• Latest
  • Trending
  • All
  • Capacitors
  • Resistors
  • Inductors
  • Filters
  • Fuses
  • Non-linear Passives
  • Applications
  • Integrated Passives
  • Oscillators
  • Passive Sensors
  • New Technologies
  • Aerospace & Defence
  • Automotive
  • Industrial
  • Market & Supply Chain
  • Medical
  • RF & Microwave
  • Telecommunication

TDK’s Thin EDLC for IC Smart Cards

7.10.2016

Snubber Capacitor Selection for SiC-Based Switching Converters

17.5.2022

Vishay Releases High Precision Compact Thin Film Wraparound Chip Resistor 

17.5.2022

TAIYO YUDEN Launches Wire-Wound Automotive Power Inductors

16.5.2022

Skeleton Announces Agreement with Polish ZPUE for Rail Energy Storage Solutions

16.5.2022
  • Home
  • Privacy Policy
  • EPCI Advertisement & Membership
  • About
No Result
View All Result
NEWSLETTER
Passive Components Blog
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • Market & Supply Chain
    • Medical
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors
    • Resistors
    • RF & Microwave
    • Telecommunication

    Snubber Capacitor Selection for SiC-Based Switching Converters

    Vishay Releases High Precision Compact Thin Film Wraparound Chip Resistor 

    TAIYO YUDEN Launches Wire-Wound Automotive Power Inductors

    Skeleton Announces Agreement with Polish ZPUE for Rail Energy Storage Solutions

    European Electronic Components Distribution Under Strong Demand and Allocation in Q1 2022

    Tecate Releases Small-Cell 3V Supercapacitors

    3D Systems to Deliver 3D Printed RF Components for Satellite Applications

    Kyocera to Build its Largest Plant in Japan for Crystals and Semiconductor Packages

    TDK to Build New Automotive MLCC Production Plant in Japan

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos
    • Sensors

    Soldering THT Components by SMD Reflow Assembly; WE Webinar

    Strain Gage Resistive Sensor Simulation; Vishay Video

    EMC Filters Explained – from Component to Design; WE Webinar

    How to Avoid EMI Noise on Data Cable by Isolated Power Module; WE askLorandt Video

    Introduction to Wireless Power Transfer; WE Webinar

    How to Pass Conducted Emissions Using Line Filters; WE Webinar

    EMI Debugging of a Low Power Buck Converter; WE Webinar

    Flat Wire Inductors for Electrical Cars; WE Webinar

    Ferrite Filter Features and Selection Guide; WE Webinar

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Preferred Suppliers
  • Who is Who
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • Market & Supply Chain
    • Medical
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors
    • Resistors
    • RF & Microwave
    • Telecommunication

    Snubber Capacitor Selection for SiC-Based Switching Converters

    Vishay Releases High Precision Compact Thin Film Wraparound Chip Resistor 

    TAIYO YUDEN Launches Wire-Wound Automotive Power Inductors

    Skeleton Announces Agreement with Polish ZPUE for Rail Energy Storage Solutions

    European Electronic Components Distribution Under Strong Demand and Allocation in Q1 2022

    Tecate Releases Small-Cell 3V Supercapacitors

    3D Systems to Deliver 3D Printed RF Components for Satellite Applications

    Kyocera to Build its Largest Plant in Japan for Crystals and Semiconductor Packages

    TDK to Build New Automotive MLCC Production Plant in Japan

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos
    • Sensors

    Soldering THT Components by SMD Reflow Assembly; WE Webinar

    Strain Gage Resistive Sensor Simulation; Vishay Video

    EMC Filters Explained – from Component to Design; WE Webinar

    How to Avoid EMI Noise on Data Cable by Isolated Power Module; WE askLorandt Video

    Introduction to Wireless Power Transfer; WE Webinar

    How to Pass Conducted Emissions Using Line Filters; WE Webinar

    EMI Debugging of a Low Power Buck Converter; WE Webinar

    Flat Wire Inductors for Electrical Cars; WE Webinar

    Ferrite Filter Features and Selection Guide; WE Webinar

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Preferred Suppliers
  • Who is Who
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

TDK’s Thin EDLC for IC Smart Cards

7.10.2016
Reading Time: 3 mins read
0 0
0
SHARES
204
VIEWS

source: TDK article

TDK has been offering pouch-type EDLCs, and has developed a new ultra-thin EDLC, with a thickness of 0.45mm (max.) that can be stored inside an IC card. It realizes battery-less smart cards equipped with a display, and is suitable for secondary power supplies for wearable devices or IoT devices.

