Passive Component Embedding in Printed Circuit Boards for Space Applications
Posted On 3.10.2017
source: CMST IMEC and Ghent University, AT&S AG, QinetiQ Space, ESA/ESTEC European Space Agency, EPCI e-Symposium
Abstract:
The objective of this study was to investigate the suitability of embedding passive components in printed circuit boards for space applications. To achieve this goal, an overview of available technologies for component embedding was provided along with their strongpoints and challenges with respect to space projects.
The direct embedding of passive components in printed circuit boards was evaluated in depth to determine its performance and reliability. Characterization and reliability investigation were performed using a dedicated test board containing embedded resistors and capacitors.
A Spacecraft Interface Module (SIM) board, part of the Advanced Data and Power Management System developed by QinetiQ Space, was redesigned using embedded passive components to demonstrate the capabilities of the technology. Procurement of components for embedding and other logistic aspects were evaluated in this exercise. The outcome of this study aids ESA in determining which projects can benefit from this technology and what procedures for procurement and validation need to be followed.
Title: Passive Component Embedding in Printed Circuit Boards for Space Applications
Authors: Maarten Cauwe (1), Johan De Baets (1), Gerhard Schmid (2), Christian Galler (2), Johan De Hert (3), Steven De Cuyper (3), Denis Lacombe (4)
Organisations: (1) CMST IMEC and Ghent University, (2) AT&S AG, (3) QinetiQ Space, (4)ESA/ ESTEC European Space Agency
Symposium: 1st PCNS Passive Components Networking Days, 12-15th Sep 2017, Brno, Czech Republic
Reference: article 1.3., PCNS2017 Proceedings Pg.29-34
ISBN: 978-80-905 768-8-9
e-Sessions Applications: Aerospace
e-Sessions Scope Components: Capacitors, Resistors
e-Sessions Topics: Quality & Reliability, Technology
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