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Message of the day from Taiwan: passive components demand picking up

4.9.2019

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    3D Systems to Deliver 3D Printed RF Components for Satellite Applications

    Kyocera to Build its Largest Plant in Japan for Crystals and Semiconductor Packages

    TDK to Build New Automotive MLCC Production Plant in Japan

    Supercapacitors Assist Diesel Locomotives Start At Winter Conditions

    Bourns Releases High Current Shielded Power Inductor in Compact Size

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Message of the day from Taiwan: passive components demand picking up

4.9.2019
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Source: DigiTimes news

Taiwanese passive component suppliers have seen inventory approach healthy levels after two to three quarters of correction.

RelatedPosts

TAIYO YUDEN Launches Wire-Wound Automotive Power Inductors

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But while their third-quarter shipments are expected to be robust, they remain cautious about the last quarter of the year. In the handset market, Asustek Computer might have been over-cautious about sales of its new gaming smartphone. Asustek reportedly has seen tight supply of its ROG Phone II, as it had failed to place sufficient orders with its handset OEM partner prior to launch.

Passive component demand picking up: Demand for MLCCs, chip resistors, as well as other passive components, has started picking up substantially, according to industry sources in Taiwan.

Asustek to account for over 50% of global gaming smartphone shipments in 2019: Asustek is expected to ship over 400,000 units of its ROG Phone II in 2019, accounting for over 50% of the global gaming smartphone shipments in the year, according to industry sources.

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