Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Extends Performance of its High Power PPTC Fuses

    Wk 48 Electronics Supply Chain Digest

    Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

    Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

    TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

    Passive Components for Next Gen Automotive Systems

    ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

    Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

    Circular Connectors Coding

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Extends Performance of its High Power PPTC Fuses

    Wk 48 Electronics Supply Chain Digest

    Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

    Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

    TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

    Passive Components for Next Gen Automotive Systems

    ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

    Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

    Circular Connectors Coding

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    RF Inductors: Selection and Design Challenges for High-Frequency Circuits

    Transformer Safety IEC 61558 Standard

    3-Phase EMI Filter Design, Simulation, Calculation and Test

    Transformer Design Optimization for Power Electronics Applications

    Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems

    Capacitor Self-balancing in a Flying-Capacitor Buck Converter

    How to Select Ferrite Bead for Filtering in Buck Boost Converter

    Power Inductors Future: Minimal Losses and Compact Designs

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Kemet’s KONNEKT MLCC Stacking Package is Minimizing the Footprint while Maximizing the Capacitance

30.5.2019
Reading Time: 3 mins read
A A

Source: Kemet Engineering Center article

KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. The KONNEKT™ U2J capacitors can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.

RelatedPosts

Bourns Extends Performance of its High Power PPTC Fuses

Wk 48 Electronics Supply Chain Digest

Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

Just when you thought we were done with our “KEMET-ized” sensational spelling, we released KONNEKT™ with not just one “k”, but two! We just kan’t help ourselves. All jokes aside, this revolutionary packaging solution was created to solve the problem of component selection in the growing trend of design minimalization. A few years ago we were involved in a major open-source project for a well-known tech giant with an interesting problem. They required a low loss, low inductance package capable of handling extremely high ripple current. The requirements also included the fact that their product would be using 48 V power architecture while taking up a very small footprint on the board.

Our team began the process of brainstorming what would later be labeled as our KONNEKT™ U2J ceramic capacitor. Similar to the construction of high rises and skyscrapers in major metropolitan areas, one creative and commonly used answer for space limitation is to build from the floor up in a vertical or standard orientation. Because of the requirement of the application and space limits, our stacked MLCC solution was placed in a horizontal configuration, known as a “low-loss orientation.” The KONNEKT™ U2J product can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.

KONNEKT U2J low-Loss and standard orientation

KONNEKT U2J low-Loss and standard orientation

KONNEKT™ Packaging Technology

Our patented KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. TLPS is a metal matrix composite bond that features copper-tin material and is used as a replacement for solder. The unique composite uses tin which is a low-temperature reaction metal at 300°C, with copper as the high melting point metal at 1085°C to form a reacted metal matrix, creating a distinct advantage over the use of solder. The TLPS forms a metallurgical bond between two surfaces, in this case, our U2J MLCC.

TLPS is reacted metal matrix that forms a metallurgical bond between 2 surfaces, in this case, 2 MLCCs

TLPS is reacted metal matrix that forms a metallurgical bond between 2 surfaces, in this case, two MLCCs

Why U2J?

We designed the solution for our customer using our U2J ceramics because of its Class 1 properties. Our U2J ceramic capacitors are extremely stable and retain over 99% of nominal capacitance at full rated voltage. When referenced to ambient temperature, U2J ceramic capacitors provide a predictable and linear change in capacitance. Additionally, U2J ceramic capacitors extend the available capacitance of Class 1 MLCCs into a range previously only available to Class II dielectric materials such as X5R and X7R. Combined with KONNEKT™ packaging technology, this little SMD offers bulk capacitance with extremely high ripple current capability.

Ripple current measurements performed at 85°C with a peak capacitor temperature of 95°C. Samples mounted to heat sink with no forced air cooling. Maximum ambient and self heating cannot exceed 125°C

Ripple current measurements performed at 85°C with a peak capacitor temperature of 95°C. Samples mounted to heat sink with no forced air cooling. Maximum ambient and self-heating cannot exceed 125°C.

Positive Results

This KONNEKT™ U2J solution was designed into a resonant converter (along with our power inductor technology) that resulted in a 98.92% conversion efficiency (650 W), which is critical for to maintain their low operating costs. We have received nothing but praise over this solution and will look to release more products utilizing this technology into the market. Typical applications for this product include wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems, data centers, and switched tank converters.

 

 

Related

Recent Posts

Bourns Extends Performance of its High Power PPTC Fuses

1.12.2025
3

Bourns Introduces Low-ohmic 2W Thick Film Resistors in Compact Package

28.11.2025
19

Samsung Releases 1uF 25V 0402 MLCC for AI Power Modules 

27.11.2025
35

TDK and NIPPON CHEMICAL to Establish Joint Venture for MLCC Material Development

27.11.2025
55

Passive Components for Next Gen Automotive Systems

26.11.2025
100

ROHM Expands Its High-Accuracy EROM Models for Shunt Resistors

26.11.2025
23

Samsung Presents Worlds First 100V 22nF Automotive MLCC in 0402 Size

26.11.2025
17

Bourns Releases High Precision Power Resistor for High-Energy Pulse Applications

26.11.2025
18

YAGEO Expands Aluminum Capacitors with 80V Ratings for 48V Automotive and Industrial Systems

25.11.2025
38

Upcoming Events

Dec 2
December 2 @ 12:00 - December 4 @ 14:15 CET

Microwave Packaging Technology

Dec 3
17:00 - 18:00 CET

The Hidden Secret of the Magnetic Transformer and example of its use

Dec 9
December 9 @ 12:00 - December 11 @ 14:15 EST

Space and Military Standards for Hybrids and RF Microwave Modules

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • What Electronics Engineer Needs to Know About Passive Low Pass Filters

    0 shares
    Share 0 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • SEPIC Converter Design and Calculation

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version