RelatedPosts

Snubber Capacitor Selection for SiC-Based Switching Converters

Vishay Releases High Precision Compact Thin Film Wraparound Chip Resistor 

TAIYO YUDEN Launches Wire-Wound Automotive Power Inductors

EDLC of TDK often used for assisting power supplies for LED flash, etc.
TDK offers small pouch-type EDLCs by applying the production technology for lithium ion batteries. TDK’s EDLC is thin, large-capacity and low-impedance, and is often used for assisting power supplies for LED flashes and other devices. EDLCs are attracting attention as a secondary power supplies for wearable devices or IoT devices, and further reduction in their thickness is demanded. To meet these needs, TDK has developed a new EDLC featuring a thickness of only 0.45mm (max.), which is one of the thinnest EDLCs in the industry (Figure 1).

Figure 1 Newly-developed thin EDLC (EDLC041720-050-2F-13)
Realizes next-generation battery-less smart cards
IC cards incorporating IC chips are used for various applications as replacements for conventional magnetic cards. Recently, next-generation smart cards with electronic paper displays or operation buttons, featuring high convenience and security, have appeared.

In a non-contact IC card system using Near Field Communication (NFC), information on the IC chip is rewritten by transmitting the energy simultaneously with signals, using the electromagnetic wave at a frequency of 13.56MHz sent from the reader/writer. However, as several seconds are required for electronic paper displays to be rewritten, the IC cards must be held over the reader/writer for a while. Although the next-generation smart cards are equipped with a primary or secondary battery to keep convenience, there are some worries with these batteries, such as the length of the battery life or the need for a lengthy charging time. TDK’s new thin EDLC provides a solution for these concerns, which rapidly stores the energy required for rewriting the display while the card is being held over the reader/writer.

The size of an IC card is 85.60mm on the longer side, 53.98mm on the shorter side, and 0.76mm thick determined by the international standard ISO/IEC7810. The newly developed EDLC with a thickness of 0.45mm makes it possible to incorporate the EDLC into an IC card, realizing a battery-less next-generation smart card (Figure 2).

Figure 2 Example of the configuration of a next-generation battery-less smart card
IC cards are required to have bending or torsional resistance. In a test using a sample incorporating TDK’s thin EDLC, the functions were not damaged even after repeating dynamic bending with a maximum flexure amount of 20mm in the long direction and 10mm in the short direction 250 times for the front and back sides respectively, for a total of 1,000 times. In addition, the functions were not lost even after repeating a dynamic torsion of 15±1° 1,000 times, which sufficiently cleared the durability test under the ISO/IEC standard required for IC cards.

Effective for wearable devices or IoT devices
The advantages of TDK’s thin EDLC include that it is a highly safe power storage device compared to lithium ion batteries or other devices. Even if an object such as a nail penetrates it when it is fully charged, it does not cause ignition or fumes. Therefore, it is suitable for healthcare devices used on the human body or wearable devices. In addition, it also features an excellent temperature characteristic, being able to operate under a broad temperature range from -20°C to +60°C. Owing to this temperature characteristic, the EDLC can support various applications, including secondary batteries for IoT devices used outdoors or storage devices in energy harvesting devices.

Wireless Sensor Networks (WSN) consisting of a large number of sensors will become the core of the near-future IoT society. However, power supplies for transmitting sensor information using radio waves have been a bottleneck for the spread of WSN. The combination of energy harvesting and EDLC provides a very effective solution that can realize battery-less sensor devices.

Part No. Nominal
Capacitance
(mF) typ.
Nominal
Impedance
[AC 1kHz]
(Ω) typ.
Operating Voltage
(continuous)
(V)
Peak
(V)
EDLC041720-050-2F-13 5 7 3.2 5.0

Related Posts

Applications e-Blog

Snubber Capacitor Selection for SiC-Based Switching Converters

17.5.2022
8
Capacitors

Skeleton Announces Agreement with Polish ZPUE for Rail Energy Storage Solutions

16.5.2022
6
Aerospace & Defence

Tecate Releases Small-Cell 3V Supercapacitors

16.5.2022
10

Popular Posts

  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0
  • What is a Dielectric Constant of Plastic Materials ?

    4 shares
    Share 4 Tweet 0
  • Why Low ESR Matters in Capacitor Design

    0 shares
    Share 0 Tweet 0
  • Capacitor Selection for Coupling and Decoupling Applications

    28 shares
    Share 28 Tweet 0
  • Understanding High-Precision Resistor Temperature Coefficient of Resistance

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

  • Home
  • Privacy Policy
  • EPCI Advertisement & Membership
  • About

© 2021 EPCI - Premium Passive Components Educational and Information Site

No Result
View All Result
  • Home
  • News
  • Video
  • Knowledge Blog
  • Preferred Suppliers
  • Events

© 2021 EPCI - Premium Passive Components Educational and Information Site

Welcome Back!

Login to your account below

Forgotten Password?

Retrieve your password

Please enter your username or email address to reset your password.

Log In
This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.