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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

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    VACUUMSCHMELZE VACODUR Max cobalt-iron lamination material illustrated as thin metallic rotor and stator stacks.

    VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

    Stackpole RPCQ thick-film chip resistors in rectangular surface-mount packages with end terminations

    Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

    Bourns CRT-G thin film chip resistor illustration with a rectangular body and metallic end terminations

    Bourns Introduces Precision Thin Film Resistors for Measurement

    Würth Elektronik ABC of Thermal Management textbook

    Würth Elektronik Launches ABC of Thermal Management Guide

    Schematic of six-arm nitrene crosslinker joining PEI polymer chains in a free-standing dielectric film.

    Crosslinked PEI Film Capacitor Dielectrics Reach 6 J/cm³ at 200°C

    Conceptual illustration of Peak Nano NanoPlex HDC capacitor dielectric film rolls beside a cast-film production line

    Peak Nano Scales NanoPlex HDC Capacitor Film Production 20-Fold

    Bourns Releases 450 V DC Bus TVS Diode

    YAGEO Nexensos M422 Pb-free platinum RTD graphic showing the operating temperature range, nominal resistance options and joining methods.

    YAGEO Introduces Pb-Free Platinum RTD Temperature Sensor

    Reference tantalum capacitor anode characterization, tantalum anode modeling, process selection and life-test verification.

    Tantalum Anode Design Combines Structural Benchmarks and Modeling

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
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ESA SPCD 2018 Call for Papers Abstract Deadline Extended

19.3.2018
Reading Time: 2 mins read
A A
Space satellite orbiting the earth

Space satellite orbiting the earth

Source: Original EPCI article, ESA SPCD organizing committee

3rd edition of the International Symposium: ESA Space Passive Component Days (SPCD) that will be held from 9th to 12th October 2018 at ESA/ESTEC, Noordwijk, The Netherlands is pleased to announce extension of the paper abstracts submission.

RelatedPosts

VACUUMSCHMELZE Introduced VACODUR Max Cobalt-Iron Alloy for Motor Laminations

Stackpole Releases Pulse-Withstanding Chip Resistors up to 4 W

Bourns Introduces Precision Thin Film Resistors for Measurement

 

The ESA SPCD 2018 abstract deadline has been extended to 31st March 2018.

 

Abstract Submission Instructions:

Authors are kindly invited to submit their abstracts (400 words maximum) via the on-line submission form available on the official website:

https://spcd.space/page.php?pid=9

On this page, you will also find the instructions for the preparation and submission of your abstract.

Technical Introduction of Components (TICs):

TICs are short commercial presentations (5 minutes max) of one of the company products or a product family that is under-development or recently qualified or has been introduced to market.

In order to submit your TIC, please use this form.

 

Manufacturers’ Private Roadmap:

A dedicated and private session for manufacturers to present their roadmaps to their customers (Buyers; procurement, supply or purchasing managers; Technical experts; No competitors).

SPCD will give the opportunity for manufacturers to communicate their product strategy with their customers in a private session. Free invitations offered for each manufacturer in order to invite his customers and give them a free access to the conference only on Friday 12th October 2018.

In order to request a private roadmap presentation, please use this form.

 

The SPCD international Symposium is the premier technical conference dedicated to Passive components for space applications. It is an exceptional venue to learn more about the latest advances in this field and meet recognized experts from industry, academia and agencies.

Aim of SPCD 
Aim of the SPCD symposium is to promote the discussion of recent developments and trends and to encourage the exchange of technical expertise and information covering a broad range of EEE passive components for space applications:

  • Capacitors & Supercapacitors
  • Circulators & Isolators
  • Cable assemblies & Harnesses
  • Connectors & Interconnections
  • Crystals & Oscillators
  • Fuses
  • Loads & Attenuators
  • Magnetics
  • Power dividers & Couplers
  • Relays & Switches
  • Resistors
  • RF switches & Phase shifters
  • SAW Devices (SAW Filters, SAW Sensors, etc.)
  • Thermal Sensors & Heaters

Topics

  • Application, Trends and Needs
  • Evaluation & Qualification
  • Lessons Learned and In-flight Experiences
  • Materials and Processes
  • New Developments
  • Normative System & Standards
  • Procurement, Distribution
  • Technology Roadmaps
  • Test, Reliability and Evaluation for space
  • You are most cordially invited to attend this meeting.

 

The SPCD organising committee

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