Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    June 2026 Interconnect, Passives and Electromechanical Components Market Insights

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    Wk 25 Electronics Supply Chain Digest

    Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

    Bourns Planar Transformers for SiC and GaN Gate Driver Isolation

    100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

    Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

    KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    June 2026 Interconnect, Passives and Electromechanical Components Market Insights

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    Wk 25 Electronics Supply Chain Digest

    Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

    Bourns Planar Transformers for SiC and GaN Gate Driver Isolation

    100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

    Panasonic Releases Relays for IEC 62955 Compliant Single‑Phase EV Wallboxes

    KYOCERA AVX Releases NTN Antenna Selection Guide Brochure

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Designing a USB Type‑C Flyback Planar Transformer with Frenetic’s Planar Tool

    Magnetics Design in High‑Frequency GaN Converters

    Qi2 Wireless Charging: Inductors, Capacitors and EMC Filters

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Effect of Burn-in Process on X7R MLCC Reliability

26.8.2022
Reading Time: 4 mins read
A A

The scientific paper on evaluation of effect of burn-in process on reliability of X7R multilayer ceramic capacitors has been published by Penn State researchers.

Base metal electrode (BME) multilayer ceramic capacitors (MLCCs) continue to advance with higher volumetric capacitance, higher voltage, and higher temperature operational ranges with greater numbers of capacitors being manufactured and integrated into the electronic infrastructure of society. Many of these applications range from aerospace, transport, computation, medical, satellite, military, and the internet of things means the interdependence of these devices require higher reliability at a collective and individual component level.

RelatedPosts

June 2026 Interconnect, Passives and Electromechanical Components Market Insights

KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

Thus, determining the lifetime reliability of MLCCs is critical to provide more reliable components, and no weak links to the electrified infrastructure. For some of the more costly systems that support military and satellite systems, the reliability testing is very extensive.

Schematic of the electromigration of oxygen vacancies during MLCC capacitors burn-in process.

The burn-in test is a screening procedure used to remove components with higher probability of infant mortality failures. In this process, components are exposed to high temperatures and voltages relative to their design. The thermal stimulated depolarization current results revealed that burn-in test caused the intragranular and transgranular migration of oxygen vacancies, which will not be relaxed after the burn-in test.

Time to failure data obtained through in situ highly accelerated lifetime tests demonstrated that not only burn-in tests were ineffective at detecting infant mortality failures, but they also had a negative impact on reliability of BME MLCCs by creating a weak population. The electromigration of oxygen vacancies during burn-in tests shorten the lifetime of MLCC population by reducing the protection effects of double Schottky barriers at the grain boundaries and electrode interfaces.

Experimental

Commercial BME X7R MLCCs (1206 case size, 1 uF, and voltage rating (Vr) of 50 V) were used for this study to investigate the dynamics of oxygen vacancies and the associated space charge distribution during burn-in test.

Burn-in tests were carried out at 125 °C with DC fields of 2xVr for 168h and 4xVr for 21h, referred to as long and short burn-in tests in this study. For burn-in tests, these two extreme voltage conditions were chosen based on the MIL- PRF-32535A standard. After burn-in tests, the MLCCs were cooled to room temperature without maintaining the electric field.

Thermal stimulated depolarization current (TSDC) is a powerful technique for studying the relaxation kinetics of polarizable defects, and it was used to investigate the effect of the short and long burn-in tests on ionic space charge development, both intergranular (ionic charge pile up within individual grains) and transgranular (ionic transportation beyond each grain). After short and long burn-intests, TSDC was performed on screened samples; samples were then heated at a constant heating rate; and the leakage current from depolarization of the relaxing defects was measured.

Results and discussion

A burn-in test can lead to electromigration of oxygen vacancies that accumulate into metastable ionic space charge regions, and these in turn reduces the reliability of MLCCs by compromising the double Schottky barriers at the grain boundaries and electrode interfaces. TSDC measurements confirmed inter-granular and transgranular ionic space charge accumulation after burn-in tests.

Schematic of hazard rate curve of MLCCs before (solid) and after (dash) short burn-in test

These oxygen vacancies electromigration can weaken the protection effect of double Schottky barriers at the grain boundaries and electrode interfaces which eventually reduces MLCCs lifetime. The reduction in MLCCs lifetime was confirmed by comparing the mean time to failure (MTTF) and standard deviation (SD) values of samples before and after burn-in tests. Although the MTTF did not change significantly (dropped up to 18%) after burn-in tests, the SD values increased up to 130percent indicating that the TTF data are spread out, raising concerns about the consistency, predictability, and quality of BME MLCCs for applications requiring higher levels of reliability.

Conclusions

The burn-in test is a screening procedure used to eliminate weak components with a high likelihood of infant mortality and to produce uniform components for applications demanding higher levels of reliability.

We demonstrated that the costly burn-intest may be ineffective in identifying infant mortality failures, and it reduces the reliability and lifetime of BME MLCCs through intragranular and transgranular electromigration of oxygen vacancies which may not relax after the burn-in test.

These oxygen vacancies electromigration creates a weak population of BME MLCCs that may fail much sooner than expected, resulting in a subsystem or system failure.

Read more at: Yousefian, P., Randall, C.A. Determining the effect of burn-in process on reliability of X7R multilayer ceramic capacitors. J Mater Sci (2022). https://doi.org/10.1007/s10853-022-07623-9

Related

Source: Journal of Material Science

Recent Posts

Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

29.6.2026
7

Skeleton Supercapacitor Achieves UL‑certified 3,500 A Peak Current for AI Data Centers

26.6.2026
31

100 V Hybrid Polymer Capacitor from VINA Enesol Targets 48–72 V Power Platforms

26.6.2026
79

Using a Virtual Anode Thermal Model to Evaluate Miniaturization Risk in Tantalum Capacitors

24.6.2026
36

High‑Speed Supercapacitor Balancing for AI Data Center Power Systems

23.6.2026
80

EMC‑Compliant PCB and Connector Design Guidelines

22.6.2026
51

Practical Value of Structural Diagnostics for Tantalum Capacitor Anodes

22.6.2026
34

Hall-Effect Sensing for Harsh Environments: TT Electronics Selected in NASA’s Dragonfly Fan

22.6.2026
32

Stackpole Releases High-Frequency Thin Film Chip Resistors for RF up to 50 GHz

19.6.2026
29

Upcoming Events

Jun 30
17:00 - 18:00 CEST

PSMA Capacitor Committee Webinar: High Voltage Pulse Capacitors

Jul 2
17:30 - 18:30 CEST

Can Claude design a production-ready Custom Magnetic Component?

Jul 14
16:00 - 17:00 CEST

EMC Design Essentials: Mastering Varistors and Common Mode Chokes

View Calendar

Popular Posts

  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Nvidia Vera Rubin: Why One AI Rack Needs So Many More MLCC Capacitors

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version