Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

    Murata Previews SiC Power and AI Sensors at electronica 2026

    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

    Murata Previews SiC Power and AI Sensors at electronica 2026

    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Sintering Atomically Thin Materials with Ceramics Now Possible

28.6.2018
Reading Time: 3 mins read
A A

Source: Newswise article

Newswise — For the first time, researchers have created a nanocomposite of ceramics with a two-dimensional material that opens the door to new designs of nanocomposites with a variety of applications, such as solid-state batteries thermoelectrics, varistors, catalysts, chemical sensors and much more.

RelatedPosts

Samtec Links Automotive Connector Demands to Software-Defined Cars

Panasonic Targets Space Thermal Design at SPCD 2026

Tungsten bronze capacitors combine high κ and thermal stability

Sintering is a method that uses high heat to compact powder materials into a solid form. Widely used in industry, ceramic powders are typically compacted at temperatures of 800 degrees Celsius or higher. Many low-dimensional materials cannot survive at those temperatures.

But a sintering process developed by a team of researchers at Penn State, called the cold sintering process (CSP), can sinter ceramics at much lower temperatures, less than 300 degrees C, saving energy and enabling a new form of material with high commercial potential.

“We have industry people who are already very interested in this work,” said Jing Guo, a post-doctoral scholar working in the group of Clive Randall, professor of materials science and engineering, Penn State. Guo is first coauthor on a paper appearing online today in the journal Advanced Materials. “They are interested in developing some new material applications with this system and, in general, using CSP to sinter nanocomposites.”

The idea of trying to develop a ceramic-2D composite system was the result of a National Science Foundation workshop on the future of ceramics, organized by Dr. Lynnette Madsen, that drew 50 of the top ceramic scientists in the U.S. Yury Gogotsi, a Charles T. and Ruth M. Bach Distinguished University Professor and Director of the  A.J. Drexel Nanomaterials Institute, at Drexel University, heard Randall’s presentation on cold sintering and proposed a collaboration to develop a ceramic composite using a new class of two-dimensional materials, called MXenes, discovered by him and his collaborators at Drexel University.  MXenes, which are carbide and nitride sheets a few atoms thin, possess extreme strength and many of them are excellent metallic conductors.

While it has been known that mixing even a very small amount of 2D materials, such as graphene, into a ceramic can dramatically change its properties, MXene has never been used in ceramic composites. In this work, Guo and Benjamin Legum, Gogotsi’s doctoral student, mixed 0.5-5 percent MXene into a well-known ceramic system called zinc oxide. The metallic MXene coated the ceramic powder and formed continuous two-dimensional grain boundaries, which prevented grain growth, increased the conductivity by two orders of magnitude, transforming semiconducting zinc oxide into a metallic ceramic, and doubled hardness of the final product. The addition of MXene also improved the ability of zinc oxide to transform heat to electricity.

“Ben came here quite frequently to work with Jing, and over time they overcame all of the problems involved with dispersing the 2D MXenes into the zinc oxide and then sintering it,” said Randall. “This opens a whole new world incorporating 2D materials into ceramics.”

Gogotsi added, “This is the first ceramic composite containing MXene. Taking into account that about thirty MXenes with diverse properties are already available, we are opening a new chapter in research on ceramic matrix composites, with potential applications ranging from electronics to batteries and thermoelectrics.”

Guo and Legum are co-first authors on the paper “Cold Sintered Ceramic Nanocomposites of 2D MXene and Zinc Oxide.” Gogotsi and Randall are corresponding authors. Other contributors are Dr. Babak Anasori and undergraduate student Pavel Lelukh from Drexel, and Ke Wang, staff scientist in Penn State’s Materials Research Institute.

The work was supported by the Air Force Research Laboratory and the National Science Foundation.

Featured image: The schematic illustration showing the co-sintering of ceramics and 2D materials using cold sintering processing, and TEM image and energy dispersive spectroscopy (EDS) map of cold sintered 99ZnO-1Ti3C2Tx nanocomposite. The MXene nanosheets are distributed homogeneously along the ZnO grain boundaries, as seen in the TEM image and EDS map. Image credit: MRI/Penn State

 

Related

Recent Posts

Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
6
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
13
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
21
Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

2.10.2026
19
TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

TDK Expanded DC-Link Film Capacitors to Reach +135 °C

2.10.2026
22
Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

Electrification Raises Demands on DC-Link Capacitors

1.10.2026
29
YAGEO Group high-reliability polymer tantalum capacitor portfolio for aerospace and defence power electronics

YAGEO High-Reliability Polymer Tantalum Capacitors for Aerospace

1.10.2026
38
Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

1.10.2026
15
Two Murata LLD three-terminal MLCCs beside a metal ruler, showing beige ceramic bodies and silver-coloured terminals.

Murata Begins Production of 0201 Three-Terminal Low-ESL MLCCs for IC Decoupling

30.9.2026
44

Upcoming Events

Oct 9
18:00 - 19:00 CEST

Edgewater Research 3Q26 Electronic Components Review Outlook Webinar

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved