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Würth Elektronik Introduces Thermo-Conductive Gap Filler

2.9.2020
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Conduct Heat, No Current

With its WE-TGF (Thermal Gap Filler) Würth Elektronik now offers a new solution for heat dissipation.

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The outstanding feature of the self-adhesive gap-filler material: The non-conductive barrier with a high dielectric strength has a high thermoconductivity index of 1 W/(m*K).

The material easily adapts to the differing thicknesses of components on the PCB and fills the gaps between hot electronic components and metal casings or cooling components.

WE-TGF is made of silicone incorporating ceramic particles. For applications in which the PCB is screwed onto a metal plate, the material is also reinforced with a glass-fibre mesh.

The thermoconductive gap filler is suited for use e.g. in:

  • power electronics
  • entertainment technology
  • networking devices

WE-TGF is available ex stock in a variety of dimensions and in thicknesses ranging from 0.23 to 5 mm. Developers working in the prototype construction area can request individually cut samples, which are shipped within 48 hours of ordering. Customization comes at no extra charge for the customer.

Source: Würth Elektronik

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