Passive Components Blog
No Result
View All Result
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

    Murata Previews SiC Power and AI Sensors at electronica 2026

    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
  • Home
  • News
    • All
    • Aerospace & Defence
    • Antenna
    • Applications
    • Automotive
    • Capacitors
    • Circuit Protection Devices
    • electro-mechanical news
    • Filters
    • Fuses
    • Inductors
    • Industrial
    • Integrated Passives
    • inter-connect news
    • Market & Supply Chain
    • Market Insights
    • Medical
    • Modelling and Simulation
    • New Materials & Supply
    • New Technologies
    • Non-linear Passives
    • Optoelectronics and Isolation
    • Oscillators
    • Passive Sensors News
    • Resistors
    • RF & Microwave
    • Telecommunication
    • Weekly Digest
    Silicon capacitors and integrated passives dossier cover

    Silicon Capacitors and Integrated Passives Dossier Report 10/26

    Samtec automotive interconnect technologies for software-defined vehicle electronics

    Samtec Links Automotive Connector Demands to Software-Defined Cars

    Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

    Panasonic Targets Space Thermal Design at SPCD 2026

    tungsten-bronze-ceramic-capacitor-stack

    Tungsten bronze capacitors combine high κ and thermal stability

    Bourns MF-ASMF Series surface-mount PPTC resettable fuses in the manufacturer product photograph

    Bourns Announces 0402 PPTC Fuses Target Low-Current Protection

    Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

    Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

    Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

    TDK Expands1608 Inductors for Automotive PoC Filters

    Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

    Murata Previews SiC Power and AI Sensors at electronica 2026

    Ruggedized passive component customization overview covering capacitors, resistors and inductors.

    Ruggedized Passive Components: Reliability Beyond the Datasheet

    Trending Tags

    • Ripple Current
    • RF
    • Leakage Current
    • Tantalum vs Ceramic
    • Snubber
    • Low ESR
    • Feedthrough
    • Derating
    • Dielectric Constant
    • New Products
    • Market Reports
  • Knowledge Blog
  • Dossiers
    • Aerospace and Defense Passive Components Dossier
    • AI Hardware Dossier
    • Automotive Dossier
    • Industrial Robotics Dossier
    • Power Converter Dossier
    • Capacitor Dossier
    • Circuit Protection Dossier
    • Inductor Dossier
    • Resistor Dossier
    • Silicon Capacitors and Integrated Passives Dossier
  • Suppliers
    • Who is Who
  • PCNS
    • PCNS 2025
    • PCNS 2023
    • PCNS 2021
    • PCNS 2019
    • PCNS 2017
  • Events
No Result
View All Result
Passive Components Blog
No Result
View All Result

Samsungs Low ESL MLCCs to Power Next-Generation ADAS SoCs

10.12.2025
Reading Time: 4 mins read
A A

Samsung Electro-Mechanics’s latest Low ESL (Equivalent Series Inductance) MLCCs, provides high-capacitance and low ESL features designed to meet the demanding requirements of Advanced Driver Assistance Systems (ADAS).

As ADAS SoCs (System-on-Chips) evolve with higher performance and increased power consumption, these new capacitors ensure stable operation in high-power and high-frequency environments.

RelatedPosts

Samsung Low-Profile and Embedded MLCCs for Compact Devices

Samsung MLCC Options for 1 MW AI Rack Power

Samsung MLCC Revenue Seen Above KRW 8T by 2027, Murata EOL Actions Reshape Supply

Key Benefits of Low ESL MLCCs

  • High Capacitance: Supports stable SoC operation under heavy loads.
  • Low ESL Characteristics: Effectively suppresses high-frequency noise caused by loop inductance.
  • Space Efficiency: Achieves over 30% board space savings compared to conventional MLCCs.
  • Reduced Component Count: Provides stable power supply with fewer devices, ideal for compact automotive circuits.

Product Lineup

Samsung Electro-Mechanics offers a wide range of MLCCs tailored for ADAS applications:

1 (see Fig above) Low Frequency Decoupling2 (see Fig above) High Frequency Decoupling
NeedsHigh-CapacitanceLow ESL Low Profile (Ultra-thin)
MLCCs0201 inch ~1㎌
0402 inch ~2.2㎌
0603/0805 inch ~22㎌
1206 inch ~47㎌
1210 inch ~220㎌
*0402 inch 10㎌
*0805 inch 47㎌
*1206 inch 100㎌
*Under Development
0402 inch Reversed Type
*0402 inch 4.3㎌ 3-Terminal
*0603 inch 10㎌ 3-Terminal

