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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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    Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

    ROHM SDR01 high anti-surge thick-film chip resistor in 1005 metric 0402 package with 0.33 W rated power

    ROHM Introduces Anti-Surge 0402 Resistors Rated at 0.33 W

    ECIA Industry Pulse Q3 2026 chart showing passive components, semiconductors and electro-mechanical component market sentiment and lead-time pressure

    ECIA Industry Pulse Moderates as Passive Lead Times Tighten

    LG Innotek Demonstrates FC-BGA Substrates With Embedded Silicon Capacitors for AI Power Delivery

    On-Chip 3D-Printed Copper Microinductors: A New Route to Compact RF Electronics

    Emerging Capacitor Markets in Fusion Energy

    Murata DLW32SH_MF 1210 surface-mount common mode choke coil with metal terminals for automotive CAN FD signal-line noise suppression

    Murata Introduces Common Mode Chokes for Automotive CAN FD up to 150°C

    onsemi solid-state transformer concept for 800 V HVDC AI data center power conversion with SiC modules, DC-link capacitors and high-frequency magnetics

    Solid-State Transformers for 800 V AI Data Centers: Passive Component Design Considerations

    Littelfuse TX00AT314AMA omnipolar TMR magnetic switch sensor in a leaded TO-92-3 through-hole package

    Littelfuse Expands Omnipolar TMR Switch with Leaded TO-92 Package Option

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Wk 35 Electronics Supply Chain Digest

2.9.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 8-30-24.

DATAPOINT OF THE WEEK: According to the European Auto Manufacturers’ Association new auto sales in Europe totaled 998K units in July, flat Y/Y and down 22% M/M vs 3-year and 5-year seasonality of -13%/-20%.

RelatedPosts

Wk 34 Electronics Supply Chain Digest

August 2026 Interconnect, Passives and Electromechanical Components Market Insights

Wk 33 Electronics Supply Chain Digest

On Y/Y basis, sales were down in France and Germany, but up in Spain, UK and Italy. BEV sales declined 6.5% Y/Y to the lowest level since February 2024 as sales in Germany dropped 37% Y/Y. BEV penetration ticked down to 13.6% from 15.9% in June. PHEV sales declined 10.5% Y/Y, marking the third consecutive month of Y/Y declines with penetration ticking up from 6.6 to 7.1%. HEV sales remained strong, growing 24% Y/Y, while ICE sales declined 8.5% Y/Y, representing 46% of total.

Headlines:

Auto

  • China’s BYD to use Huawei’s advanced autonomous driving system in off-road EVs
  • Canada imposes a 100% tariff on imports of Chinese-made electric vehicles, matching the US
  • GM delays Indiana EV battery factory about a year
  • Chinese EVs suffer setback in Europe as tariffs start
  • BMW closes gap to Tesla in European EV sales in July
  • Hyundai targets 30% rise in sales by 2030, as it doubles hybrid lineups
  • Typhoon Shanshan pummels Japan; Toyota, Nissan, Honda, Renesas and Rohm halting some factories
  • Xpeng prices its first budget EV from $16,813
  • Xpeng aims to build EVs in Europe to blunt tariffs
  • Volkswagen passenger cars brand struggles to hit cost-cutting goal
  • US auto sales set to rise in August on Labor Day weekend surge
  • US EV sales forecast cut to 9% by J.D Power as growth slows

Datacenter

  • Dell raises full year outlook on increased demand for AI servers

Semiconductors

  • ASML’s China chip business faces new curbs from Netherlands
  • Advanced packaging equipment market expected to grow over 10% in 2024
  • Nvidia reported strong results and guidance; Blackwell volume shipments to begin in Jan-Q following a mask change to improve yield
  • Intel exploring options including foundry split, scrapping projects
  • Marvell beats and guides above expectations amid acceleration in AI ASIC demand and rebound in carrier networking
  • Wolfspeed shuts down 150mm SiC wafer fab, delays German facility plans
  • Rohm to accelerate 6th, 7th gen SiC devices
  • Xiaomi rumored to release internally developed smartphone AP in 1H25

Other

  • Apple orders over 10% more iPhone components than last year on AI sales bet according to Nikkei
  • German business sentiment falls in August, delaying recovery hopes
  • IDC raises annual global smartphone shipments forecast on GenAI optimism
  • HP forecasts downbeat profit as weak PC market, competition weigh

Source: Edgewater Research

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