Source: CMSE news
One of the core focus of this year’s CMSE 2019, April 16-18th, 2019 Los Angeles, California, USA are discussion and trainings on high reliability passive components. A full day comprehensive Passive Component Reliability Workshop course will be presented in three sessions covering capacitors, inductors and resistors by industry fellow lecturers.
The training class on Passive Component Reliability Workshop includes: (pdf flyer download here):
Tantalum & Electrolytic Capacitors (Dr. Yuri Freeman, Kemet), MLCC & EMI filters (John Marshall, AVX) and SuperCapacitors, Film & Thin film capacitors (Chris Reynolds, AVX).
Students will gain an understanding of capacitor construction and how performance characteristics are affected by time, temperature, voltage and frequency. End applications are discussed along with reliability expectations, common failure modes and de-rating methods for increased lifetime performance. Processing guidelines are presented and the availability and use of simulation models is shown.
The Inductor performance, reliability and selection session will be taught by (Scott Harris, Vanguard Electronics). This course will outline the basics of magnetics from an RF and power inductor and transformers point of view. Material performance, core types and properties along with wire types, winding techniquesand patterns are shown relative to their impact upon performance. Reliability predictions and levels are discussed along with a preview of emerging technologies and device simulation techniques.
Resistor theory, performance & reliability will be taught by (Bryan Yarborough,Vishay). Resistor types and materials will be discussed relative to component performance. Device characteristics and performance relative to time, temperature, frequency and power are discussed. Heat transfer means and noise characteristics outlined. Reliability expectations and recommended applications are given.
The CMSE Program At a Glance:
Copper Wirebonding – A Technology Review
by Mukul Saran, Texas Instruments
Advanced Integrated Circuit Packaging and Reliability Issues
by Richard Rao, Ph.D., Microchip Technology, Inc.
Moisture in Microelectronics… Volatiles Control in Hermetic Electronic Components
by Thomas Green, TJ Green Associates LLC
and Robert Lowry, Electronic Materials Consultant
Passive Component Reliability Workshop
by Dr. Yuri Freeman, Kemet
John Marshall, AVX
Chris Reynolds, AVX
Scott Harris, Vanguard Electronics
MLCC Shortages: FY 2019 Tier-To-Tier replacement Strategies and Alternative Reference Design Solutions
by Dennis Zogbi, Paumanok Publications, Inc.
Flexibility and Innovation in Military Systems
by Jonathan Ahlbin, MDA
Mil/Aerospace Talent Gap… How to Attract and Retain Young Engineers (1.5 Hrs)
Rick Rodriguez, Component Engineering Mgr., Raytheon Missile Systems
Roz Morrison, HR Manager, Raytheon Missile Systems
Dr. Michael Hamilton, Auburn University, Director, Alabama Micro/Nano Science & Technology Center
Tom Green, TJ Green Associates LLC
Session #1: Passive Components for Military and High Rel Space Systems
Session #2: Advanced Packaging for Military and Aerospace
Session #3: RF and Power GaN Technology
Session #4: Component Technology Reliability Issues and the Trusted Supply Chain
CMSE homepage link is here.
The direct link to detailed Advanced Program is here.