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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

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    Stackpole RNAN aluminium nitride thin-film chip resistors in 0603, 0805, 1206 and 2512 package sizes for precision high-power electronics

    Stackpole RNAN AlN Thin-Film Resistors Reach 6 W

    binder angled M12-A midmount panel-mount PCB connector for centric board mounting, showing compact front-facing industrial connector geometry

    binder Adds Midmount M12-A PCB Connectors for Slim Sensors

    Bourns PST065 and PST10 Series compact incremental potentiometers with hollow shafts for rotary position feedback

    Bourns Expands Compact Incremental Potentiometer Offering

    Wk 35 Electronics Supply Chain Digest

    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

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    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

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Researchers Achieved Ultrahigh Capacitive Energy Density in Ion-Bombarded Relaxor Ferroelectric Dielectric Films for Next Generation of Capacitors

3.7.2020
Reading Time: 2 mins read
A A
Polarization-electric field hysteresis loops obtained from a PbZr0.2Ti0.8O3 thin film inthe  (a)  as-grow  state,  and  (b)  after  high-energy helium-ion  bombardment; credit: S.Sahar, UC Berkeley

Polarization-electric field hysteresis loops obtained from a PbZr0.2Ti0.8O3 thin film inthe (a) as-grow state, and (b) after high-energy helium-ion bombardment; credit: S.Sahar, UC Berkeley

Researchers at Berkeley University of California reached energy storage densities as high as ~133 joules per cubic centimeter with efficiencies exceeding 75% by high-energy ion bombardment of relaxor ferroelectric thin films.

Defect-enhanced energy storage

Dielectric capacitors are vital components of electronics and power systems. The thin-film materials of which capacitors are composed are usually optimized by changing the material composition. However, Kim et al. found that postprocessing an already effective thin-film dielectric by high-energy ion bombardment further improved the material because of the introduction of specific types of defects that ultimately improved the energy storage performance. The results suggest that postprocessing may be important for developing the next generation of capacitors.

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Abstract

Dielectric capacitors can store and release electric energy at ultrafast rates and are extensively studied for applications in electronics and electric power systems. Among various candidates, thin films based on relaxor ferroelectrics, a special kind of ferroelectric with nanometer-sized domains, have attracted special attention because of their high energy densities and efficiencies.

We show that high-energy ion bombardment improves the energy storage performance of relaxor ferroelectric thin films. Intrinsic point defects created by ion bombardment reduce leakage, delay low-field polarization saturation, enhance high-field polarizability, and improve breakdown strength. We demonstrate energy storage densities as high as ~133 joules per cubic centimeter with efficiencies exceeding 75%. Deterministic control of defects by means of postsynthesis processing methods such as ion bombardment can be used to overcome the trade-off between high polarizability and breakdown strength.

Science  03 Jul 2020:
Vol. 369, Issue 6499, pp. 81-84
DOI: 10.1126/science.abb0631

Related

Source: Science mag

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