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TE Connectivity Acquires Kemtron to Expand Performance Materials Offerings

13.6.2022

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    Electron microscope images show the precise atom-by-atom structure of a barium titanate (BaTiO3) thin film sandwiched between layers of strontium ruthenate (SrRuO3) metal to make a tiny capacitor. (Credit: Lane Martin/Berkeley Lab)

    Researchers Developed BaTiO3 Ultrathin Ceramic Capacitors for Microchips

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    Ceramic Capacitors Loss Modelling under High DC Bias Voltage and High Current Stress

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    NTC Thermistor in Fire Alarm Application LTSpice Simulation

    MLCC Ageing; Samsung Video

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TE Connectivity Acquires Kemtron to Expand Performance Materials Offerings

13.6.2022
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TE Connectivity (TE), a world leader in connectivity and sensors, has completed the acquisition of Kemtron Ltd. (incl. its subsidiary -Kemtron Sarl), a United Kingdom based company and leading provider of EMI/RFI shielding, environmental sealing, gaskets and components.

With TE’s depth of engineering expertise and manufacturing of heat shrink tubing, the acquisition of Kemtron Ltd. further strengthens TE’s capabilities and design solutions for customers who produce sensitive electronics subject to extreme temperatures, harsh environments and radio frequencies.

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“I am excited to welcome Kemtron Ltd. to TE,” said Nick Jones, vice president and general manager of TE’s Performance Materials business. “Combining TE’s expertise in heat shrink tubing, manufacturing scale and distribution with Kemtron Ltd.’s reputation for providing quality and market-leading EMI/RFI solutions, we can significantly enhance the value we bring to our customers. The resulting expansion of our advanced materials science and engineering capabilities marks an important milestone in our strategic vision to expand in these critical shielding and sealing markets.”

Source: TE Connectivity, Kemtron

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