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    Bourns Releases High Power High Ripple Chokes

    KYOCERA AVX Releases Hermaphroditic WTW and WTB Connectors

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    TDK Releases Compact Polypropylene Film Capacitors for Resonant Topologies

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Comparison Testing of Chip Resistor Technologies Under High Vibration

11.4.2025
Reading Time: 1 min read
A A

This video from VPG compares the mechanical endurance of different resistor technologies under consistent high-vibration stress.

Surface-mount SMD chip resistors can experience mechanical stress and failure when subjected to vibration or cyclic flexing, particularly in environments with high shock, motion, or thermal expansion.

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In the demonstration, resistor-mounted PCBs are placed on a vibration table and subjected to ±2 degrees of flex at 25 Hz, simulating continuous mechanical strain. Resistance is monitored in real-time, with failure defined as a shift of more than 0.1% (ΔR larger than 0.1%).

All standard chip resistors under test failed within 2 to 12 minutes (roughly 8,000 to 16,000 flex cycles). In contrast, the Alpha Electronics MPP molded Bulk Metal® Z-Foil resistor, featuring flexible terminations, completed over 1,000,000 cycles without any measurable resistance change.

This test highlights the mechanical robustness and stability of Bulk Metal Foil resistors with molded and flex-terminal construction, particularly in applications exposed to sustained vibration, flex, or mechanical fatigue.

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Source: VPG

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