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    Modelithics Releases Components Library v25.0 for Keysight 

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    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

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    Modelithics Releases Components Library v25.0 for Keysight 

    How to design a 60W Flyback Transformer

    Researchers Present Hybrid Supercapacitor Zn-Ion Microcapacitors

    Murata Releases 008004 High-Frequency SMD Chip Inductor

    Wk 19 Electronics Supply Chain Digest

    Bourns Extends Rotational Life Option for its Guitar Potentiometer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    TAIYO YUDEN Releases Compact SMD Power Inductors for Automotive Application

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    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

    Coupled Inductors in Multiphase Boost Converters

    VPG Demonstrates Precision Resistor in Cryogenic Conditions

    Comparison Testing of Chip Resistor Technologies Under High Vibration

    EMC Challenges for High Speed Signal Immunity and Low EMI

    MOSFET Gate Drive Resistors Power Losses

    Modified Magnetic Reluctance Equivalent Circuit and its Implications

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2019 Passive Components Product of the Year

3.2.2020
Reading Time: 2 mins read
A A

Electronic Products announces winners of the 2019 Product of the Year Awards selected by the editors of Electronic Products. The passive components category winner is:

Cornell Dubilier Electronics ULP Series of Ultra-Low-Profile Aluminum Electrolytic Capacitors

Cornell Dubilier Electronics (CDE) has developed an ultra-low-profile family of aluminum-electrolytic capacitors that can replace large arrays of surface-mount (SMT) capacitors. Called a “game changer” for engineers designing compact electronic devices, the ULP series is designed specifically for applications requiring bulk capacitance and the lowest board profiles and offers considerably higher energy density than arrays of SMT capacitors. This design allows engineers to use a single component to save space, weight, and cost while improving reliability.

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“With energy density exceeding 0.4 J/cc, a single ULP capacitor provides much greater bulk storage in a smaller footprint than a bank of low-profile SMT capacitors,” claimed Mario DiPietro, CDE’s product manager. “The technology is particularly effective at displacing parallel banks of SMT solid tantalum capacitors to achieve high capacitance on the board.”

Capacitance values range from 500 µF to 24,000 µF. Working voltages range from 4 to 63 WVDC with an operating life of 3,000 hours at 85°C without voltage derating. Unlike solid tantalum capacitors, type ULP capacitors do not require voltage derating, said CDE.

The ULP family is offered in package heights of 2.2 mm and 3.2 mm. With flat ribbon-lead–style terminations, it is even possible to mount the device off-board for added design flexibility. These capacitors are suitable for use in portable devices and a wide range of applications in which height profile, board space, and weight are critical design factors.

The 2.2-mm thin part is available with up to 7,800 µF; the 3.2-mm part is rated at up to 24,000 µF. Both have voltage ratings from 4 to 63 WVDC, depending on capacitance.

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