Resistors

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Coupled Inductors in Multiphase Boost Converters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Future electronic components to be printed like newspapers

20.7.2018
Reading Time: 2 mins read
A A

Source: Purdue University news

WEST LAFAYETTE, Ind. — A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

RelatedPosts

Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

Glass Core Technology Breakthrough Potential for High-Speed Interconnects

YAGEO Releases High Isolation Transformer for 1500VDC Applications

The low-cost process, developed by Purdue University researchers, combines tools already used in industry for manufacturing metals on a large scale, but uses the speed and precision of roll-to-roll newspaper printing to remove a couple of fabrication barriers in making electronics faster than they are today.

Cellphones, laptops, tablets, and many other electronics rely on their internal metallic circuits to process information at high speed. Current metal fabrication techniques tend to make these circuits by getting a thin rain of liquid metal drops to pass through a stencil mask in the shape of a circuit, kind of like spraying graffiti on walls.

“Unfortunately, this fabrication technique generates metallic circuits with rough surfaces, causing our electronic devices to heat up and drain their batteries faster,” said Ramses Martinez, assistant professor of industrial engineering and biomedical engineering.

Flexible plasmonics

Purdue researchers have developed a new technique that prints metals like newspapers, making them smoother and more flexible for better current flow throughout a metallic circuit. (Purdue University image/Ramses Martinez)

Future ultrafast devices also will require much smaller metal components, which calls for a higher resolution to make them at these nanoscale sizes.

“Forming metals with increasingly smaller shapes requires molds with higher and higher definition, until you reach the nanoscale size,” Martinez said. “Adding the latest advances in nanotechnology requires us to pattern metals in sizes that are even smaller than the grains they are made of. It’s like making a sand castle smaller than a grain of sand.”

This so-called “formability limit” hampers the ability to manufacture materials with nanoscale resolution at high speed.

Purdue researchers have addressed both of these issues – roughness and low resolution – with a new large-scale fabrication method that enables the forming of smooth metallic circuits at the nanoscale using conventional carbon dioxide lasers, which are already common for industrial cutting and engraving.

“Printing tiny metal components like newspapers makes them much smoother. This allows an electric current to travel better with less risk of overheating,” Martinez said.

The fabrication method, called roll-to-roll laser-induced superplasticity, uses a rolling stamp like the ones used to print newspapers at high speed. The technique can induce, for a brief period of time, “superelastic” behavior to different metals by applying high-energy laser shots, which enables the metal to flow into the nanoscale features of the rolling stamp – circumventing the formability limit.

“In the future, the roll-to-roll fabrication of devices using our technique could enable the creation of touch screens covered with nanostructures capable of interacting with light and generating 3D images, as well as the cost-effective fabrication of more sensitive biosensors,” Martinez said.

The researchers discuss their technology further in Nano Letters, an American Chemical Society publication. The work is financially supported by Purdue University; the Ross Fellowship program at Purdue; the Administrative Department of Science, Technology and Innovation of Colombia (Grant 567-2012); and Procter & Gamble (Grant 209621).

featured image credit: Purdue University image/Ramses Martinez

 

Related

Recent Posts

YAGEO Releases High Isolation Transformer for 1500VDC Applications

12.6.2025
9

Vishay Extends Axial Wirewound Resistors with WSZ Lead Form

12.6.2025
8

Smoltek CNF-MIM Capacitor Commercialization Update

11.6.2025
12

Bourns Unveils Automotive Thick Film on Steel

11.6.2025
25

TT Electronics Releases Failsafe and High Surge SMD MELF Resistors

10.6.2025
12

Understanding Switched Capacitor Converters

9.6.2025
49

Exxelia to Present Smart Integrated Magnetics and MML Film Capacitors at SIAE25 

6.6.2025
28

YAGEO Unveils PulseChip LAN Transformer

6.6.2025
16

Bourns Releases Automotive Impedance Matching Transformer

6.6.2025
10

Stackpole Offers Affordable Current Sense Chip Resistors

6.6.2025
6

Upcoming Events

Jun 24
17:00 - 18:00 CEST

Ultra-Compact and Efficient Switched-Capacitor Power Converters

Jul 23
13:00 - 14:00 CEST

PCB design for a Smartwatch

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology Explained

    0 shares
    Share 0 Tweet 0
  • How to Design an Inductor

    0 shares
    Share 0 Tweet 0
  • Flying Capacitors Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Premium Suppliers

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version