Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

    Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

    Würth Elektronik Present in IEEE APEC

    Samsung Three Pillars MLCC Strategy for AI Hardware Topology

    Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

    KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

    Earthing Systems and IEC Classification Explained

    Smiths Interconnect invests £2m in Costa Rica electronics plant

    Kyocera Offers Small SAW Filters for IoT RF Modules

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

    Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

    Würth Elektronik Present in IEEE APEC

    Samsung Three Pillars MLCC Strategy for AI Hardware Topology

    Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

    KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

    Earthing Systems and IEC Classification Explained

    Smiths Interconnect invests £2m in Costa Rica electronics plant

    Kyocera Offers Small SAW Filters for IoT RF Modules

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    2026 Power Magnetics Design Trends: Flyback, DAB and Planar

    Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power

    Calculating Resistance Value of a Flyback RC Snubber 

    One‑Pulse Characterization of Nonlinear Power Inductors

    Thermistor Linearization Challenges

    Coaxial Connectors and How to Connect with PCB

    PCB Manufacturing, Test Methods, Quality and Reliability

    Transformer Behavior – Current Transfer and Hidden Feedback

    Choosing the Right Capacitor: The Importance of Accurate Measurements

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • DossiersNew
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Low Inductance, Direct Power DC Bus for Electric Drive Systems

17.4.2020
Reading Time: 4 mins read
A A

Recently, a team at Sandia National Laboratories developed and patented an interesting approach to DC power bus for electrical vehucles with low resistance, low inductance but also sufficient capacitance to smooth out voltage ripple.

As DC currents increase along with switching frequencies in applications such as electric vehicles and hybrid electric vehicles, the performance demands on the DC power bus go beyond just the IR drop (i.e. voltage drop) and thermal considerations. That bus must now have very low inductance at higher frequencies into the hundreds of kilohertz, driven by design demands and the increased use of wide bandgap devices (WBG) represented by silicon carbide (SiC) and gallium nitride (GaN) switches.

RelatedPosts

Molex Extends Cardinal Multi‑Port Coax Assemblies to 145 GHz for AI and 6G Test

Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

Würth Elektronik Present in IEEE APEC

The bus must have low resistance and low inductance but also sufficient capacitance to smooth out voltage ripple. Unfortunately, the same capacitors used for that second attribute are detrimental to the first one due to their interconnect and internal parasitics. Different approaches can be used to try to the multiple conflicting goals, in addition to simply adding more bulk capacitance.

Sandia National Laboratories design uses a layered, PC board-like construction with two metal planes separated by a polymer dielectric to provide “planar” capacitance, Figure 1.

Fig. 1. The power bus looks like a PC board but with a polymer dielectric rather than glass-epoxy, so it functions as a planar capacitor. (Source: Sandia National Laboratories)

This base capacitance is boosted by a large number (in the hundreds) of small multilayered ceramic capacitors (MLCCs) — rather than the customary electrolytic or film capacitors — connected between the planes using standard PC board vias, Figure 2.

Fig. 2. The top and bottom views of the assembled board show the large number of MLCC devices as well as the large, uninterrupted “ground” plane. (Source: Sandia National Laboratories)

This approach provides both electrical and thermal benefits. The spread-out placement of so many capacitors reduces shunt impedance to high-frequency current components, and the flat ceramic capacitors can tolerate higher temperatures and support better airflow. There are other benefits as well. In existing applications, the positive and negative (often called ground) rails use bus bars, and these are separated by a large area; as the magnetic field lines cross this larger area, there is a higher effective inductance due to the large current loop. The Sandia Laboratories plate-based approach greatly reduces the inductance by decreasing the area of the current loop.

Their prototype board used 2-ounce cladded PC-board material and measured about 6 × 11 × 0.062 inches thick (150 × 280 × 1.6 mm). It was populated with 336 0.15 µF/1000 V MLCC devices (with X7R dielectric and AEC – Q200 qualified, for automotive use). Total capacitive was 50.4 µF, which their models and simulations indicated would be sufficient to keep ripple below a target value at 100 kHz.

In addition to extensive modeling, they tested this design from 100 Hz to 10 MHz with an impedance-measurement instrument, Figure 3, and those results closely matched their model. They also compared their results to an available model of a bus used in a similar way in a Toyota Prius. Their bus had somewhat superior performance, was physically smaller, and could withstand higher temperatures.

Fig. 3. The test result of impedance versus frequency showed the performance of the simulated and physical units tracked closely and was better than the existing bus in a Toyota Prius. (Source: Sandia National Laboratories)

Summary

The low-inductance DC power bus demonstrates substantial reductions in parasitic inductance over conventional DC link systems by using a printed circuit board and carefully controlled capacitor placement to maximize planar capacitance. Utilizing ceramic rather than standard electrolytic or film capacitors helps to achieve higher operating temperatures and improved thermal management. Parallel capacitor placement provides low shunt impedance to high-frequency current components and smooths current spikes created by switching operations. Beyond electric vehicle drive systems, this system may be relevant in electric drive applications where high-frequency switching and/or high temperature operations are desired.

Benefits

  • Reduced parasitic inductance
  • High frequency operation (>100 kHz) 
  • High temperature operation and improved thermal management 
  • Increased power density with reduced overall size 
  • Supports WBG devices 
  • May be fabricated with simple PCB assembly methods

Applications and Industries

  • Automotive 
  • Electric drive systems / electric vehicles 
  • High frequency switching 
  • Grid-tied power systems 
  • Geothermal 
  • Oil and gas

Related

Source: Sandia National Laboratories

Recent Posts

Samsung Launches Worlds First Automotive 47uF 4V MLCC in 0805 Size

24.2.2026
15

Würth Elektronik Present in IEEE APEC

24.2.2026
11

Samsung Three Pillars MLCC Strategy for AI Hardware Topology

24.2.2026
26

Bourns Releases High Clearance Transformer for Isolated DC/DC Supplies

24.2.2026
8

KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series

24.2.2026
16

Bourns Unveils High Volt GDT for High‑Energy Surge Protection

23.2.2026
3

TDK Releases DC Link Aluminum Capacitors for EV On‑Board Chargers

23.2.2026
12

Capacitech C-Link Supercapacitors for AI Data Center Voltage Spikes Mitigation

23.2.2026
22

Bourns Extends Multilayer Chip Inductors Offer for RF and Wireless Designs

20.2.2026
14

Upcoming Events

Mar 3
16:00 - 17:00 CET

Cybersecurity at the Eleventh Hour – from RED to CRA – Information and Discussion

Mar 21
All day

PSMA Capacitor Workshop 2026

Apr 21
16:00 - 17:00 CEST

Heatsink Solutions: Thermal Management in electronic devices

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC Manufacturers Consider Price Increase as AI Demand Outpaces Supply

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant and DF of Plastic Materials?

    4 shares
    Share 4 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCC Case Sizes Standards Explained

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version