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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

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    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

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    Wk 34 Electronics Supply Chain Digest

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    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

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Smoltek Published Video Interview with Phil Lessner, CTO at Yageo, on Future of Thin CNF-MIM Capacitor Collaboration

2.6.2023
Reading Time: 2 mins read
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In this video published by Smoltek, Philip Lessner, EVP & CTO at YAGEO Group explains why he and Yageo sees a lot of potential in Smotek’s disruptive carbon nanofiber technology for capacitors and how the CNF-MIM-technology can roll out a wide range of ultra-thin wafer based capacitors that fit very well with the new semiconductor segments Yageo is targeting.

Smoltek Nanotech Holding AB has published a filmed interview with Philip Lessner, Executive VP & Chief Technology Officer at YAGEO Group. YAGEO is a large global manufacturer of passive electronic components, including capacitors for the semiconductor industry, and is collaborating with Smoltek to develop a family of ultra-thin capacitors based on Smoltek’s patent protected CNF-MIM technology.

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In the interview, Phil discusses how YAGEO was made aware of Smoltek’s innovative nanotechnology platform and how this collaboration, to develop ultra-thin capacitors, fits into YAGEO’s total offering. Furthermore, he elaborates on initial indications of interest from potential customers. 

“The project is currently in the joint development phase and the goals for 2023 are to manufacture engineering samples that YAGEO and Smoltek will test for performance. If certain goals are met, the collaboration will move on to the manufacturing qualification phase,” says Phil Lessner, Executive VP & Chief Technology Officer at YAGEO Group.

“We see several advantages with the CNF-MIM technology compared to current silicon-based capacitors. During recent meetings with customers, we also confirmed a strong interest. So, the sooner we can manufacture engineering samples and get them into the hands of customers, the better,” says Phil Lessner.

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Source: Smoltek

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