Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

    TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

    Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

    Littelfuse C&K SDE End-Stackable SMT DIP Switches

    Bourns SM91522AL BMS signal transformer with integrated common-mode chokes

    Bourns Releases BMS Transformer with 3.5 mm Height

    DigiKey product distribution center in Thief River Falls, Minnesota

    DigiKey Invests $100 Million to Expand Distribution Capacity

    Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

    Murata World First 008004 NTC Thermistors for Temperature Sensing

    Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

    Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

    Wk 42 Electronics Supply Chain Digest

    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Kemet’s KONNEKT MLCC Stacking Package is Minimizing the Footprint while Maximizing the Capacitance

30.5.2019
Reading Time: 3 mins read
A A

Source: Kemet Engineering Center article

KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. The KONNEKT™ U2J capacitors can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.

RelatedPosts

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

Littelfuse C&K SDE End-Stackable SMT DIP Switches

Bourns Releases BMS Transformer with 3.5 mm Height

Just when you thought we were done with our “KEMET-ized” sensational spelling, we released KONNEKT™ with not just one “k”, but two! We just kan’t help ourselves. All jokes aside, this revolutionary packaging solution was created to solve the problem of component selection in the growing trend of design minimalization. A few years ago we were involved in a major open-source project for a well-known tech giant with an interesting problem. They required a low loss, low inductance package capable of handling extremely high ripple current. The requirements also included the fact that their product would be using 48 V power architecture while taking up a very small footprint on the board.

Our team began the process of brainstorming what would later be labeled as our KONNEKT™ U2J ceramic capacitor. Similar to the construction of high rises and skyscrapers in major metropolitan areas, one creative and commonly used answer for space limitation is to build from the floor up in a vertical or standard orientation. Because of the requirement of the application and space limits, our stacked MLCC solution was placed in a horizontal configuration, known as a “low-loss orientation.” The KONNEKT™ U2J product can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.

KONNEKT U2J low-Loss and standard orientation

KONNEKT U2J low-Loss and standard orientation

KONNEKT™ Packaging Technology

Our patented KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. TLPS is a metal matrix composite bond that features copper-tin material and is used as a replacement for solder. The unique composite uses tin which is a low-temperature reaction metal at 300°C, with copper as the high melting point metal at 1085°C to form a reacted metal matrix, creating a distinct advantage over the use of solder. The TLPS forms a metallurgical bond between two surfaces, in this case, our U2J MLCC.

TLPS is reacted metal matrix that forms a metallurgical bond between 2 surfaces, in this case, 2 MLCCs

TLPS is reacted metal matrix that forms a metallurgical bond between 2 surfaces, in this case, two MLCCs

Why U2J?

We designed the solution for our customer using our U2J ceramics because of its Class 1 properties. Our U2J ceramic capacitors are extremely stable and retain over 99% of nominal capacitance at full rated voltage. When referenced to ambient temperature, U2J ceramic capacitors provide a predictable and linear change in capacitance. Additionally, U2J ceramic capacitors extend the available capacitance of Class 1 MLCCs into a range previously only available to Class II dielectric materials such as X5R and X7R. Combined with KONNEKT™ packaging technology, this little SMD offers bulk capacitance with extremely high ripple current capability.

Ripple current measurements performed at 85°C with a peak capacitor temperature of 95°C. Samples mounted to heat sink with no forced air cooling. Maximum ambient and self heating cannot exceed 125°C

Ripple current measurements performed at 85°C with a peak capacitor temperature of 95°C. Samples mounted to heat sink with no forced air cooling. Maximum ambient and self-heating cannot exceed 125°C.

Positive Results

This KONNEKT™ U2J solution was designed into a resonant converter (along with our power inductor technology) that resulted in a 98.92% conversion efficiency (650 W), which is critical for to maintain their low operating costs. We have received nothing but praise over this solution and will look to release more products utilizing this technology into the market. Typical applications for this product include wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems, data centers, and switched tank converters.

 

 

Related

Recent Posts

TDK B3201 series Y1 film safety capacitors with rectangular cases and parallel wire leads

TDK Introduces Y1 Film Safety Capacitors for 500 V AC EMI Filtering

21.10.2026
7
Littelfuse C&K SDE surface-mount DIP switches with gull-wing terminals and top-mounted actuators

Littelfuse C&K SDE End-Stackable SMT DIP Switches

21.10.2026
1
Conceptual illustration of a Murata NCU01 surface-mount NTC thermistor beside densely arranged electronic components

Murata World First 008004 NTC Thermistors for Temperature Sensing

20.10.2026
13
Modelithics COMPLETE+3D v26.4 library for RF passive-component and 3D electromagnetic simulation in Keysight ADS/RFPro

Modelithics COMPLETE+3D v26.4 Expands RF Models and 3D Workflows

19.10.2026
10
Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
55
Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

15.10.2026
27
TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

TDK X Series SMD Varistors for Industrial Transient Protection

14.10.2026
13
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
87
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
33

Upcoming Events

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

Oct 28
13:00 - 14:00 CDT

Inductor Design in a Multi-Phase Buck Converter

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Thermistor Basics: NTC and PTC Selection Guide

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved