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    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

    Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

    Motor Run Capacitor Safety Classes S0–S3: A Design Guide

    YAGEO Piezoelectric Sensors for Predictive Maintenance

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    Assorted electronic connectors for USB, audio, video and power interfaces

    Top 10 Connector Manufacturers 2025: Amphenol Takes the Lead

    Samtec AcceleRate mP UDM6 and UDF6 board-to-board connectors with signal-contact arrays and power blades

    Samtec AcceleRate mP 10 mm Signal and Power Connectors

    Schematic diagrams illustrating the physical model of the stripline microinductor.

    Stripline Microinductors with Nickel–Iron Oxide Cores

    Würth Elektronik WE-LHMI and WE-HCI power inductor comparison slide showing current ratings and maximum operating temperatures

    Power Inductor Selection: Ferrite vs Powder Core Trade-Offs, Würth Elektronik Webinar

    Bourns PWR163 DPAK-style surface-mount power resistor with moulded housing, metal backplate and terminals

    Bourns Releases Power Resistor Adds Reverse-Pin Configuration

    Conceptual polypropylene DC-link film capacitor module with parallel cells and copper interconnections

    DC-Link Film Capacitor Modules: Inductance and Thermal Design, Jianghai-Europe Tech Memo

    Panasonic EVP-BX surface-mount tactile switches with top-push actuators and two-terminal construction

    Panasonic EVP-BX Quiet Tactile Switches for HMI Designs

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    YAGEO Piezoelectric Sensors for Predictive Maintenance

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Call for Papers – ESA SPCD 4th Edition Space Passive Component Days – Abstract Submission Deadline Extended

16.3.2020
Reading Time: 4 mins read
A A

ESA SPCD Organising Commitee is announce extension of the Call for Papers for the 4rthedition of the International Symposium: Space Passive Component Days SPCD 2020 until 31st March 2020. EPCI European Passive Components Institute has been proud sponsor of ESA SPCD events.

The 4th SPCD will be held from 13th to 16th October 2020 at ESA/ESTEC, Noordwijk, The Netherlands. The SPCD international Symposium is the premier technical conference dedicated to Passive components for space applications. It is an exceptional venue to learn more about the latest advances in this field and meet recognized experts from industry, academia and agencies.  

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Abstract Submission:

the online abstract submission form is now available:

Abstract Submission The deadline for abstract submission is 13 March 2020 31th March 2020.

Technical Introduction of Components (TICs):

In addition to the technical papers, the SPCD symposium will provide the opportunity for manufacturers to present themselves or to present their products. TICs are quick presentations (5 minutes) of one of the company products or a product family that is under-development or recently qualified or has been introduced to market. TIC Submission

Private Roadmap Presentation:

SPCD gives the manufacturers the opportunty to communicate their product strategy with their customers in a private session. Free passes are offered for each manufacturer in order to invite his customers. Roadmap Presentation Submission  

Aim of SPCD

Aim of the SPCD symposium is to promote the discussion of recent developments and trends and to encourage the exchange of technical expertise and information covering a broad range of EEE passive components for space applications:

  • Capacitors & Supercapacitors
  • Cable assemblies & Harnesses
  • Crystals & Oscillators
  • Loads & Attenuators
  • Power dividers & Couplers
  • Resistors
  • SAW Devices (SAW Filters, SAW Sensors, etc.) 
  • Circulators & Isolators
  • Connectors & Interconnections
  • Fuses
  • Magnetics
  • Relays & Switches
  • RF switches & Phase shifters
  • Thermal Sensors & Heaters  

Topics

  • Application, Trends and Needs
  • Commercial Off-The-Shelf (COTS)
  • Evaluation & Qualification
  • Lessons Learned and In-flight Experiences
  • Materials and Processes
  • New Developments
  • Normative System & Standards
  • Procurement Distribution
  • Technology Roadmaps
  • Test, Reliability and Evaluation for space

The SPCD organising committee

Exhibiting at SPCD?

The ideal opportunity to present your products and services! Check the Exhibition Stand fees & Apply to Exhibit online  Apply to exhibit

Sponsoring at SPCD?    

Sponsorship will provide your company with greater visibility to the conference delegates!  Click to see the Sponsorship Packages & Apply to sponsor online Apply to sponsor

EPCI European Passive Components Institute is a proud sponsor of ESA SPCD event

Related

Source: ESA SPCD

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