Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Littelfuse TP7.0SMD-XC automotive TVS diodes with black surface-mount bodies and silver end terminals.

    Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

    Supercapacitor LSM production

    LS Materials Wins $51.5M AI Data Center Supercapacitor Order

    Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

    Relaxor superlattice capacitors approach 99% efficiency

    Stackpole RMAN thick-film chip resistors with rectangular bodies and metal end terminations

    Stackpole 2512 AlN Thick-Film Resistors Rated up to 3.5 W

    ECIA September 2026 Industry Pulse electronic component trends and sentiment report

    ECIA September 2026 Pulse: Growth Holds, Supply Pressure Persists

    Wk 39 Electronics Supply Chain Digest

    Concept illustration of TT Electronics resistor and sensing technologies with chip resistors, a shaft potentiometer and a slotted optical sensor

    TT Electronics: Resistor and Sensing Trends at electronica 2026

    Conceptual Toray heat-resistant film capacitor beside an inverter cooling structure.

    Toray Film Capacitor Enables 150°C Inverter Operation

    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Development of Atomically Thin Magnets Enable Next Generation of Thinner and Faster Electronics

14.5.2020
Reading Time: 3 mins read
A A
A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively.
Credit: Stevens Institute of Technology

A ferromagnetic semiconductor semiconductor two-atoms thick. The green, blue, and red spheres are sulfur, molybdenum and iron atoms, respectively. Credit: Stevens Institute of Technology

Stevens researchers develop a ferromagnetic semiconductor that works at room temperature, solving one of science’s most intractable problems

As our smartphones, laptops, and computers get smaller and faster, so do the transistors inside them that control the flow of electricity and store information. But traditional transistors can only shrink so much. Now, researchers at Stevens Institute of Technology have developed a new atomically thin magnetic semiconductor that will allow the development of new transistors that work in a completely different way; they not only can harness an electron’s charge but also the power of its spin, providing an alternative path to creating ever smaller and faster electronics.

RelatedPosts

Littelfuse Introduces Extremely Low Clamping Voltage TVS Diodes for Automotive Protection

LS Materials Wins $51.5M AI Data Center Supercapacitor Order

Relaxor superlattice capacitors approach 99% efficiency

Rather than relying on making smaller and smaller electrical components, the new discovery, reported in the April 2020 issue of Nature Communications, potentially provides a critical platform for advancing the field of spintronics (spin + electronics), a fundamentally new way to operate electronics and a much-needed alternative to continued miniaturization of standard electronic devices. In addition to removing the miniaturization barrier, the new atomically thin magnet can also enable faster processing speed, less energy consumption and increased storage capacity.

“A two-dimensional ferromagnetic semiconductor is a material in which ferromagnetism and semiconducting properties coexist in one, and since our material works at room temperature, it allows us to readily integrate it with the well-established semiconductor technology,” said EH Yang, a professor of mechanical engineering at Stevens Institute of Technology, who led this project.

“The magnetic field strength in this material is 0.5 mT; while such weak magnetic field strength cannot allow us to pick up a paper clip, it is large enough to alter the spin of electrons, which can be utilized for quantum bits applications,” said Stefan Strauf, a professor of physics at Stevens.

When computers were first built, they filled an entire room, but now they can fit in your back pocket. The reason for this is Moore’s law, which suggests that every two years, the number of transistors that fit on a computer chip will double, effectively doubling a gadget’s speed and capability. But transistors can only become so small before the electrical signals that they are supposed to control no longer obey their commands.

While most forecasters expect Moore’s law will end by 2025, alternative approaches, which do not rely on physical scaling, have been investigated. Manipulating the spin of electrons, instead of relying solely on their charge, may provide a solution in the future.

Building a new magnetic semiconductor using two-dimensional materials – that is, two-atoms thick- will allow the development of a transistor to control electricity with control of the spin of an electron, either up or down, while the whole device remains lightweight, flexible and transparent.

Using a method called in situ substitutional doping, Yang and his team successfully synthesized a magnetic semiconductor whereby a molybdenum disulfide crystal is substitutionally doped with isolated iron atoms. During this process, the iron atoms kick off some of the molybdenum atoms and take their place, in the exact spot, creating a transparent and flexible magnetic material – again, only two-atoms thick. The material is found to remain magnetized at room temperature, and since it is a semiconductor, it can directly be integrated into the existing architecture of electronic devices in the future.

Yang and his team at Stevens worked with several institutions to image the material – atom by atom – to prove that the iron atoms took the place of some of the molybdenum atoms. These institutions included the University of Rochester, Rensselaer Polytechnic Institute, Brookhaven National Laboratory, and Columbia University.

“To do something great in science, you need to get others to collaborate with you,” said Shichen Fu, a Ph.D. student in mechanical engineering at Stevens. “This time, we brought all the right people together – labs with different strengths and different perspectives – to make this happen.”

Related

Source: EurekAlert

Recent Posts

Features of BCZT and strontium titanate dielectric layers in a thin-film superlattice

Relaxor superlattice capacitors approach 99% efficiency

12.10.2026
11
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
28
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
27
Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

TDK Expands1608 Inductors for Automotive PoC Filters

6.10.2026
11
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
38
YAGEO Group PMT6709NLT and PHT7249NLT GDSC SMD LLC gate-drive transformers for SiC and GaN switching applications

YAGEO Introduces LLC Transformers for SiC and GaN Gate Drives

2.10.2026
35
Schematic of the step-wise LPG/LPG@MnOx/LPG-O functionally graded thick cathode for a zinc-ion hybrid capacitor, Hefei Institutes of Physical Science.

Laser-Engineered Zinc-Ion Cathodes Target Thick Electrodes

1.10.2026
18
Würth Elektronik electronica 2026 presentation featuring electronic components, PCB technologies and high-current PowerBusbar connection solutions.

Würth Elektronik Previews Components, PCBs and Power Solutions at electronica 2026

30.9.2026
27
Bourns SRP201210V low-profile shielded SMD power inductors for compact portable electronics

Bourns Releases Compact Shielded Power Inductors

30.9.2026
22

Upcoming Events

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

Oct 27
15:00 - 16:00 CET

Heraeus Electronics Webinar: What materials perform when failure is not an option?

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • Passive Low Pass Filters: Fundamentals and EMI Design

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved