High-Voltage Protection In DC Fast Charging Mar 11, 2025, 10:30 am EDT Join this TTI Webinar to gain knowledge about high-voltage DC protection, such as contactors, isolation monitoring modules and fast disconnects that can add innovation, expertise and scale to your projects. HVDC systems demand robust protection mechanisms to ensure operational safety and reliability. This […]
500W PSFB Transformer design for achieving ZVS Wed, Mar 12 8:30 PM - 9:00 PM GMT+1 This intermediate-to-advanced session will focus on II part of simulating the converter to achieve Zero Voltage Switching (ZVS) and calculating the right leakage inductance for optimal performance. Speaker: Dr Molina, CEO Frenetic
Enabling RF and mmWave Design Success with Advanced Models Date: Tuesday, March 18, 2025 Time: 06:00 ET / 11:00 GMT / 12:00 CET / 15:00 GST Traditionally, measured S-parameter data files in the RF and mmWave industry have been the most commonly available “model” to represent passive devices as well as active devices in some […]
VIRTUAL: Microelectronic Packaging Failure Modes and Analysis Instructors: Thomas Green and Robert Lowry Description: The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review […]
Würth Elektronik Webinar: New UL listing for RIGID.flex: Maximum performance - highest safety Wed, Mar 19, 2025 11:00 AM - 12:00 PM CET Our RIGID.flex PCBs have long been established in all industries where miniaturization, maximum reliability and extreme requirements are needed - from medical technology and the automotive industry to aerospace. UL-listed for over […]
Validating Efficiency and EMC on WBG devices ROHDE & SCHWARZ WEBINAR joined with Würth Elektronik Wednesday, March 19, 2025 at 14:00 CET Are you developing switched mode power supplies? Do you want to switch from traditional silicon to wideband gap devices made of SiC or GaN and wonder how this will improve your efficiency and […]
Wirebond Materials, Processes, Reliability and Testing Instructor: Lee Levine Description: Wire Bonding is a welding process that is the dominant chip interconnection method. More than 15 trillion wires are bonded annually. In the past, gold wire was the dominant material in use, but in 2015 copper and palladium coated copper wire captured more than 51% of […]
How to Get Started with Your DC/DC Power Supply Design 25th March 2025, 4PM CET Designing a DC-DC Converter can be challenging and complex, with many technical considerations. But, as specialist expertise in power supply design becomes scarcer, engineers look for ways to simplify the process, reduce design iterations, and accelerate time to market. At […]
Accelerate Your Design Flows with Highly Accurate Simulation Models Wed, Mar 26, 2025 3:00 PM - 4:00 PM CET Accurate measurement-based models make it possible to achieve first-pass design success for high-frequency PCB-based designs. The Modelithics COMPLETE Library™ for Keysight Advanced Design System (ADS) and Keysight RF Synthesis (Genesys) consists of an extensive collection of […]
Introduction to coupled inductors and applications st, 9. 4. 2025, 16:00 – 17:00 CET This webinar by organized by Frenetic, honored to have Professor Sam Ben-Yaakov as our guest speaker—one of the most respected voices in power electronics and magnetics education. Starting from the fundamentals of Coupled Inductors (CI), this session will explore a variety […]
Optimizing Performance with Panel Mount EMI Filters: Solutions for Effective EMI Control Webinar by Knowles Precision Devices April 10, 2025 Time: 11 AM EDT (8 AM PDT / 5:00 PM CEST) Overview Within electronic design, selecting the right type of filter is just as important as the components on the PCB itself. EMI panel mount […]
External Visual Inspection per MIL-STD-883 TM 2009 Instructor: Thomas Green Description: This course covers the visual inspection criteria for hermetic packaged microelectronic devices and similar devices and a review of typical plastic package defects in accordance with best commercial practices. Color photographs of actual production defects are reviewed and discussed in detail. The students are […]
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