• Latest
  • Trending
  • All
  • Capacitors
  • Resistors
  • Inductors
  • Filters
  • Fuses
  • Non-linear Passives
  • Applications
  • Integrated Passives
  • Oscillators
  • Passive Sensors
  • New Technologies
  • Aerospace & Defence
  • Automotive
  • Industrial
  • Market & Supply Chain
  • Medical
  • RF & Microwave
  • Telecommunication

Addressing Design Challenges in EMI-Suppression Capacitors

8.8.2022

4th PCNS Call for Abstracts Extended !

31.3.2023

KEMET SMD Tantalum Polymer Capacitors Meets Newly Released Military Performance Specification MIL-PRF-32700/1 and /2

31.3.2023

Practical LLC Transformer Design Methodology

31.3.2023

Practical Measurement of Crystal Circuits

31.3.2023

March 2023 ECIA NA Electronic Components Sales Misses Expectations

31.3.2023

Würth Elektronik Presents New Series of DC-Link Film Capacitors

30.3.2023
  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About
No Result
View All Result
NEWSLETTER
Passive Components Blog
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • Market & Supply Chain
    • Medical
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors
    • Resistors
    • RF & Microwave
    • Telecommunication

    4th PCNS Call for Abstracts Extended !

    KEMET SMD Tantalum Polymer Capacitors Meets Newly Released Military Performance Specification MIL-PRF-32700/1 and /2

    Practical LLC Transformer Design Methodology

    Practical Measurement of Crystal Circuits

    March 2023 ECIA NA Electronic Components Sales Misses Expectations

    Würth Elektronik Presents New Series of DC-Link Film Capacitors

    Vishay Increases Anti-Surge Thick Film 0805 Power Resistor Performance with 0.5 W Power Rating

    Q&A Update on Aluminum Capacitor Technology with Industry Highest Energy Density >5J/cc Available for Acquisition

    Designing with High Voltage Resistors: 10 Top Tips for Success

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos
    • Sensors

    Practical LLC Transformer Design Methodology

    Practical Measurement of Crystal Circuits

    Investigating Modeling Techniques of Class II Ceramic Capacitors Losses for High Voltage and Current Applications

    Understanding Basics of Current Sense Resistors

    What Decoupling Capacitor Value To Use And Where To Place Them

    How to Measure Rated Current on Power Inductors

    LTspice Simulation of a Spark-Gap Circuit Protection Surge Arrester

    Approximate Inductor Design Using Two Alternative Cores

    1kW Phase Shift Full Bridge Converter Design and Simulation

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Preferred Suppliers
    • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • Market & Supply Chain
    • Medical
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors
    • Resistors
    • RF & Microwave
    • Telecommunication

    4th PCNS Call for Abstracts Extended !

    KEMET SMD Tantalum Polymer Capacitors Meets Newly Released Military Performance Specification MIL-PRF-32700/1 and /2

    Practical LLC Transformer Design Methodology

    Practical Measurement of Crystal Circuits

    March 2023 ECIA NA Electronic Components Sales Misses Expectations

    Würth Elektronik Presents New Series of DC-Link Film Capacitors

    Vishay Increases Anti-Surge Thick Film 0805 Power Resistor Performance with 0.5 W Power Rating

    Q&A Update on Aluminum Capacitor Technology with Industry Highest Energy Density >5J/cc Available for Acquisition

    Designing with High Voltage Resistors: 10 Top Tips for Success

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos
    • Sensors

    Practical LLC Transformer Design Methodology

    Practical Measurement of Crystal Circuits

    Investigating Modeling Techniques of Class II Ceramic Capacitors Losses for High Voltage and Current Applications

    Understanding Basics of Current Sense Resistors

    What Decoupling Capacitor Value To Use And Where To Place Them

    How to Measure Rated Current on Power Inductors

    LTspice Simulation of a Spark-Gap Circuit Protection Surge Arrester

    Approximate Inductor Design Using Two Alternative Cores

    1kW Phase Shift Full Bridge Converter Design and Simulation

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Preferred Suppliers
    • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Addressing Design Challenges in EMI-Suppression Capacitors

8.8.2022
Reading Time: 8 mins read
0 0
0
SHARES
1.1k
VIEWS

Kemet blog article describes EMI challenges and how to address it by EMI-Suppression capacitors.

One of the most enduring trends in the electronics industry is miniaturization. Advances in semiconductor technology, such as the implementation of wide-bandgap (WBG) MOSFET and diode devices, emphasize reducing the size of electronic components while significantly improving performance. Smartphones, wearables, and tablets are just a few examples of the numerous devices that utilize the latest semiconductor technologies. However, reliability remains a concern when components and devices downsize and become more compact.

