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    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

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    Electrocaloric Multilayer Capacitors: Towards Quiet, Solid‑State Cooling Around Room Temperature

    High-Crystallinity Nanocrystalline Composites for MHz Chip Inductors

    European Components Distribution Shows Strong Q1 2026 Growth Amid Geopolitical Uncertainty

    Stackpole Expanded its AlN Thick Film Chip Resistors

    KYOCERA 10 µF 0201 MLCC Brings High‑Capacitance into Mobile Designs

    Würth Elektronik Introduces Compact Flat-wire SMT Power Inductors for Automotive

    KYOCERA AVX Extends MLV Varistors for 48V Automotive Protection

    Energy Localization in Tantalum Anode Formation: A Structural Perspective

    Wk 18 Electronics Supply Chain Digest

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    Transformer-Based Power-Line Harvester Magnetic Design

    Thermal Modeling of Magnetics

    Standard vs Planar LLC transformers Comparison for Battery Chargers

    How Modern Tools Model Magnetic Components for Power Electronics

    Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool

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Interview with Yageo CTO Philip Lessner Ph.D. on Electronic Components Current and Future Trends

29.10.2024
Reading Time: 1 min read
A A

In this video by Octopart and Edgewater, Philip Lessner, Ph.D, Chief Technology Officer at the Yageo Group discusses the latest trends and insights in the electronic component marketplace.

YAGEO Group is a leading electronic component company with capabilities on a global scale, including production and sales facilities in Asia, Europe and the Americas. Phillip discusses the latest developments in the future of work in the electronic components industry.

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Source: Edgewater

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