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Thales Alenia Space Passive Components Roadmap 2018

19.12.2018
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source: Thales Alenia Space ; ESA SPCD 2018 Symposium

EPCI e-symposium library article

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Thales Alenia Space presented its passive component roadmap during the ESA SPCD 2018 symposium at ESA ESTEC

published by EPCI under approval of ESA SPCD 2018 organizing committee.


Title: TAS Roadmap Passive Components
Author(s): Myriam Boyer (1), Teva Ihorai (1), Dominique Ducasse (1)
Organisation(s): (1) Thales Alenia Space, 26 Avenue Jean François Champollion, 31100 Toulouse, France
Symposium: ESA SPCD 2018
Reference: Technology Roadmaps.
ISBN: N/A
e-Sessions Applications: Aerospace
e-Sessions Scope Components: Capacitors, Resistors, Inductors, RF passives
e-Sessions Topics: Roadmaps


Common requirements for passive parts

Main requirements coming from Equipment & Payload Road Map:

  • Equipment/ Payload/ design flexibility
  • Higher density & integrated solutions
  • Increase of dissipated power & operating temperature
  • Cost & lead time reductions
  • To promote collaboration with European Suppliers

Capacitors & Resistors

2019 – 2020

  • Chip size reduction0302 / 0402
  • New technology on Board or Hybrid Line
  • Polymer Tantalum (SnPb or Gold terminations)
  • Grade 2 / COTS introduction :
    ⇒Known space manufacturers : lighten
    ⇒Automotive suppliers : Evaluation / JD Construction
  • Upgrading solutions analyzed
  • Introduction of COTS solutions for specific applications

Higher density & more integrated solutions needed towards:

2021 – 2023

  • Chip size reduction to 0201
  • Automatic Process suitable with Pure Tin Terminations components
  • Extended Temperature range to 175°C
  • Miniaturize actual Film / Tantalum capacitors
  • Extend Rated power on resistors with smaller size
  • Components Cohabitation = COTS / Grade 1

Magnetics

2019 – 2020

  • Components designed to be flexible with stable performances
  • Components designed to be compliant with automatic assembly processes
  • Magnetics solutions with small tuning operation time and wide range of customization (planar, RM, toroid…)
  • Standard series with limited range of customization
  • SMD solutions preferred / small size / reduced manufacturing lead time
  • Introduction of COTS solutions for specific applications

Increase of dissipated power & operating temperature, higher density & more integrated solutions, cost & LT reduction needed towards:

2021 – 2023

  • Magnetics with no tuning operation
  • Standard series with wide range of customization
  • New materials compliant to operating temperature (core, ferrite, coil former, glue resin…)
  • Cost and manufacturing lead time optimization

Crystals & Oscillators

2019 -2020

  • Components designed to have a high frequencystability
  • Components designed to be compliant with Space environment:
    • Vacuum
    • Mechanical environment
    • Thermal environment
  • OCXO :
    • Low phase noise
    • Very high stability Vs environment
    • Rad. Tolerant
  • XO :
    • Precision
    • Jitter
    • Good stability Vs environment
    • Rad. Tolerant
  • Crystal resonators:
    • Aging +-0.5ppm
    • Frequency stability
    • Mounting automation
    • Introduction of COTS solutions for specific applications ?

Increase of performances (phase noise, jitter, ageing precision), higher density & more integrated solutions, cost & LT reduction needed towards:

2021 – 2023

Continuous improvement regarding:

  • Performances
  • Harsh environment
  • Radiation
  • Size reduction
  • Cost reduction
  • Mounting automation

Connectors

2019 -2020

  • High densitysolutions
  • Reliable interconnection solutions
  • High performances
  • Connectors with SMD terminations
  • Interposer solutions with solder-less terminations (spring probe) for board to board applications
  • High data rate connectors

Modular/Flexible Power -Signal connectors, Fast locking & plugging solutions (Cost reductions), Solder-less solutions, connectors easy to mount and to repair at unit level needs towards:

2021 -2023

  • Interposer solutions (RF application up to 20GHz)
  • Connectors with Press fit terminations
  • Connectors board to unit/device to board with solder-less terminations (spring probe)
  • Optical solutions for very high speed flow of data
  • Introduction of COTS solutions for specific applications

RF Passive Components

2019 -2020

  • Components designed to be Glitch free
  • Components designed to achieve a Shielding effectiveness of 75dBi
  • 2.4 connectors (up to 50GHz)
  • High power TNC connectors (300W/C band)
  • SMP-Lock connectors (DC–22GHz)
  • RF Passive components with SMP-L connectors (DC–22GHz)
  • High power coaxial ISO(360W/L&S band)
  • Power dividers with integrated ISO(X & Ku band)

Increase of Frequency at Payload and Equipment level, Fast locking & Integrated solutions needs towards:

2021 -2023

  • Surface mount ISO/CIRC (X & Ku band)
  • Increase of Power at Payload and Equipment level
  • 1.85 connectors (up to 65GHz)
  • High power connectors (L,S & C band)
  • SMP-Lock connectors (DC–32GHz)
  • RF Passive components with SMP-L connectors (DC–32GHz)
  • High power coaxial ISO (L,S & C band)
  • Power dividers with integrated ISO (Ka band)
  • Surface mount ISO/CIRC (Ka band)
  • Surface mount Switches

see the presentation linkhere:

 

 

 


 

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