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    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

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    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

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    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

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    YAGEO Group AS Series resin-coat-less multilayer piezoelectric actuator with lead wires for high-speed industrial motion control

    YAGEO Unveils Multilayer Piezoelectric Actuators

    Bourns CSI2F bolt-down current sense resistors for high-current busbar measurement

    Bourns Current Sense Resistors Reach 36 W

    Wk 38 Electronics Supply Chain Digest

    Heraeus C5735 thick-film gold conductor circuit with fine laser-etched RF trace pattern

    Heraeus Presents Laser Etching for RF Thick-Film Gold Circuits

    YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

    YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

    bourns-crk2725-wide-terminal-current-sense-resistors

    Bourns Releases 5 W Wide-Terminal Current Sense Resistors

    TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

    TDK Expanded DC-Link Film Capacitors to Reach +135 °C

    Knowles ATT A-Series surface-mount RF attenuator in compact ceramic thin-film package

    Knowles A-Series RF Attenuators Target Compact 20 GHz Designs

    Film DC-link capacitor and supercapacitor energy buffer in a high-voltage power converter system

    Electrification Raises Demands on DC-Link Capacitors

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Wk 35 Electronics Supply Chain Digest

2.9.2024
Reading Time: 3 mins read
A A

Electronics Supply Chain Weekly Digest 8-30-24.

DATAPOINT OF THE WEEK: According to the European Auto Manufacturers’ Association new auto sales in Europe totaled 998K units in July, flat Y/Y and down 22% M/M vs 3-year and 5-year seasonality of -13%/-20%.

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Wk 37 Electronics Supply Chain Digest

On Y/Y basis, sales were down in France and Germany, but up in Spain, UK and Italy. BEV sales declined 6.5% Y/Y to the lowest level since February 2024 as sales in Germany dropped 37% Y/Y. BEV penetration ticked down to 13.6% from 15.9% in June. PHEV sales declined 10.5% Y/Y, marking the third consecutive month of Y/Y declines with penetration ticking up from 6.6 to 7.1%. HEV sales remained strong, growing 24% Y/Y, while ICE sales declined 8.5% Y/Y, representing 46% of total.

Headlines:

Auto

  • China’s BYD to use Huawei’s advanced autonomous driving system in off-road EVs
  • Canada imposes a 100% tariff on imports of Chinese-made electric vehicles, matching the US
  • GM delays Indiana EV battery factory about a year
  • Chinese EVs suffer setback in Europe as tariffs start
  • BMW closes gap to Tesla in European EV sales in July
  • Hyundai targets 30% rise in sales by 2030, as it doubles hybrid lineups
  • Typhoon Shanshan pummels Japan; Toyota, Nissan, Honda, Renesas and Rohm halting some factories
  • Xpeng prices its first budget EV from $16,813
  • Xpeng aims to build EVs in Europe to blunt tariffs
  • Volkswagen passenger cars brand struggles to hit cost-cutting goal
  • US auto sales set to rise in August on Labor Day weekend surge
  • US EV sales forecast cut to 9% by J.D Power as growth slows

Datacenter

  • Dell raises full year outlook on increased demand for AI servers

Semiconductors

  • ASML’s China chip business faces new curbs from Netherlands
  • Advanced packaging equipment market expected to grow over 10% in 2024
  • Nvidia reported strong results and guidance; Blackwell volume shipments to begin in Jan-Q following a mask change to improve yield
  • Intel exploring options including foundry split, scrapping projects
  • Marvell beats and guides above expectations amid acceleration in AI ASIC demand and rebound in carrier networking
  • Wolfspeed shuts down 150mm SiC wafer fab, delays German facility plans
  • Rohm to accelerate 6th, 7th gen SiC devices
  • Xiaomi rumored to release internally developed smartphone AP in 1H25

Other

  • Apple orders over 10% more iPhone components than last year on AI sales bet according to Nikkei
  • German business sentiment falls in August, delaying recovery hopes
  • IDC raises annual global smartphone shipments forecast on GenAI optimism
  • HP forecasts downbeat profit as weak PC market, competition weigh

Source: Edgewater Research

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