Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

    B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

    Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

    Connector Industry Performance Accelerates Through Mid-2026

    Wk 33 Electronics Supply Chain Digest

    Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

    YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

    Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

    KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

    B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

    Bourns UT-A Wirewound Power Resistors Target High-Temperature and Pulse-Load Applications

    Connector Industry Performance Accelerates Through Mid-2026

    Wk 33 Electronics Supply Chain Digest

    Filter Capacitors in Electric Vehicles: Knowles Safety MLCCs for BMS and Isolated DC/DC Converters

    YAGEO Expands Aluminum Polymer Capacitors for High-Temperature AI Server Power Rails

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Development of Atomically Thin Magnets Enable Next Generation of Thinner and Faster Electronics

14.5.2020
Reading Time: 3 mins read
A A
A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively.
Credit: Stevens Institute of Technology

A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively. Credit: Stevens Institute of Technology

Stevens researchers develop a ferromagnetic semiconductor that works at room temperature, solving one of science’s most intractable problems

As our smartphones, laptops, and computers get smaller and faster, so do the transistors inside them that control the flow of electricity and store information. But traditional transistors can only shrink so much. Now, researchers at Stevens Institute of Technology have developed a new atomically thin magnetic semiconductor that will allow the development of new transistors that work in a completely different way; they not only can harness an electron’s charge but also the power of its spin, providing an alternative path to creating ever smaller and faster electronics.

RelatedPosts

Bourns Copper-Electrode MOV Series Targets High-Energy Line Surge Protection

Bourns Expands 12 mm SMD Incremental Encoder with Shaft-Length Options for Compact HMI Controls

KEMET HRA X7R High-Reliability MLCCs Target Higher Capacitance in Defense and Aerospace Electronics

Rather than relying on making smaller and smaller electrical components, the new discovery, reported in the April 2020 issue of Nature Communications, potentially provides a critical platform for advancing the field of spintronics (spin + electronics), a fundamentally new way to operate electronics and a much-needed alternative to continued miniaturization of standard electronic devices. In addition to removing the miniaturization barrier, the new atomically thin magnet can also enable faster processing speed, less energy consumption and increased storage capacity.

“A two-dimensional ferromagnetic semiconductor is a material in which ferromagnetism and semiconducting properties coexist in one, and since our material works at room temperature, it allows us to readily integrate it with the well-established semiconductor technology,” said EH Yang, a professor of mechanical engineering at Stevens Institute of Technology, who led this project.

“The magnetic field strength in this material is 0.5 mT; while such weak magnetic field strength cannot allow us to pick up a paper clip, it is large enough to alter the spin of electrons, which can be utilized for quantum bits applications,” said Stefan Strauf, a professor of physics at Stevens.

When computers were first built, they filled an entire room, but now they can fit in your back pocket. The reason for this is Moore’s law, which suggests that every two years, the number of transistors that fit on a computer chip will double, effectively doubling a gadget’s speed and capability. But transistors can only become so small before the electrical signals that they are supposed to control no longer obey their commands.

While most forecasters expect Moore’s law will end by 2025, alternative approaches, which do not rely on physical scaling, have been investigated. Manipulating the spin of electrons, instead of relying solely on their charge, may provide a solution in the future.

Building a new magnetic semiconductor using two-dimensional materials – that is, two-atoms thick- will allow the development of a transistor to control electricity with control of the spin of an electron, either up or down, while the whole device remains lightweight, flexible and transparent.

Using a method called in situ substitutional doping, Yang and his team successfully synthesized a magnetic semiconductor whereby a molybdenum disulfide crystal is substitutionally doped with isolated iron atoms. During this process, the iron atoms kick off some of the molybdenum atoms and take their place, in the exact spot, creating a transparent and flexible magnetic material – again, only two-atoms thick. The material is found to remain magnetized at room temperature, and since it is a semiconductor, it can directly be integrated into the existing architecture of electronic devices in the future.

Yang and his team at Stevens worked with several institutions to image the material – atom by atom – to prove that the iron atoms took the place of some of the molybdenum atoms. These institutions included the University of Rochester, Rensselaer Polytechnic Institute, Brookhaven National Laboratory, and Columbia University.

“To do something great in science, you need to get others to collaborate with you,” said Shichen Fu, a Ph.D. student in mechanical engineering at Stevens. “This time, we brought all the right people together – labs with different strengths and different perspectives – to make this happen.”

Related

Source: EurekAlert

Recent Posts

B–H Curve-Based Inductor Modelling in LTspice: A Current-Dependent Magnetic Model

31.8.2026
16

Vishay IFBT SMT Flyback Transformers Target PoE and Isolated DC/DC Designs up to 30 W

28.8.2026
15

Bourns Automotive BMS Signal Transformer Combines Reinforced Isolation and Common-Mode Noise Rejection

27.8.2026
27

Vishay Introduces Automotive Low Loss SMD Common-Mode Chokes

26.8.2026
31

Current-Dependent Inductors: Using Non-Linear Inductance in Buck Converters and PFC Stages

24.8.2026
39

Passive Components for Industrial Automation and Robotics (Dossier Report 08/26)

20.8.2026
117

Single Pair Ethernet for Humanoid Robot In-Robot Networks

17.8.2026
164

Bourns Transformer and Inductor Target 600 W GaN Cycloconverters

13.8.2026
77

YAGEO Extends Automotive CAN and CAN-FD Common-Mode Chokes

10.8.2026
64

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 16
17:00 - 18:00 CEST

Designing a 5 kW, 800 V-to-50 V PSFB Converter for Next-Generation Data Centers

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved