Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Updates REDEXPERT DC‑DC Converter Designer

    Stackpole Unveils High-Temperature Automotive Thick Film Chip Resistors for Harsh Environments

    Molex Presents MiniMix Hybrid Power and Signal Connectors for Compact Humanoid Joints

    Bourns Releases Custom SiC AFE/PFC Power Inductor for High‑Voltage Designs

    Littelfuse Releases Toggle Safety Covers for Reliable Control Panels

    Bourns Expanded Blend‑Balance Guitar Potentiometers Resistance Range

    TDK Extends Vibration‑Resistant Axial Aluminum Capacitors for Compact DC‑links

    YAGEO Releases SMD 0402 Pt Temperature Sensors for Space‑Constrained Designs

    Bourns Introduces Automotive Wide Terminal Metal Foil Current Sense Resistors for High‑Reliability Designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Würth Elektronik Updates REDEXPERT DC‑DC Converter Designer

    Stackpole Unveils High-Temperature Automotive Thick Film Chip Resistors for Harsh Environments

    Molex Presents MiniMix Hybrid Power and Signal Connectors for Compact Humanoid Joints

    Bourns Releases Custom SiC AFE/PFC Power Inductor for High‑Voltage Designs

    Littelfuse Releases Toggle Safety Covers for Reliable Control Panels

    Bourns Expanded Blend‑Balance Guitar Potentiometers Resistance Range

    TDK Extends Vibration‑Resistant Axial Aluminum Capacitors for Compact DC‑links

    YAGEO Releases SMD 0402 Pt Temperature Sensors for Space‑Constrained Designs

    Bourns Introduces Automotive Wide Terminal Metal Foil Current Sense Resistors for High‑Reliability Designs

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Panasonic quits semiconductor business

29.11.2019
Reading Time: 2 mins read
A A

OSAKA, Japan-Panasonic Corporation announced that it will transfer the semiconductor business mainly operated by Panasonic Semiconductor Solutions Co., Ltd., which is a 100% consolidated subsidiary company of Panasonic Equity Management Japan G.K. a 100% consolidated subsidiary company of the Company, to Nuvoton Technology Corporation, a Taiwan-based semiconductor company under the umbrella of Winbond Electronics Corporation group, and enter into the Stock and Asset Transfer Agreement with this company.

After 67 years Matsushita/Panasonic is quitting the chip industry. Between 1985 and 1990 the company was a top ten player. Now it is to be sold to Nuvoton Technology of Taiwan which is 61% owned by Winbond. Nuvoton is paying $250 million for the unit which designs power-management chips and sensors for smartphones, cars and security cameras. For its FY ending in March, Panasonic Semiconductor made a loss of $215 million on sales of $840 million. Earlier this year, in May, Panasonic sold its discretes business – which makes diodes and transistors – to Rohm. In 2015 the company put its SoC design business into a join venture with Fujitsu called Socionext.

RelatedPosts

Würth Elektronik Updates REDEXPERT DC‑DC Converter Designer

Stackpole Unveils High-Temperature Automotive Thick Film Chip Resistors for Harsh Environments

Molex Presents MiniMix Hybrid Power and Signal Connectors for Compact Humanoid Joints

Background and Purpose

The semiconductor business of the company has shifted from the AV area to the automotive and industrial area over the last few years. The Company has positioned the “Sensing” technologies such as image sensors, and the “LiB Application” technologies such as IC for battery management and MOSFET for LiB battery circuits protection as the focus areas, and the Company has aimed to grow its business by consolidating resources in these areas.

In the meantime, in April 2014, the Company transferred the semiconductor wafer production process of the Hokuriku Plants (Uozu, Tonami, Arai) to the joint venture company formed with Tower Semiconductor Ltd., an Israel based foundry company. Furthermore, in June 2014, the Company transferred its semiconductor assembly plants in Singapore, Indonesia and Malaysia to UTAC Manufacturing Services Ltd. having its headquarter in Hong Kong.

The Company has been strengthening its competitiveness by becoming an asset light company, consolidating and eliminating its offices and production bases in both Japan and overseas for the mitigation of business risks. However, the competitive environment surrounding the semiconductor business has become extremely severe due to aggressive expansion of competitors, huge investments in the focused area, and industry reorganization through M&A.

In such an environment, the Company has come to believe that the even stronger business operation and the continuous investment is critical in order to achieve a sustained growth and expansion of the semiconductor business. Accordingly, it has concluded that the best option would be to transfer the business to Nuvoton, which highly appreciates the Company’s accumulated technical and product capabilities and therefore has a potential to lead stable growth by leveraging those capabilities.

Related

Source: Panasonic

Recent Posts

AI Data Centers Push Aluminium Capacitor Prices Higher

30.7.2026
166

DigiKey Ads 27,000 New In-Stock Parts and 104 Additional Suppliers in Q2 2026

30.7.2026
25

June 2026: AI Demand Pushes Japanese and Korean MLCC Makers to Five‑Year Shipment High

28.7.2026
183

July 2026 Interconnect, Passives and Electromechanical Components Market Insights

27.7.2026
113

LeanBOM: Practical Cross‑Technology Capacitor Search by Real Working Conditions

14.7.2026
143

In the Age of AI, Every Watt Counts: Implications for Components

13.7.2026
163

ECIA Industry Pulse June 2026 Reaches Five‑Year High

1.7.2026
140

YAGEO Announces July 2026 Capacitor Price Increase

1.7.2026
1.3k

MLCCs in the Age of AI: Q2 2026 Market Tightness

30.6.2026
1.1k

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site