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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

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    Power line EMI filter on a copper ground-plane fixture connected to a vector network analyzer with a toroidal balun

    How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

    Assorted EMI and RF filter components: common mode choke, ferrite beads, feedthrough filter, X2 capacitor, cavity filter, ceramic coaxial resonators, thin-film filter and SAW/BAW packages

    Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

    Illustration of a thin-film capacitor stack with TiN electrodes and an ultrathin hafnium zirconium oxide ferroelectric layer on silicon

    Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

    Cut-open lithium-ion capacitor pouch cell showing stacked carbon electrodes and separators, with vials of carbon powder

    Lithium-Ion Capacitor Review Backs Hard Carbon//AC Pairing

    Rack power shelf in an AI data center with film DC-link capacitors, a supercapacitor bank and a converter board

    800 VDC AI Data Centers Reshape Capacitor Demand for 2027

    Schematic of a titanium nitride thin-film inductor within a CMOS poly-resistor stack beside its integrated resonator circuit.

    TiN Superinductors Bring Compact Cryogenic Inductance to CMOS

    Close-up of reddish-brown metallic rocks illustrating TTI MarketEYE’s connector raw material cost analysis

    Connector Raw Material Costs Rise 20.9% in Q2 2026

    AI and Passive Components: Structural Growth Beyond Data Centers

    YAGEO PMT6397 push-pull transformer with a segmented toroidal winding and surface-mount terminals

    YAGEO Releases Push-Pull Transformers for Isolated 3 W Supplies

    Trending Tags

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    • RF
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ESA SPCD 2018 Call for Papers Abstract Deadline Extended

19.3.2018
Reading Time: 2 mins read
A A
Space satellite orbiting the earth

Space satellite orbiting the earth

Source: Original EPCI article, ESA SPCD organizing committee

3rd edition of the International Symposium: ESA Space Passive Component Days (SPCD) that will be held from 9th to 12th October 2018 at ESA/ESTEC, Noordwijk, The Netherlands is pleased to announce extension of the paper abstracts submission.

RelatedPosts

How to Measure Filter Performance: Insertion Loss, VNA Fixtures and CM/DM Separation

Passive Filter Technologies Compared: LC, Ferrite, Feedthrough, Ceramic, Cavity, Microstrip, SAW and BAW

Sub-Volt Ferroelectric HZO Capacitor Pairs Speed and Endurance

 

The ESA SPCD 2018 abstract deadline has been extended to 31st March 2018.

 

Abstract Submission Instructions:

Authors are kindly invited to submit their abstracts (400 words maximum) via the on-line submission form available on the official website:

https://spcd.space/page.php?pid=9

On this page, you will also find the instructions for the preparation and submission of your abstract.

Technical Introduction of Components (TICs):

TICs are short commercial presentations (5 minutes max) of one of the company products or a product family that is under-development or recently qualified or has been introduced to market.

In order to submit your TIC, please use this form.

 

Manufacturers’ Private Roadmap:

A dedicated and private session for manufacturers to present their roadmaps to their customers (Buyers; procurement, supply or purchasing managers; Technical experts; No competitors).

SPCD will give the opportunity for manufacturers to communicate their product strategy with their customers in a private session. Free invitations offered for each manufacturer in order to invite his customers and give them a free access to the conference only on Friday 12th October 2018.

In order to request a private roadmap presentation, please use this form.

 

The SPCD international Symposium is the premier technical conference dedicated to Passive components for space applications. It is an exceptional venue to learn more about the latest advances in this field and meet recognized experts from industry, academia and agencies.

Aim of SPCD 
Aim of the SPCD symposium is to promote the discussion of recent developments and trends and to encourage the exchange of technical expertise and information covering a broad range of EEE passive components for space applications:

  • Capacitors & Supercapacitors
  • Circulators & Isolators
  • Cable assemblies & Harnesses
  • Connectors & Interconnections
  • Crystals & Oscillators
  • Fuses
  • Loads & Attenuators
  • Magnetics
  • Power dividers & Couplers
  • Relays & Switches
  • Resistors
  • RF switches & Phase shifters
  • SAW Devices (SAW Filters, SAW Sensors, etc.)
  • Thermal Sensors & Heaters

Topics

  • Application, Trends and Needs
  • Evaluation & Qualification
  • Lessons Learned and In-flight Experiences
  • Materials and Processes
  • New Developments
  • Normative System & Standards
  • Procurement, Distribution
  • Technology Roadmaps
  • Test, Reliability and Evaluation for space
  • You are most cordially invited to attend this meeting.

 

The SPCD organising committee

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