Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Supercapacitor Manufacturing Breakthrough – Researches Developed Micro-Supercapacitors on Silicon Wafer

10.3.2022
Reading Time: 3 mins read
A A
Micro supercapacitors can increase the lifespan of batteries and reduce their charging time in products like smartphones and electric cars. The image shows a 2 inch wide silicon wafer with integrated micro supercapacitors, manufactured using the CMOS-compatible process developed by Chalmers’ researchers. The wafer can be upscaled to a diameter of 8 inches to fit even more supercapacitor units. source: Chalmers University

Micro supercapacitors can increase the lifespan of batteries and reduce their charging time in products like smartphones and electric cars. The image shows a 2 inch wide silicon wafer with integrated micro supercapacitors, manufactured using the CMOS-compatible process developed by Chalmers’ researchers. The wafer can be upscaled to a diameter of 8 inches to fit even more supercapacitor units. source: Chalmers University

Researchers at Chalmers University of Technology, Sweden, have developed a method that represents a breakthrough for how supercapacitors can be produced. Integrated micro-supercapacitors have been manufactured on silicon wafer using the CMOS-compatible process.

Micro-supercapacitors could revolutionise the way we use batteries by increasing their lifespan and enabling extremely fast charging. Manufacturers of everything from smartphones to electric cars are therefore investing heavily into research and development of these electronic components.

RelatedPosts

Researchers Introduced 300°C High Temperature Capable Solid Electrolyte Supercapacitors

Selection Guide for EMI Suppression Polypropylene Film Capacitors KEMET Tech Note

Hybrid vs EDLC Supercapacitors; Vishay Video

​“When discussing new technologies, it is easy to forget how important the manufacturing method is, so that they can actually be commercially produced and be impactful in society. Here, we have developed methods that can really work in production,” explains Agin Vyas, doctoral student at the Department of Microtechnology and Nanoscience at Chalmers University of Technology and lead author of the article.

Supercapacitors consist of two electrical conductors separated by an insulating layer. They can store electrical energy and have many positive properties compared to a normal battery, such as much more rapid charging, more efficient energy distribution, and a much greater lifespan without loss of performance, with regards to the charge and discharge cycle. When a supercapacitor is combined with a battery in an electrically powered product, the battery life can be extended many times –up to 4 times for commercial electric vehicles. And whether for personal electronic devices or industrial technologies, the benefits for the end consumer could be huge.

“It would of course be very convenient to be able to quickly charge, for example, an electric car or not have to change or charge batteries as often as we currently do in our smartphones. But it would also represent a great environmental benefit and be much more sustainable, if batteries had a longer lifespan and did not need to be recycled in complicated processes,” says Agin Vyas.

Manufacturing a big challenge

But in practice, today’s supercapacitors are too large for many applications where they could be useful. They need to be about the same size as the battery they are connected to, which is an obstacle to integrating them in mobile phones or electric cars. Therefore, a large part of today’s research and development of supercapacitors is about making them smaller – significantly so Agin Vyas and his colleagues have been working with developing ‘micro’ supercapacitors. These are so small that they can fit on the system circuits which control various functions in mobile phones, computers, electric motors and almost all electronics we use today. This solution is also called ‘system-on-a-chip’.

One of the most important challenges is that the minimal units need to be manufactured in such a way that they become compatible with other components in a system circuit and can easily be tailored for different areas of use. The new paper demonstrates a manufacturing process in which micro-supercapacitors are integrated with the most common way of manufacturing system circuits (known as CMOS).

“We used a method known as spin coating, a cornerstone technique in many manufacturing processes. This allows us to choose different electrode materials. We also use alkylamine chains in reduced graphene oxide, to show how that leads to a higher charging and storage capacity,” explains Agin Vyas.

“Our method is scalable and would involve reduced costs for the manufacturing process. It represents a great step forward in production technology and an important step towards the practical application of micro-supercapacitors in both everyday electronics and industrial applications.”

A method has also been developed for producing micro-supercapacitors of up to ten different materials in one unified manufacturing process, which means that properties can be easily tailored to suit several different end applications.

Results

In this article, we have demonstrated a scalable fabrication method to investigate the properties of CMOS compatible micro-supercapacitors. The micro-supercapacitors show capacitance of 0.1 mF cm−2 at 20 mV s−1, energy density of 54 μJ cm−2 at the same scan rate and power density of 0.3 mW cm−2.

Read the full study

Alkyl-Amino Functionalized Reduced-Graphene-Oxide–heptadecan-9-amine-Based Spin-Coated Microsupercapacitors for On-Chip Low Power Electronics in the journal Physica Status Solidi B.
https://doi.org/10.1002/pssb.202100304

The research has been funded by: EU Horizon 2020 (GreEnergy), Vinnova, SAAB.

Related

Source: Chalmers University

Recent Posts

Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

15.10.2026
12
Supercapacitor LSM production

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

13.10.2026
71
Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
23
Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

Toray Film Capacitor Enables 150°C Inverter Operation

9.10.2026
47
Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
56
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
34
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
31
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
41
TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

TDK Expanded DC-Link Film Capacitors to Reach +135 °C

2.10.2026
56

Upcoming Events

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

Oct 27
16:00 - 17:00 CET

Power Inductor technologies

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved