Würth Elektronik Releases Heat Sinks for TO and IC packages

31.3.2026

Würth Elektronik has expanded its thermal management range with a modular heat sink portfolio for power semiconductors in TO packages ...

Würth Elektronik ICS to Acquire MRS Electronic and Expand Vehicle Electronics Portfolio

31.3.2026

4

Würth Elektronik ICS has signed an agreement to acquire 100% of the shares in MRS Holding, the parent company of ...

Indias ECMS Wave Brings New Capacity For Passive Components Manufacturing in India

31.3.2026

6

India has approved 29 new projects under the Electronics Components Manufacturing Scheme (ECMS), unlocking investments of around ₹71.0 billion, i.e. ...

Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors

31.3.2026

3

Binder has introduced a new triangular moulding design for selected M16 and M12 cable connectors to improve mechanical robustness, strain ...

Panasonic High Precision Chip Resistors Bridge Gap Between Thin and Thick Technology

30.3.2026

55

Panasonic’s super high precision thick film chip resistors target designs that need thin‑film‑class accuracy but with higher power handling and ...

2D Porous Carbon Nanosheets for Zinc‑Ion Hybrid Supercapacitors

30.3.2026

3

Researchers from China developed an in‑situ template–activation route using sodium lignosulfonate and potassium oxalate to synthesize 2D porous carbon cathode ...