*Under Development
SamsungCL03Z105MRR6PN#
CL05Y225KP66PN#
CL10Z226MR96PN#
CL21Z226MQYVPN#
CL31Z476MQKVPN#
CL32Z227MSV6PN#
CLL5Z105MS21PN#
CL05Z105MR41PT# (New)
CL10Z105MO66PT# (New)

Second Solution: Low ESL(3T) MLCC

As ADAS SoCs evolve, there is a growing need for MLCCs which offer both high capacitance and low ESL characteristics for stable SoC operations under high power/high frequency circumstances. As the switching frequency of SoCs increases, loop inductance generates high-frequency noise, which is suppressed by MLCCs. ​

Low ESL(3T) MLCCs excel at mitigating high-frequency noise, enabling stable power supply with fewer devices compared to normal MLCCs. This makes them an excellent solution in circuits with limited board space.

In addition to meeting the electrical requirements of this application, Low ESL(3T) MLCCs can achieve space savings of over 30%. ​

Size
(inch/mm)
Related
Voltage
TCCCapacitancePart NumberMP Status
0402/10054.0VdcX7T1.0㎌CL05Z105MR41PT#NEW
0603/160816VdcX7T1.0㎌CL10Z105MO66PT#NEW

Alongside this newly introduced product, Samsung Electro-Mechanics is also developing 3T MLCCs with sizes of 0603 inch or smaller and capacitances of 1µF or higher, and will continue to expand its MLCC line-up to meet market needs.

For more information, visit Samsung Electro-Mechanics Component Center.

Related

Source: Samsung Electro-Mechanics

Recent Posts

Silicon capacitors and integrated passives dossier cover

Silicon Capacitors and Integrated Passives Dossier Report 10/26

8.10.2026
1
Samtec automotive interconnect technologies for software-defined vehicle electronics

Samtec Links Automotive Connector Demands to Software-Defined Cars

8.10.2026
1
Panasonic Industry PGS graphite heat-spreading technology and passive components for spacecraft thermal management

Panasonic Targets Space Thermal Design at SPCD 2026

8.10.2026
8
tungsten-bronze-ceramic-capacitor-stack

Tungsten bronze capacitors combine high κ and thermal stability

7.10.2026
14
Conceptual illustration of Littelfuse AQ4315-01ETG and SP4315-01WTG TVS diode applications on high-speed PCB data lines

Littelfuse Adds Low-Capacitance TVS Diodes for Fast Data Links

7.10.2026
11
Datasheet-style illustration of a TDK MLJ1608-G multilayer chip inductor with end terminals

TDK Expands1608 Inductors for Automotive PoC Filters

6.10.2026
7
Murata electronica 2026 technology preview featuring MGJ2T2 power converters and SCI36LT inertial sensors.

Murata Previews SiC Power and AI Sensors at electronica 2026

6.10.2026
30
Ruggedized passive component customization overview covering capacitors, resistors and inductors.

Ruggedized Passive Components: Reliability Beyond the Datasheet

6.10.2026
21
TDK B3272 series boxed DC-link film capacitors with radial leads for automotive and industrial power-electronics applications

TDK Expanded DC-Link Film Capacitors to Reach +135 °C

2.10.2026
24

Upcoming Events

Oct 9
18:00 - 19:00 CEST

Edgewater Research 3Q26 Electronic Components Review Outlook Webinar

Oct 14
17:00 - 18:00 CEST

Live Demo! Discover KYOCERA AVX Antenna Integrator Studio (AIS)

Oct 19
15:00 - 16:00 CEST

ESCC-qualified Pt Temperature Sensors for Space Applications

View Calendar

Popular Posts

  • Buck Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Boost Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • LLC Resonant Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Flyback Converter Design and Calculation

    0 shares
    Share 0 Tweet 0
  • Capacitor Charging and Discharging

    0 shares
    Share 0 Tweet 0
  • Resistor Symbols

    0 shares
    Share 0 Tweet 0
  • Audio Capacitors: Choosing Capacitors for Crossover Circuits

    0 shares
    Share 0 Tweet 0
  • Thermistors Basics, NTC and PTC Thermistors

    0 shares
    Share 0 Tweet 0
  • MLCC and Ceramic Capacitors

    0 shares
    Share 0 Tweet 0
  • RF Connector Types: How To Choose the Right One

    0 shares
    Share 0 Tweet 0

Newsletter Subscription

 

Passive Components Blog

© 2015–2026
All rights reserved

  • Home
  • Privacy Policy
  • EPCI Membership & Advertisement
  • About

No Result
View All Result
  • Home
  • Knowledge Blog
  • Dossiers
  • PCNS

© 2015–2026
All rights reserved