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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

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    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

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    Hirose FH51 automotive FPC/FFC connector with low-profile receptacle construction and top-and-bottom contact arrangement

    Hirose Automotive FPC/FFC Connector Adds One-Action Mating up to 125°C

    Overview of fabricated ferroelectric capacitors improving hyperdimensional computing task learning accuracy. a The experimental work reported in this study comprises ferroelectric capacitor (FeCAP) device fabrication, structural and electrical characterization, analog state identification and their reliability study. b The computational part of the work explores the benefits of using characteristics from the fabricated devices in a hyperdimensional computing scheme; source: authors

    High-Precision Hyperdimensional Computing with Multi-Level Ferroelectric HZO Capacitors

    Coilcraft Introduces Automotive Common Mode Chokes Target CISPR 25 Class 5 EMC Compliance

    Murata Expands Automotive Metal Power Inductor Range

    Modelithics Qorvo GaN Library v26.5.11 Adds 200 W RF Transistor Model

    Bourns Releases Low-Profile Incremental Ring Encoder Targets Compact Industrial HMIs

    Wk 34 Electronics Supply Chain Digest

    August 2026 Interconnect, Passives and Electromechanical Components Market Insights

    AEM Introduced High-Power Fuses for Compact Automotive and Industrial Overcurrent Protection

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
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Coilcraft introduces low profile power inductors with high ripple current handling

27.11.2019
Reading Time: 1 min read
A A

Source: Coilcraft news

Coilcraft introduces new XAR7030 series raised power off-the-shelf inductors that feature terminals that elevate the inductor body 1.5 mm from the PCB surface and measure just 7.1 mm square with a max height of 3.2 mm.

RelatedPosts

TDK Releases Hybrid Polymer Aluminum Capacitors with Enhanced Ripple Current Capability

Selection Guide for DC-Link Film Capacitors in Automotive Electric Compressors; KEMET App Note

Tantalum Polymer use in GaN based applications

Description

  • Unique off-the-board design provides 1.5 mm clearance for parts to be mounted underneath
  • Excellent current handling – up to 60 A; Exceptionally low DCR – only 1.26 mOhms
  • Magnetically shieldedfor high density applications
  • Soft saturation, perfect for VRM/VRDapplications
  • Composite construction minimizes audible buzzing
  • RoHS-compliant, halogen free.260°C compatible. Matte tin over nickel over phos bronze terminations
  • High current, very low DCR, soft saturation

Main Features

  • Core material: Composite
  • Environmental RoHS compliant, halogen free
  • Terminations RoHS compliant matte tin over nickel over phos bronze
  • Weight 1.06 g
  • Ambient temperature –40°C to +165°C with Irms current
  • Maximum part temperature +125°C (ambient + temp rise)
  • Storage temperature Component: –55°C to +165°C. Tape and reel packaging: –55°C to +80°C
  • Resistance to soldering heat Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles
  • Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C / 85% relative humidity)
  • Failures in Time (FIT) / Mean Time Between Failures (MTBF) 38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332

 

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