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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

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    Siemens executives Markus Grabmeier and Barry Powell with Skeleton Technologies CEO Taavi Madiberk at the investment announcement

    Siemens Backs Skeleton’s US AI Power Manufacturing Expansion

    Concept illustration of an LTCC antenna module with multilayer ceramic substrate, antenna elements and an integrated beamforming IC

    Murata LTCC 6G Antenna Module Demonstrates 135 GHz Operation

    TDK X series surface-mount multilayer varistors with ceramic chip bodies and metal end terminations

    TDK X Series SMD Varistors for Industrial Transient Protection

    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

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Wk 35 Electronics Supply Chain Digest

2.9.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 8-30-24.

DATAPOINT OF THE WEEK: According to the European Auto Manufacturers’ Association new auto sales in Europe totaled 998K units in July, flat Y/Y and down 22% M/M vs 3-year and 5-year seasonality of -13%/-20%.

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Wk 39 Electronics Supply Chain Digest

Wk 38 Electronics Supply Chain Digest

September 2026 Interconnect, Passives and Electromechanical Components Market Insights

On Y/Y basis, sales were down in France and Germany, but up in Spain, UK and Italy. BEV sales declined 6.5% Y/Y to the lowest level since February 2024 as sales in Germany dropped 37% Y/Y. BEV penetration ticked down to 13.6% from 15.9% in June. PHEV sales declined 10.5% Y/Y, marking the third consecutive month of Y/Y declines with penetration ticking up from 6.6 to 7.1%. HEV sales remained strong, growing 24% Y/Y, while ICE sales declined 8.5% Y/Y, representing 46% of total.

Headlines:

Auto

  • China’s BYD to use Huawei’s advanced autonomous driving system in off-road EVs
  • Canada imposes a 100% tariff on imports of Chinese-made electric vehicles, matching the US
  • GM delays Indiana EV battery factory about a year
  • Chinese EVs suffer setback in Europe as tariffs start
  • BMW closes gap to Tesla in European EV sales in July
  • Hyundai targets 30% rise in sales by 2030, as it doubles hybrid lineups
  • Typhoon Shanshan pummels Japan; Toyota, Nissan, Honda, Renesas and Rohm halting some factories
  • Xpeng prices its first budget EV from $16,813
  • Xpeng aims to build EVs in Europe to blunt tariffs
  • Volkswagen passenger cars brand struggles to hit cost-cutting goal
  • US auto sales set to rise in August on Labor Day weekend surge
  • US EV sales forecast cut to 9% by J.D Power as growth slows

Datacenter

  • Dell raises full year outlook on increased demand for AI servers

Semiconductors

  • ASML’s China chip business faces new curbs from Netherlands
  • Advanced packaging equipment market expected to grow over 10% in 2024
  • Nvidia reported strong results and guidance; Blackwell volume shipments to begin in Jan-Q following a mask change to improve yield
  • Intel exploring options including foundry split, scrapping projects
  • Marvell beats and guides above expectations amid acceleration in AI ASIC demand and rebound in carrier networking
  • Wolfspeed shuts down 150mm SiC wafer fab, delays German facility plans
  • Rohm to accelerate 6th, 7th gen SiC devices
  • Xiaomi rumored to release internally developed smartphone AP in 1H25

Other

  • Apple orders over 10% more iPhone components than last year on AI sales bet according to Nikkei
  • German business sentiment falls in August, delaying recovery hopes
  • IDC raises annual global smartphone shipments forecast on GenAI optimism
  • HP forecasts downbeat profit as weak PC market, competition weigh

Source: Edgewater Research

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