RelatedPosts

KEMET SMD Tantalum Polymer Capacitors Meets Newly Released Military Performance Specification MIL-PRF-32700/1 and /2

Flex Suppressor Explained and its Applications

Examining the Influence of ESR and Ripple Current on Selecting the Suitable Capacitor

Miniaturization is not only intended for mobile devices. The utilization of WBG semiconductor components in power conversion systems allows for smaller footprints and greater efficiency with lower energy losses during the energy conversion. Other key advantages include reducing audible noise and the miniaturization of passive components (all with the benefit of PCB real estate reduction).

However, due to the ever-increasing number of electronic components integrated into smaller geometries, miniaturized devices have become increasingly susceptible to electrical noise or interference. While the use of higher frequencies in WBG devices helps to minimize audible noise, it produces more high-frequency emissions and requires more complex designs to meet emission requirements by regulatory agencies. For these reasons, EMI suppression capacitors play a crucial role in the electronics industry, with the need for more miniaturized solutions under critical electrical and environmental applications.

Reliability Challenges Due to Miniaturization of Semiconductor Devices

Two significant concerns come from the miniaturization of power devices with high voltages and higher frequencies: more inductive noise and greater heat losses. These challenges can have a significant effect on the reliability and performance of electronic devices.

Along with miniaturization, many of these devices face the challenge of operating within severe environmental conditions throughout their extended lifespan. Specific examples include:

  • Electric and hybrid vehicles expected to withstand higher temperatures and extreme thermal shock cycles.
  • Miniaturized solar micro-inverters and smart energy meters with expected lifetimes of up to 25 years without servicing, in different field environments.
  • Data and communication systems with less and less space to work with (and, therefore, higher power density per square foot requirements) to improve the efficiency of the electronic infrastructure.

Challenges of Metallized Polypropylene Film Technology in EMI Suppression Applications

In the latest EMI suppression film technology developments, manufacturers are achieving excellent protection of film elements by utilizing new materials and improving the capacitor manufacturing processes. In this way, products can withstand severe operating conditions that would otherwise lower their reliability and performance. However, enhancing the reliability levels under high temperature, humidity, and bias (THB) conditions in miniaturized capacitors can be particularly challenging.

Metallized polypropylene film technology (MKP) is currently the mainstay of EMI suppression capacitor solutions due to its excellent high voltage per micron and ultra-low, stable DF capabilities. Perhaps most importantly, it also has the best self-healing properties compared to other film dielectric technologies. However, combining high temperature and humidity conditions often has a drastic effect on MKP material when an AC or DC voltage is applied, resulting in accelerated degradation and potentially catastrophic failures of the capacitors. The reason for this is the phenomena of electrochemical corrosion in the zinc metallization.

Figure 1: The applied voltage drives reactions in the electrochemical cell. The corrosion rate is directly proportional to Temperature, Humidity, and Voltage Bias.

Stress Testing to Ascertain Reliability

A well-accepted accelerated life test standard for active and passive components in the electronic industry is the Temperature-Humidity-Bias (THB) test, with levels of 85°C and 85% relative humidity under AC or DC bias conditions. For many years, designers in various industries (including automotive, energy, consumer, and industrial) have used this test to ascertain the reliability of their final products for up to 25 years of operation under severe climatic conditions. More recently, the THB test has been recognized as an IEC standard for EMI suppression film capacitors.

The table below shows the different Temperature-Humidity-Bias (THB) testing conditions per IEC Standard:

GradeTest Condition ATest Condition B
I40°C / 93% RH 21 days85°C / 85% RH 168 hours
II40°C / 93% RH 56 days85°C / 85% RH 500 hours
III60°C / 93% RH 56 days85°C / 85% RH 1,000 hours
Table 1: 60384-14 Am .1 Ed.4 Fixed capacitors, .2 Humidity Robustness Grades
Requirement
Capacitance|ΔC| ≤ 10%
Dissipation Factor0.024 for CN ≤ 1 μF 0.015 for CN > 1 μF
Insulation Resistance> 50% of the applicable limits
Table 2: Capacitance, Dissipation Factor, and Insulation Resistance requirements.
Figure 2: An example mission profile with high temperature and relative humidity conditions in Central Florida, USA, with humidity reaching levels of 100% and average month of 83%

Designers needing to ensure that their products pass the THB evaluation and emission certification have encountered several challenges; for instance, it can be difficult to obtain the required technology and include multiple EMI suppression capacitors into already component-dense circuits. There are also higher power requirements within a limited board space to take into consideration. See below examples of circuit designs with a limited footprint surface for EMI suppression capacitors, X2 and Y2.

Figure 3: Example of extreme design consideration for X2 capacitors on a PCB area limitation on high energy density PS with WBG semiconductor designs

Miniaturizing Safety Capacitor Constructions: Challenges and Solutions

Some of the constraints of EMI suppression capacitors correlate to the film quality and protection surrounding it. The amount and type of resin used, the epoxy filling the surrounding of the capacitor element, and the material and thickness of the radial box encapsulating them all play vital roles in a product’s reliability. Moreover, there is a mechanical challenge in manufacturing capacitors with smaller capacitance values; lower capacitances require less film and metallization material, making the product more susceptible to damage due to humidity.

