Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TI unveils industry’s smallest 12-V, 10-A DC/DC step-down power solution eliminating input and output capacitors

14.2.2017
Reading Time: 2 mins read
A A

source: PR Newswire article

TI unveils industry’s smallest 12-V, 10-A DC/DC step-down power solution. Highly integrated SWIFT™ power modules eliminate input and output capacitors to provide best transient performance for space-constrained application. Pair of 12-V, 10-A, 4-MHz step-down power modules from Texas Instruments provide a power management solution that is 20% smaller than any other 10-A power module-based solution available today. The easy-to-use SWIFT TPSM84A21 and TPSM84A22 DC/DC modules integrate power MOSFETs, shielded inductors, input and output capacitors, and passives into a tiny, low profile footprint. 

RelatedPosts

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

Wk 42 Electronics Supply Chain Digest

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

DALLAS, Feb. 13, 2017 /PRNewswire/ — Texas Instruments (TI) (NASDAQ: TXN) today introduced a pair of 12-V, 10-A, 4-MHz step-down power modules that provide a power management solution that is 20 percent smaller than any other 10-A power module-based solution available today. The easy-to-use SWIFT TPSM84A21 and TPSM84A22 DC/DC modules integrate power MOSFETs, shielded inductors, input and output capacitors, and passives into a tiny, low profile footprint. In addition, it provides industry-leading performance, with as little as 1 percent overshoot in transient conditions without special magnetics or additional capacitors. For more information, samples and an evaluation module, see www.ti.com/tpsm84a21-pr.

By using the step-down power module together with TI’s WEBENCH® Power Designer, engineers can get their space-constrained point-of-load (POL) telecom, networking, and test and measurement power-supply designs to market faster. TI will demonstrate the TPSM84A22 module in its booth (No. 701) at the Applied Power Electronics Conference (APEC), March 27-29 in Tampa, Florida.

Unlike other 10-A step-down modules available today, the highly integrated TPSM84A21 and TPSM84A22 require just one external voltage-setting resistor for a complete 12-V step-down power solution. For an application such as powering tightly regulated field-programmable gate array (FPGA) rails, a typical 10-A module would require up to 16 external capacitors. In comparison, the TPSM84A21 provides ultra-low output ripple due to the very high 4-MHz switching frequency and integrated 185 microfarads of output capacitance, which maintains regulation accuracy without any external capacitors.

TPSM84A21 and TPSM84A22 key features and benefits

  • Tiny solution:A9-mm by 15-mm module and a single external voltage-setting resistor make up a complete solution footprint of 11 mm by 15 mm.
  • Low profile: Measuring 2.3 mm in height, the small size, weight and bill of materials enable placement of the complete solution on the back side of a printed circuit board.
  • Best transient performance: 4-MHz switching enables ±1 percent overshoot without any external capacitors.
  • Easy to design: Integrated input and output capacitors eliminate the loop compensation and magnetics part selection from the design process. Use WEBENCH Power Designer to quickly create a complete 12-V, 10-A DC/DC step-down solution with just one voltage-setting resistor.

Availability, packaging and pricing The TPSM84A21 with a voltage output of 0.55 V to 1.35 V and the TPSM84A22 with a voltage output of 1.2 V to 2.0 V are available in volume now through the TI store and authorized distributors. Offered in a 20-pin quad flat micro (QFM) package, the modules are priced at US$8.63 in 1,000-unit quantities. Order the TPS84A21EVM and TPS84A22EVM evaluation modules and download the PSpice transient models.

The TPSM84A21 and TPSM84A22 are the newest additions to TI’s broad portfolio of DC/DC power modules that integrate inductors, FETs, compensation, and other passive components into a single package to save board space and simplify prototyping, design, and manufacturing.

 

Related

Recent Posts

Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
5
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
46
Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

15.10.2026
23
TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

TDK X Series SMD Varistors for Industrial Transient Protection

14.10.2026
10
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
86
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
31
Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

12.10.2026
13
ECIA September 2026 Industry Pulse electronic component trends and sentiment report

ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

12.10.2026
36
Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

TT Electronics: Resistor and Sensing Trends at electronica 2026

9.10.2026
15

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved