In this article Samtec introduces all forms of high-speed communication suitable for Datacom and AI applications, whether over printed circuit boards, copper cables or optical fiber.
The rise of Artificial Intelligence (AI) has made headlines with groundbreaking advancements in data analysis, pattern recognition, robotic automation, and perceptual awareness. As AI finds applications beyond computer screens and into the wider world, AI-enabled applications demand secure datacom connections that can deliver high performance in demanding environments.
AI is rapidly becoming an indispensable tool for a growing number of real-world applications. Publicly accessible AI tools are provided by data centers and delivered through web browsers. Modern embedded computing utilizes system-on-module (SoM) and computer-on-module (CoM) architectures to achieve ultra-low latency and high speed at the point of need. AI systems consist of multiple SoMs and CoMs, and many of these new systems require increased speed and high-density footprints.
Within data centers, AI applications drive the development of new system architectures and topologies that enhance speeds, bandwidth, and frequencies. These architectures must be adaptable to quickly respond to the increasing demands generated by the growth of AI. Emerging application-specific AI hardware systems necessitate optimized channel performance to support increased data rates.
Samtec is at the forefront of development for all forms of high-speed communication, whether over printed circuit boards, copper cables, or optical fiber. Our comprehensive portfolio of high-performance cables and connectors caters to the bandwidth, scalability, and density demands of the latest generation of AI topologies. We offer high-speed connectors and high-performance cable systems that support the full range of industry-standard form factors, including PCIe® CEM AIC and PECFF.
Samtec has published the Artificial Intelligence Solutions Guide. This valuable resource provides a guide to comprehending some of the cutting-edge architectures optimized for AI and ML applications. Additionally, we explore alternative solutions for delivering high-speed data, encompassing traditional board and mezzanine connectors, copper cabling, and the latest optical technologies. Furthermore, we showcase essential information required for the latest AI systems, including power connectors, test and measurement equipment, and a thorough understanding of the latest standards.