KEMET’s Solution: The R52 Miniaturized X2 Suppression Capacitor

Figure 4: R52 Capacitance Drift with Lifetime

KEMET’s R&D team has studied and experimented with unique solutions to address the challenges of designing EMI suppression capacitors that meet THB test requirements without sacrificing miniaturization and reliability. The first KEMET harsh environment solution was the F862, X2 series based on an enhanced MKP technology that met the AEC-Q200 qualification for automotive applications. The F863, X2, followed a few years later, providing a more compact and cost-driven solution for a consumer-oriented market.

The latest EMI suppression solution from KEMET is its new R52, X2 capacitor with harsh environment capabilities, exceeding previous solutions and passing the latest IEC-60384-14 humidity robustness test with a Class IIB classification. It achieved 500 hours during an accelerated life test under 85°C and 85% relative humidity at rated voltage. See the image below for the maximum, average, and minimum capacitance drift for the R52 family.

The R52 series successfully passes stringent tests while also providing a solution for space-constrained applications. The table below shows a comparison of KEMET’s R52 technology with those of three competitors’ EMI solutions using one particular part number, a capacitance of 0.47 µF, and 15 mm lead spacing. On average, the R52 physical volume is 60% smaller than any other X2 solution with the same range of capacitance values in the market.

Competitor
X2 310 VAC
B x H x L
(mm x mm x mm)
% In Volume vs. KEMET R52 X2
C: 0.47 µF, (9 x 12.5 x 18)
A11 x 19 x 17.5+81%
B11 x 18.5 x 18+81%
C13.5 x 22.5 x 18+170%
Table 3: KEMET’s R52 compared to leading competitors.
Figure 5: R52 Current Capabilities at various frequencies

The high capacitance and current capabilities of KEMET’s R52 allow it to function as an excellent EMI suppression solution both across and in series with the mains on high energy density designs requiring a high level of filtering capability on a broad spectrum of frequencies. A good example is in variable frequency drives and EV fast-charging systems where designers prefer to utilize high-capacitance, certified EMI suppression capacitors together with AC and DC filtering solutions to mitigate harmonic content on the output of the drives and converters. The R52 is also suited for use in capacitive power supplies and power line communication systems.

KEMET’s R52 EMI suppression capacitor is a first-to-market solution that provides an optimal balance of miniaturization and reliability in automotive, industrial, consumer, and energy applications. This product offers an ultra-high capacitance in a compact package for more board savings and lower application costs for engineers. Extensively tested for high reliability in harsh environments, KEMET’s R52 meets THB test requirements and passes the IEC-60384-14 humidity robustness test with a Class IIB classification. The R52 also meets AEC-Q200 qualification.

Source: Kemet Electronics

Related Posts

PCNS

4th PCNS Call for Abstracts Extended !

31.3.2023
108
Capacitors

KEMET SMD Tantalum Polymer Capacitors Meets Newly Released Military Performance Specification MIL-PRF-32700/1 and /2

31.3.2023
1
Inductors

Practical LLC Transformer Design Methodology

31.3.2023
8

Upcoming Events

Apr 3
April 3 @ 12:00 - April 4 @ 14:00 CEST

Microelectronic Packaging Failure Modes and Analysis

Apr 5
11:00 - 12:00 CEST

Plugging – Filling – Tenting; WE PCB Webinar

Apr 6
April 6 @ 12:00 - April 7 @ 14:00 EDT

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • What is a Dielectric Constant of Plastic Materials ?

    4 shares
    Share 4 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • Capacitor Selection for Coupling and Decoupling Applications

    28 shares
    Share 28 Tweet 0
  • Leakage Current Characteristics of Capacitors

    0 shares
    Share 0 Tweet 0
  • Why Low ESR Matters in Capacitor Design

    0 shares
    Share 0 Tweet 0
  • Capacitor Losses (ESR, IMP, DF, Q), Series or Parallel Eq. Circuit ?

    0 shares
    Share 0 Tweet 0
  • How to Choose the Right Inductor for DC-DC Buck Applications

    0 shares
    Share 0 Tweet 0
  • Coefficient of Linear Thermal Expansion on Polymers Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

PCNS Call for Papers !

Archive

2022
2021
2020
2019
2018
2017

Symposium

Passive Components Networking Symposium

Passives e-Learning

Knowledge Blog

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

© EPCI - Premium Passive Components Educational and Information Site

No Result
View All Result
  • Home
  • News
  • Video
  • Knowledge Blog
  • Preferred Suppliers
  • Events

© EPCI - Premium Passive Components Educational and Information Site

Welcome Back!

Login to your account below

Forgotten Password?

Retrieve your password

Please enter your username or email address to reset your password.

Log In
This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.