Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Transformer Losses and Thermal Design: Modelling and Validation

    DMASS Europe Q3 2026 electronic component distribution market overview

    European Component Distribution Jumps 42.7% in Q3 2026

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Researchers Demonstrated New Layer-by-Layer Fabrication Method for Polypropylene-based Nanocomposite Capacitors

9.11.2022
Reading Time: 4 mins read
A A

Researchers from SDU Southern Denmark University in Sonderborg, Denmark demonstrated a novel layer-by-layer technique to fabricate nano-scale polypropylene for precise control of nanocomposite capacitor dielectric morphologies in metallized film capacitors.

Nanocomposite dielectrics are an increasingly important area of innovation in capacitor research as an avenue to improve capacitive energy density, electrical breakdown strength, and temperature stability of devices.

RelatedPosts

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

800 VDC AI Data Centers Reshape Capacitor Demand for 2027

In such devices, morphology control is critical in order to optimize electrical field distribution in the device and to prevent the clustering of nanoparticles lowering breakdown voltages. However, this is difficult to achieve with large-scale fabrication techniques, such as melt extrusion and stretching, as melt processing can induce clustering and offers few possibilities for fine structure control of length scales below 1 µm.

Layer-by-layer fabrication offers a potential bottom-up alternative whereby dielectrics are printed by successive depositions of ultra-thin layers of a room-temperature-stable polymer ink. This would allow fine thickness and morphology control and could easily be adapted to industrial-scale printing techniques, like roll-to-roll slot-die coating. This study explores this technique by developing polypropylene-based inks in industry-friendly solvents that are then used to fabricate capacitor devices. A gel ink was able to be used to deposit ultrathin (sub-200 nm) layers of mostly amorphous polypropylene with high reproducibility.

Capacitors based on these polypropylene layers perform commensurate with commercial devices, exhibiting excellent self-clearing and breakdown performance. Successive depositions of the ink were also demonstrated, allowing the fabrication of devices with finely tuned thicknesses and capacitances, as well as nanocomposite capacitors. This demonstrates the viability of layer-by-layer dielectric printing at large scale and paves the way for commercial ultra-thin conformable polypropylene capacitors, multi-component sandwich nanocomposite capacitors, and multilayer polypropylene capacitors, as well as brand new possibilities in dielectrics research.

Research Highlights

  • A novel technique to fabricate capacitors with nano-scale layer-by-layer printing
  • Polypropylene gel inks were used to successively print layers as thin as 200 nm
  • Layer thickness is easily controllable, and the capacitance is highly predictable
  • Incorporation of BaTiO3 nanoparticles was demonstrated in a structured dielectric
  • Presents pathway to the commercial printing of structured nanocomposite capacitors
Fig. 1. A schematic of the proposed LBL capacitor fabrication process. (1) the process begins with a metal foil (e.g. aluminium) which will serve as bottom electrode and substrate. (2) the first coating of dielectric ink is applied to the metal foil using a high-volume printing technique, such as R2R slot-die coating, which sets to form the first dielectric layer (3). (4) successive coatings are made with the dielectric ink to build up the thickness of the dielectric layer before the top electrode is deposited. Depending on the combinations of inks and the sequence used, designs such as sandwich nanocomposite capacitors (5), ultrathin polypropylene capacitors (6), and multilayer polypropylene capacitors (7) can be printed.

Conclusion

This study detailed the production of room-temperature-stable polypropylene inks in industry-friendly solvents with the goal of demonstrating LBL printing of a polymer dielectric capacitor. The ink was produced by high-temperature emulsification and was gel based – exhibiting no evidence of nanoparticle formation. The ink was able to reproducibly deposit ultra-thin layers of largely amorphous polypropylene, which performs consistent with commercial polypropylene as a dielectric material, particularly with regard to self-clearing capabilities. Furthermore, successive depositions of the gel ink were shown to be possible and to predictably build up the thickness of the dielectric with commensurate changes in the capacitance of the device, and the fabrication of structured nanocomposite capacitors with improved performance was demonstrated.

This study has, therefore, demonstrated a viable new fabrication method for polypropylene-based polymer and nanocomposite capacitors based on a layer-by-layer strategy. Generalisation to other thermoplastic polymers is likely possible, however the self-clearing capability of polypropylene makes it an attractive candidate for continued research. With some optimisation, this technique can be easily scaled to large-scale fabrication via the use of existing commercial printing techniques, allowing the commercialisation of a range of new device structures and fine morphology control in nanocomposite dielectrics. Furthermore, LBL dielectric fabrication can act as a platform for future research to explore a wide variety of different dielectric structures with precision – allowing both confirmation of theoretical models and the development of new dielectric materials.

Full paper can be viewed and downloaded at: https://doi.org/10.1016/j.pedc.2022.100025

Related

Source: Science Direct

Recent Posts

Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

6.11.2026
3
Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

6.11.2026
2
Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

800 VDC AI Data Centers Reshape Capacitor Demand for 2027

6.11.2026
2
Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

5.11.2026
9

Transformer Losses and Thermal Design: Modelling and Validation

4.11.2026
19

AI Server Power Supply Efficiency Under Pulsed Loads

4.11.2026
11
Würth Elektronik ICS PowerBusbar PF vertical PCB busbars with flat metal bodies and press-fit pins.

Würth PowerBusbar PF: Vertical Press-Fit Busbars for PCBs

4.11.2026
24
Schematic diagrams illustrating the physical model of the stripline microinductor.

Stripline Microinductors with Nickel–Iron Oxide Cores

4.11.2026
9
Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

3.11.2026
34

Upcoming Events

Nov 24
16:00 - 17:00 CET

Select the Correct Components for Your DC/DC Converter

Dec 1
16:00 - 17:00 CET

Developing low-noise mixed-signal systems

Dec 8
16:00 - 17:00 CET

WE-CCMF: Design Principles, Layout Guidelines and Measurement Results for High-Speed EMI Filtering

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • September 2026 Interconnect, Passives and Electromechanical Components Market Insights

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved