Passive Components Blog
No Result
View All Result
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Releases TVS Diodes for ISO 7637-2 Pulse 5b Load-Dump Protection

    Vishay Introduces Y1 SMD Ceramic Disc Safety Capacitors to Reduce EMI Filter Board Space

    ECIA Industry Pulse Index Cools After Five-Year High

    YAGEO Extends Automotive CAN and CAN-FD Common-Mode Chokes

    Würth Elektronik Updates REDEXPERT DC‑DC Converter Designer

    Stackpole Unveils High-Temperature Automotive Thick Film Chip Resistors for Harsh Environments

    Molex Presents MiniMix Hybrid Power and Signal Connectors for Compact Humanoid Joints

    Bourns Releases Custom SiC AFE/PFC Power Inductor for High‑Voltage Designs

    Littelfuse Releases Toggle Safety Covers for Reliable Control Panels

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • NewsFilter
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest

    Littelfuse Releases TVS Diodes for ISO 7637-2 Pulse 5b Load-Dump Protection

    Vishay Introduces Y1 SMD Ceramic Disc Safety Capacitors to Reduce EMI Filter Board Space

    ECIA Industry Pulse Index Cools After Five-Year High

    YAGEO Extends Automotive CAN and CAN-FD Common-Mode Chokes

    Würth Elektronik Updates REDEXPERT DC‑DC Converter Designer

    Stackpole Unveils High-Temperature Automotive Thick Film Chip Resistors for Harsh Environments

    Molex Presents MiniMix Hybrid Power and Signal Connectors for Compact Humanoid Joints

    Bourns Releases Custom SiC AFE/PFC Power Inductor for High‑Voltage Designs

    Littelfuse Releases Toggle Safety Covers for Reliable Control Panels

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • VideoFilter
    • All
    • Antenna videos
    • Capacitor videos
    • Circuit Protection Video
    • Filter videos
    • Fuse videos
    • Inductor videos
    • Inter-Connect Video
    • Non-linear passives videos
    • Oscillator videos
    • Passive sensors videos
    • Resistor videos

    Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

    EMC Design Fundamentals: Safe Use of Varistors and Common Mode Chokes in Mains and Data-Line Filters

    Ferrite versus Nanocrystalline Power Inductor Cores: Turns, Gap and Size

    KYOCERA AVX Presents Antenna Integrator Studio Tutorial for Antenna Placement and RF Design

    Power Design Simulation Tools for Faster Inductor Selection and Loss Optimization

    EMC‑Compliant PCB and Connector Design Guidelines

    Why Isolated DC/DC Power Supplies Fail Late, Würth Elektronik Podcast

    Designing 800 V DC EMC Filters: Calculation, Simulation and Measurement

    Current Sense Transformer Datasheet and Design‑in Guide

    Trending Tags

    • Capacitors explained
    • Inductors explained
    • Resistors explained
    • Filters explained
    • Application Video Guidelines
    • EMC
    • New Products
    • Ripple Current
    • Simulation
    • Tantalum vs Ceramic
  • Knowledge Blog
  • Dossiers
    • AI Hardware Dossier
    • Power Converter Dossier
    • Automotive Dossier
    • Capacitor Dossier
    • Resistor Dossier
    • Inductor Dossier
    • Circuit Protection Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Development of Atomically Thin Magnets Enable Next Generation of Thinner and Faster Electronics

14.5.2020
Reading Time: 3 mins read
A A
A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively.
Credit: Stevens Institute of Technology

A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively. Credit: Stevens Institute of Technology

Stevens researchers develop a ferromagnetic semiconductor that works at room temperature, solving one of science’s most intractable problems

As our smartphones, laptops, and computers get smaller and faster, so do the transistors inside them that control the flow of electricity and store information. But traditional transistors can only shrink so much. Now, researchers at Stevens Institute of Technology have developed a new atomically thin magnetic semiconductor that will allow the development of new transistors that work in a completely different way; they not only can harness an electron’s charge but also the power of its spin, providing an alternative path to creating ever smaller and faster electronics.

RelatedPosts

Littelfuse Releases TVS Diodes for ISO 7637-2 Pulse 5b Load-Dump Protection

Vishay Introduces Y1 SMD Ceramic Disc Safety Capacitors to Reduce EMI Filter Board Space

ECIA Industry Pulse Index Cools After Five-Year High

Rather than relying on making smaller and smaller electrical components, the new discovery, reported in the April 2020 issue of Nature Communications, potentially provides a critical platform for advancing the field of spintronics (spin + electronics), a fundamentally new way to operate electronics and a much-needed alternative to continued miniaturization of standard electronic devices. In addition to removing the miniaturization barrier, the new atomically thin magnet can also enable faster processing speed, less energy consumption and increased storage capacity.

