Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

    Vishay Thin Film Chip Resistors Combine up to 50 GHz Operation with High Power Density

    Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

    KYOCERA AVX Adds 0201 C0G RF MLCCs to KGU Ultra-Low-ESR Capacitor Series

    Vishay Extends High-Current Common-Mode Chokes with 30 A EMI Filtering up to 150 °C

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Panasonic quits semiconductor business

29.11.2019
Reading Time: 2 mins read
A A

OSAKA, Japan-Panasonic Corporation announced that it will transfer the semiconductor business mainly operated by Panasonic Semiconductor Solutions Co., Ltd., which is a 100% consolidated subsidiary company of Panasonic Equity Management Japan G.K. a 100% consolidated subsidiary company of the Company, to Nuvoton Technology Corporation, a Taiwan-based semiconductor company under the umbrella of Winbond Electronics Corporation group, and enter into the Stock and Asset Transfer Agreement with this company.

After 67 years Matsushita/Panasonic is quitting the chip industry. Between 1985 and 1990 the company was a top ten player. Now it is to be sold to Nuvoton Technology of Taiwan which is 61% owned by Winbond. Nuvoton is paying $250 million for the unit which designs power-management chips and sensors for smartphones, cars and security cameras. For its FY ending in March, Panasonic Semiconductor made a loss of $215 million on sales of $840 million. Earlier this year, in May, Panasonic sold its discretes business – which makes diodes and transistors – to Rohm. In 2015 the company put its SoC design business into a join venture with Fujitsu called Socionext.

RelatedPosts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

Knowles Cornell Dubilier 105C Flatpack Aluminum Electrolytic Capacitors Target Low-Profile High-Density Power Designs

Background and Purpose

The semiconductor business of the company has shifted from the AV area to the automotive and industrial area over the last few years. The Company has positioned the “Sensing” technologies such as image sensors, and the “LiB Application” technologies such as IC for battery management and MOSFET for LiB battery circuits protection as the focus areas, and the Company has aimed to grow its business by consolidating resources in these areas.

In the meantime, in April 2014, the Company transferred the semiconductor wafer production process of the Hokuriku Plants (Uozu, Tonami, Arai) to the joint venture company formed with Tower Semiconductor Ltd., an Israel based foundry company. Furthermore, in June 2014, the Company transferred its semiconductor assembly plants in Singapore, Indonesia and Malaysia to UTAC Manufacturing Services Ltd. having its headquarter in Hong Kong.

The Company has been strengthening its competitiveness by becoming an asset light company, consolidating and eliminating its offices and production bases in both Japan and overseas for the mitigation of business risks. However, the competitive environment surrounding the semiconductor business has become extremely severe due to aggressive expansion of competitors, huge investments in the focused area, and industry reorganization through M&A.

In such an environment, the Company has come to believe that the even stronger business operation and the continuous investment is critical in order to achieve a sustained growth and expansion of the semiconductor business. Accordingly, it has concluded that the best option would be to transfer the business to Nuvoton, which highly appreciates the Company’s accumulated technical and product capabilities and therefore has a potential to lead stable growth by leveraging those capabilities.

Related

Source: Panasonic

Recent Posts

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

4.9.2026
4

Samsung Electro-Mechanics Secures KRW 1.0722 Trillion AI Server MLCC Supply Contract

3.9.2026
32

Connector Industry Performance Accelerates Through Mid-2026

31.8.2026
37

Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

20.8.2026
125

Advanced Electronics Markets Reshape Capacitor Demand for 2026/2027

20.8.2026
126

ECIA Industry Pulse Index Cools After Five-Year High

10.8.2026
101

AI Data Centers Push Aluminium Capacitor Prices Higher

30.7.2026
477

DigiKey Ads 27,000 New In-Stock Parts and 104 Additional Suppliers in Q2 2026

30.7.2026
36

June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

28.7.2026
273

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved