Hirose Unveils Industry Thinnest Backflip FPC Connector
Hirose Electric Co., Ltd. has introduced the FH80 backflip FPC board to board connector, featuring the industry’s lowest profile height...
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Hirose Electric Co., Ltd. has introduced the FH80 backflip FPC board to board connector, featuring the industry’s lowest profile height...
TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in...
Kyocera introduces SAW filters dedicated for use in implantable pacemakers and automated external defibrillators (AEDs). To contribute to people's daily...
This article provides an overview of impact of shielding materials on shielding effectiveness. The post is based on Würth Elektronik‘s “Reference...
Electronics Supply Chain Weekly Digest 4-11-25. DATAPOINT OF THE WEEK: Passenger car retail sales in China surged to 1.94M in...
This video from Sam Ben Yaakov provides detailed insight into features and operations of coupled inductors and transformers in multiphase...
KOA releases new wide terminal (reverse geometry) flat SMD chip resistors. The terminal temperature specifications enable even higher power ratings...
Paumanok Publications, Inc. has published the market research study entitled “Passive Electronic Components: World Market Outlook: 2025-2030”. This market study...
This article provides an overview of impact of shielding materials on shielding effectiveness. The post is based on Würth Elektronik‘s...
This article based on Knowles Precision Devices blog explains how stacked ceramic capacitor assemblies improve efficiency in power and RF applications. By...
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© EPCI - Leading Passive Components Educational and Information Site