“A two-dimensional ferromagnetic semiconductor is a material in which ferromagnetism and semiconducting properties coexist in one, and since our material works at room temperature, it allows us to readily integrate it with the well-established semiconductor technology,” said EH Yang, a professor of mechanical engineering at Stevens Institute of Technology, who led this project.

“The magnetic field strength in this material is 0.5 mT; while such weak magnetic field strength cannot allow us to pick up a paper clip, it is large enough to alter the spin of electrons, which can be utilized for quantum bits applications,” said Stefan Strauf, a professor of physics at Stevens.

When computers were first built, they filled an entire room, but now they can fit in your back pocket. The reason for this is Moore’s law, which suggests that every two years, the number of transistors that fit on a computer chip will double, effectively doubling a gadget’s speed and capability. But transistors can only become so small before the electrical signals that they are supposed to control no longer obey their commands.

While most forecasters expect Moore’s law will end by 2025, alternative approaches, which do not rely on physical scaling, have been investigated. Manipulating the spin of electrons, instead of relying solely on their charge, may provide a solution in the future.

Building a new magnetic semiconductor using two-dimensional materials – that is, two-atoms thick- will allow the development of a transistor to control electricity with control of the spin of an electron, either up or down, while the whole device remains lightweight, flexible and transparent.

Using a method called in situ substitutional doping, Yang and his team successfully synthesized a magnetic semiconductor whereby a molybdenum disulfide crystal is substitutionally doped with isolated iron atoms. During this process, the iron atoms kick off some of the molybdenum atoms and take their place, in the exact spot, creating a transparent and flexible magnetic material – again, only two-atoms thick. The material is found to remain magnetized at room temperature, and since it is a semiconductor, it can directly be integrated into the existing architecture of electronic devices in the future.

Yang and his team at Stevens worked with several institutions to image the material – atom by atom – to prove that the iron atoms took the place of some of the molybdenum atoms. These institutions included the University of Rochester, Rensselaer Polytechnic Institute, Brookhaven National Laboratory, and Columbia University.

“To do something great in science, you need to get others to collaborate with you,” said Shichen Fu, a Ph.D. student in mechanical engineering at Stevens. “This time, we brought all the right people together – labs with different strengths and different perspectives – to make this happen.”

Related

Source: EurekAlert

Recent Posts

YAGEO Extends Automotive CAN and CAN-FD Common-Mode Chokes

10.8.2026
20

Würth Elektronik Updates REDEXPERT DC‑DC Converter Designer

6.8.2026
46

Bourns Releases Custom SiC AFE/PFC Power Inductor for High‑Voltage Designs

6.8.2026
51

Current Sense Transformers: Ferrite vs Nanocrystalline Cores for Accurate Current Measurement

5.8.2026
73

Murata Releases 1210 Metal Terminal Common Mode Choke for 10Base‑T1S In‑Vehicle Ethernet

30.7.2026
151

Würth Elektronik Coupled Inductors Harnessing Leakage Inductance in SEPIC, ZETA and Ćuk Converters

29.7.2026
119

TDK Releases SMD Common‑Mode Chokes for Compact High‑Current EMI Filtering

28.7.2026
122

Exxelia Offers 1200V Capacitors and Magnetics for 800V Aerospace Platforms

22.7.2026
78

Bourns Introduces Automotive BMS Signal Transformer with Integrated Common Mode Chokes

17.7.2026
61

Upcoming Events

Sep 10
11:00 - 12:00 CEST

Equipment models and model strategies for Space Missions

Sep 29
16:00 - 17:00 CEST

Cybersecurity 2026

Nov 24
16:00 - 17:00 CET

Component selection with the WE REDEXPERT® DC-DC Converter Designer Tool

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • MLCCs in the Age of AI: Q2 2026 Market Tightness

    0 shares
    Share 0 Tweet 0
  • Earthing Systems and IEC Classification Explained

    0 shares
    Share 0 Tweet 0
  • YAGEO Announces July 2026 Capacitor Price Increase

    0 shares
    Share 0 Tweet 0
  • Dual Active Bridge (DAB) Topology

    0 shares
    Share 0 Tweet 0
  • Ripple Current and its Effects on the Performance of Capacitors

    3 shares
    Share 3 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© EPCI - Leading Passive Components Educational and Information Site

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© EPCI - Leading Passive Components Educational and Information Site