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TAIYO YUDEN Transfers its Wireless Module Business

25.10.2021

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    3D Systems to Deliver 3D Printed RF Components for Satellite Applications

    Kyocera to Build its Largest Plant in Japan for Crystals and Semiconductor Packages

    TDK to Build New Automotive MLCC Production Plant in Japan

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    Bourns Releases High Current Shielded Power Inductor in Compact Size

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TAIYO YUDEN Transfers its Wireless Module Business

25.10.2021
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TAIYO YUDEN CO., LTD. announced today that TAIYO YUDEN and KAGA FEI Co., Ltd. (“KAGA FEI”) signed a contract regarding transfer of TAIYO YUDEN’s Wireless Module business (the “Business”) to KAGA FEI. The transaction will be completed on January 1, 2022.

As IoT devices have become widely used, demand in the market for Bluetooth® modules and wireless LAN modules is expected to continue to grow. TAIYO YUDEN has been engaged in providing wireless modules, leveraging its excellent product development capability and support system.

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However, TAIYO YUDEN concluded the transfer contract of the Business with KAGA FEI, deeming that TAIYO YUDEN must concentrate its management resources on the Electronic Components business, including multilayer ceramic capacitors, which is the core business of TAIYO YUDEN, to achieve the goals of the Medium-Term Management Plan 2025.

TAIYO YUDEN is working to achieve sustainable growth, aiming to enhance corporate value while increasing both economic and social value.

*Note: The Bluetooth® word mark and logos are owned by Bluetooth SIG, Inc., and the use of such marks by TAIYO YUDEN CO., LTD. is under license

Source: TAIYO-YUDEN

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