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Electronic Products has announced the finalists for the 2019 Product of the Year Awards

30.1.2020

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25.5.2023

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    YAGEO Releases High Capacitance 630V NP0 MLCC for Higher Power Density and Efficiency Circuits

    Skeleton Acquires Former Batteries Plant to Increase Manufacturing Capacity

    TDK Enhances Efficiency of Materials Development Using Advanced AI

    Transformer Optimal Operating Frequency for Phase-Shifted Full-Bridge Converter

    Vishay Unveils 120W High Energy Power Resistor

    Knowles Offers Build-to-Print Services for Thin Film Circuits

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Electronic Products has announced the finalists for the 2019 Product of the Year Awards

30.1.2020
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Electronic Products has announced the finalists for the 2019 Product of the Year Awards. The annual awards, now in its 44th year, recognizes outstanding products that represent any or all of the following qualities: a significant advancement in a technology or its application, an exceptionally innovative design, a substantial achievement in price/performance, improvements in design performance, and the potential for new product designs/opportunities. EP editors evaluated nearly 150 products across 10 electronic component categories including passive electronic components. Winners will be announced in EP’s January/February 2020 digital issue.

The finalists in category of passive electronic components are:

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Cornell Dubilier Electronics, ULP Series of Ultra-Low-Profile Aluminum Electrolytic Capacitors
Cornell Dubilier Electronics (CDE) has developed an ultra-low-profile family of aluminum-electrolytic capacitors that can replace large arrays of surface-mount (SMT) capacitors. Called a “game-changer” for engineers designing compact electronic devices, the ULP series is designed specifically for applications requiring bulk capacitance and the lowest board profiles and offers considerably higher energy density than arrays of surface-mount capacitors. This design allows engineers to use a single component to save space, weight, and cost while improving reliability.

“With energy density exceeding 0.4 J/cc, a single ULP capacitor provides much greater bulk storage in a smaller footprint than a bank of low-profile SMT capacitors,” said the company, and “the technology is particularly effective at displacing parallel banks of SMT solid tantalum capacitors to achieve high capacitance on the board.”

Cornell Dubilier Introduce Ultra-Flat Aluminum Electrolytic Capacitors Save Board Space

Ohmite Mfg. Co., TRH Series of Thick-film Resistors With a Ceramic Heat Sink
Ohmite has combined its signature thick-film technology with a ceramic heat sink. Traditional designs using high power resistors and heatsink require multiple items to create a single assembly — a resistor, heat sink, thermal grease, and screw/nut. The TRH Series offers a single part solution to the common TO-247, screw, and heat sink. Traditionally, all three items are offered separately and require assembly to produce one resistive solution. The Ohmite TRH series fuses the resistor and ceramic heats ink into one unit. The solution not only eliminates multiple items; it eliminates the thermal calculations required in these assemblies along with the assembly times required for the total assembly. Using multiple thick-film techniques and patterns, the TRH Series can cover three primary applications: high energy, high voltage, and constant power.

Ohmite Releases Thick Film Resistors on Ceramic Heatsink
Source: Electronic Products

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