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    TDK Introduces High Current 80VDC Board-Mount EMI Filters

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    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

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    TDK Introduces High Current 80VDC Board-Mount EMI Filters

    Bourns Releases High Heat Tolerant TO-227 Thick Film Resistor

    TDK Increases Current Ratings of Automotive Thin-Film Power Inductors

    Sumida Announces New DC Common Mode Choke Coil Series

    KYOCERA AVX Releases New 3dB Hybrid Couplers

    SCHURTER Unveils High Voltage Fuses for EV Applications

    YAGEO Releases First to Market 750V Aluminum Capacitors

    binder Introduces M9 Compact Circular Connector

    Smolteks CNF-MIM Capacitors Meet Thermal and Voltage Stability Industry Requirements

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
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    • Derating
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    • New Products
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    Accelerating Full Bridge LLC Resonant Converter Design with Frenetic AI

    Understanding Switched Capacitor Converters

    Coupled Inductors Circuit Model and Examples of its Applications

    Inductor Resonances and its Impact to EMI

    Highly Reliable Flex Rigid PCBs, Würth Elektronik Webinar

    Causes of Oscillations in Flyback Converters

    How to design a 60W Flyback Transformer

    Modeling and Simulation of Leakage Inductance

    Power Inductor Considerations for AI High Power Computing – Vishay Video

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Correlation between Calculation & Practice for Simple TOP-to-BOTTOM PCB Heat Dissipation

17.12.2024
Reading Time: 1 min read
A A

This Würth Elektronik webinar aim to show where the difference between calculation and measurement of PCB heat dissipation comes from, even for relatively simple assemblies.

Without time-consuming thermal simulations, demanding heat dissipation of assemblies cannot solve satisfactorily.

RelatedPosts

Würth Elektronik Extends High Saturation Flat-Wire Power Inductors Line

Advancements and Applications of Switch Capacitor Power Converters

Würth Elektronik Releases Long Life SMT nano and microSD Card Connectors

But, to what extent can simple thermal requirements on PCBs be determined with basic mathematics?

How well do the results correlate with real measurements?

Related

Source: Würth Elektronik

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